Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Electromagnetic shielding heat-dissipation film and manufacturing method thereof

An electromagnetic shielding and heat-dissipating film technology, applied in the fields of magnetic field/electric field shielding, cooling/ventilation/heating transformation, electrical components, etc. Effect of heat dissipation and electromagnetic shielding effect

Active Publication Date: 2015-10-14
SUZHOU RIDEA MATERIAL TECH
View PDF6 Cites 35 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But because of its small specific gravity (3 ), causing its heat capacity and heat flux to be limited, and it cannot conduct heat out in time

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electromagnetic shielding heat-dissipation film and manufacturing method thereof
  • Electromagnetic shielding heat-dissipation film and manufacturing method thereof
  • Electromagnetic shielding heat-dissipation film and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] Example 1: as figure 1 As shown, the electromagnetic shielding heat dissipation film includes a heat dissipation film layer 11, a shielding film layer 12 and a wave-absorbing film layer 13, wherein the heat dissipation film layer 11 is a 25um graphite film with a thermal conductivity of 1600 W / m·k, and the shielding film layer 12 is a copper foil with a thickness of 20um, and the wave-absorbing film 13 is a film containing 80% by weight iron-nickel alloy powder and 20% by weight epoxy resin adhesive, with a thickness of 50mm and a magnetic permeability of 120 at 1MHz. .

Embodiment 2

[0038] Example 2: as figure 1 As shown, the heat dissipation film layer 11 in the electromagnetic shielding heat dissipation film is a 10um graphite film, and its thermal conductivity is 1900 W / m·k. The shielding film layer 12 is an aluminum foil with a thickness of 40um. The thin film of iron-nickel alloy powder and 30% by weight epoxy resin adhesive has a thickness of 30mm and a magnetic permeability of 90 at 1MHz.

Embodiment 3

[0039] Example 3: as figure 2 As shown, the electromagnetic shielding heat dissipation film includes a heat dissipation film layer 11, a shielding film layer 12 and a wave-absorbing film layer 13, wherein the heat dissipation film layer 11 is a 25um graphite film with a thermal conductivity of 1600 W / m·k, and the shielding film layer 12 is a copper foil with a thickness of 20um, and the wave-absorbing film 13 is a film containing 80% by weight iron-nickel alloy powder and 20% by weight epoxy resin adhesive, with a thickness of 50mm and a magnetic permeability of 120 at 1MHz. . A 25um PET protective film 14 (polyethylene terephthalate) is attached to the wave-absorbing film 13, a 10um acrylic adhesive double-sided adhesive 15 is attached to the surface of the graphite film 11 and PET coated with silicone oil on the contact surface. The release film layer 16 has a thickness of 50um.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention provides an electromagnetic shielding heat-dissipation film and a manufacturing method thereof. The electromagnetic shielding heat-dissipation film comprises a heat-dissipation film layer, a shielding film layer and a wave-absorbing film layer, wherein the heat-dissipation film layer is a synthetic graphite film, the shielding film layer is a metal film, and the wave-absorbing film layer is an organic binder film mixed with soft magnetic material powders. The method for manufacturing the electromagnetic shielding heat-dissipation film comprises the following steps: 1) attaching a heat-dissipation film to a smooth high-temperature-resistant film layer to form the heat-dissipation film layer; 2) depositing the metal film onto the surface of heat-dissipation film through a gas phase method or a liquid phase method or the combination of the two to form the shielding film layer; 3) coating organic binder mixed with the soft magnetic material powders onto the surface, wherein the metal film heat-dissipation film are deposited, and carrying out solidification under the function of high temperature or a catalyst; and 4) stripping the high-temperature-resistant film layer on the surface of the heat-dissipation film to obtain the electromagnetic shielding heat-dissipation film.

Description

technical field [0001] The invention relates to an electromagnetic shielding heat dissipation film and a manufacturing method thereof. The electromagnetic shielding heat dissipation film has the functions of electromagnetic shielding and heat dissipation, and is used for electromagnetic shielding and suppression of electromagnetic noise in the motor and electronic industries. Background technique [0002] With the rapid development of electronic technology, the increasing popularity of electronic products with various personalized entertainment functions has also made electronic products rapidly develop in the direction of intelligence, integration, thinness, and multi-function. [0003] However, due to the increase in the speed and frequency of data transmission and the integration of circuit boards, there is an increasing requirement to improve the environment of electromagnetic interference to reduce the interference of adjacent components. In addition, when the smart d...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00H05K7/20
Inventor 周作成刘付胜聪
Owner SUZHOU RIDEA MATERIAL TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products