Lead-free solder scaling powder and preparation method thereof

A lead-free solder and flux technology, applied in the direction of welding equipment, welding/cutting media/materials, welding media, etc., can solve the problems of flux performance failure, surfactant volatilization, failure to activate and protect, etc., to achieve Improves the effect of wide application and excellent wettability

Inactive Publication Date: 2015-10-21
WUHU ADER CONVEYOR MACHINERY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the process of research and use, it is found that compared with traditional Sn-Pb solder, Sn-Ag-Cu lead-free solder has poor wettability, easy oxidation, and high melting point.
The increase of the melting point means that the soldering temperature must be increased. On the one hand, it is easy to cause damage to the board surface components, and on the other hand, it will cause the volatilization of the surfactant in the flux, causing the flux to fail, and cannot achieve good activation and protection.

Method used

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Examples

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Effect test

preparation example Construction

[0020] In the preparation method of the present invention, the specific type of organic acid can be selected in a wide range, but in order to make the prepared lead-free solder flux have more excellent wetting ability, preferably, the organic acid is selected from benzoic acid, octanoic acid , one or more of phthalic acid, malic acid, succinic acid, citric acid, adipic acid and sebacic acid.

[0021] In the preparation method of the present invention, the specific type of silane can be selected in a wide range, but in order to make the prepared lead-free solder flux have more excellent wetting ability, preferably, the silane is monosilane, disilane and acrylic acid. One or more of silanes.

[0022] In the preparation method of the present invention, the specific type of fatty acid can be selected in a wide range, but in order to make the prepared lead-free solder flux have more excellent wetting ability, preferably, the fatty acid is linseed oil, arachidic acid, laurel one or...

Embodiment 1

[0029] At 25°C, benzoic acid, octylphenol polyoxyethylene ether, silane, linseed oil, lithium bistrimethylsilylamide, trimethylboron, carbon disulfide and rosin (weight ratio 10:17:10 :7:1:2:4:4:10) mixed for 50 minutes to prepare lead-free solder flux A1.

Embodiment 2

[0031] At 15°C, phthalic acid, nonylphenol polyoxyethylene ether, disilane, arachidic acid, lithium hexamethyldisilazide, triethylboron, carbon disulfide and rosin (weight ratio 10:15 :7:5:0.5:1:2:3:10) mixed for 30 minutes to prepare lead-free solder flux A2.

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PUM

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Abstract

The invention discloses lead-free solder scaling powder and a preparation method thereof. The lead-free solder scaling powder comprises organic acid, nonionic surface active agents, silane, fatty acid, lithium amide, trialkyborane, carbon disulfide and rosin. The lead-free solder scaling powder can improve the wettability of Sn-Ag-Cu series lead-free solder and is environmentally friendly. In addition, the preparation method of the lead-free solder scaling powder is simple in step, and raw materials are easy to obtain.

Description

technical field [0001] The invention relates to flux, in particular to a lead-free solder flux and a preparation method thereof. Background technique [0002] Welding technology is widely used in industry, especially in the manufacturing process of electronic products, almost all kinds of welding methods are used, the commonly used welding is mostly soldering, and in soldering, the most commonly used and most effective The representative one is soldering. Soldering is to heat the electronic weldment and the solder with a lower melting point than the weldment to the soldering temperature. When the weldment does not melt, the solder melts and infiltrates the soldering surface through the action of the flux, relying on the metal atoms between the two The diffusion between them forms a new alloy composition and completes the connection of the weldment. During the whole welding process, the active substance in the flux plays a vital role in the welding. The active substance in ...

Claims

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Application Information

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IPC IPC(8): B23K35/363B23K35/40
CPCB23K35/3612B23K35/362B23K35/40
Inventor 周勇贾真李开领
Owner WUHU ADER CONVEYOR MACHINERY
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