Flat heat pipe liquid suction core provided with fins and embedded grooves and manufacturing method thereof

Abstract

The invention discloses a flat heat pipe liquid suction core provided with fins and embedded grooves and a manufacturing method thereof. The flat heat pipe liquid suction core comprises a metal evaporation plate, wherein multiple first embedded grooves and multiple second embedded grooves which are arranged at intervals and distributed in a staggered mode in the first direction and the second direction and multiple fins distributed in an array mode are arranged on the evaporation face of the metal evaporation plate, and each first embedded groove and each second embedded groove respectively comprises a groove body forming a groove cavity and a vertical gap forming a groove opening. Each fin comprises a fin body and a supporting boss and is formed by the gaps and internal groove bodies of the corresponding first embedded groove and the corresponding second embedded groove in a staggered mode. The liquid suction core can increase heat exchange area, promote boiling for nucleus formation, enhance boiling heat transfer, improve capillary pressure and reduce backflow resistance. During manufacture, a ball-end milling cutter is utilized to mill the embedded grooves in the first direction, and a base plate is turned to mill the embedded grooves in the second direction and meanwhile form a fin structure. The flat heat pipe liquid suction core is simple in manufacturing process and low in machining cost and can remarkably strengthen heat transfer.

Description

technical field [0001] The invention relates to a flat heat pipe liquid-absorbing core, in particular to a flat heat pipe liquid-absorbing core with a fin-embedded groove and a manufacturing method thereof. Background technique [0002] As the power of electronic chips continues to increase and the physical size continues to decrease, the heat flux on the electronic chip continues to increase. The problem of thermal failure of electronic chips due to excessive temperature is becoming more and more serious. The heat dissipation problem of high heat flux components It has become one of the key technical issues affecting the design of electronic devices. [0003] At present, many heat dissipation devices are far from meeting the heat dissipation requirements of some electronic devices, and traditional heat dissipation methods such as air cooling have reached a technical bottleneck. The flat heat pipe utilizes the principle of phase change heat transfer. Because it adopts the s...

AI Technical Summary

Problems solved by technology

However, the capillary radius of these structures is small, the flow resistance is large, the permeability is low, and it is easy to block, and the above manufacturing methods have the disadvantages of uncontrollable groove-pore structure shape, long processing time, and high manufacturing cost.

The grooved liquid-absorbing core usually adopts special processing methods such as wire cutting and laser processing, which can only process a simple open structure with smooth walls, and has defects such as low capillary suction, poor boiling heat transfer performance, long processing cycle, and high cost.

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