Sn-Ag-Cu-based solder powder, and solder paste using said powder

A solder powder and solder technology, applied in the field of SnAgCu solder powder, can solve the problems of powder surface oxidation, poor wettability, time-consuming, etc., and achieve rapid melting, good wettability, excellent melting and wettability effects

Inactive Publication Date: 2015-07-08
MITSUBISHI MATERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the yield becomes very poor
On the other hand, if the powder is about 7 μm, even by this method, the yield becomes good, but the powder with this particle size cannot sufficiently cope with the finer pitch in recent years.
[0010] In addition, in the solder powder disclosed in Patent Document 3, since the particle size is as small as 5 μm or less, and the outermost layer is composed of easily oxidizable tin, oxidation of the powder surface is likely to occur.
If it is oxidized, it will take time to melt when forming solder bumps, and there will be a problem of poor wettability

Method used

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  • Sn-Ag-Cu-based solder powder, and solder paste using said powder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] First, add 1.59×10 to 50mL of water -4 mol of copper(II) sulfate, 4.10×10 -4 mol of silver (I) sulfate, 2.62×10 -2 mol of tin(II) sulfide was stirred with a stirrer at 300 rpm for 5 minutes to prepare a solution. After adjusting the pH of the solution to 0.5 with sulfuric acid, 0.5 g of polyvinyl alcohol 500 (polyvinyl alcohol having an average molecular weight of 500) was added as a dispersant, and stirred at 300 rpm for 10 minutes.

[0049] Next, 50 mL of a 1.58 mol / L divalent chromium ion aqueous solution adjusted to a pH of 0.5 was added to the solution at an addition rate of 50 mL / sec, and stirred at a rotation speed of 500 rpm for 10 minutes to reduce each metal ion to obtain a solution dispersed in the solution. Dispersions of metal powders. After the dispersion was allowed to stand for 60 minutes to precipitate the produced metal powder, the supernatant was removed, and the operation of adding 100 mL of water and stirring at 300 rpm for 10 minutes was repeate...

Embodiment 2

[0053] A solder powder was obtained in the same manner as in Example 1 except that 0.80 mg of salicylic acid was used as an additive. On the surface of the solder powder, 0.02 parts by mass of salicylic acid was adhered to 100 parts by mass of the total components of tin, silver, and copper contained in the solder powder.

Embodiment 3

[0055] A solder powder was obtained in the same manner as in Example 1 except that 40 mg of salicylic acid was used as an additive. On the surface of the solder powder, 0.99 parts by mass of salicylic acid was adhered to 100 parts by mass of the total components of tin, silver, and copper contained in the solder powder.

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Abstract

An Sn-Ag-Cu-based solder powder is obtained by depositing, as an additive agent, on surfaces of a solder powder having an average particle size of not more than 5 µm, a dry substance of a solution of hydroxybenzoic acid having a melting point of not more than 250 ˚C or an ester thereof. It is preferable that the additive agent be salicylic acid, 3,4 dihydroxybenzoic acid ether, or 3,5 dihydroxybenzoic ether. It is preferable that: the deposited amount of the additive agent be 0.01-1.0 parts by mass per 100 parts by mass of the total amount of tin, silver, and copper components included in the solder powder; the content ratio of silver be 0.1-10 mass% when the total amount of tin, silver, and copper components is 100 mass%; the content ratio of copper be 0.1-2.0 mass% when the total amount of tin, silver, and copper components is 100 mass%; and the remainder comprise tin.

Description

technical field [0001] The present invention relates to a lead-free solder powder for fine pitch and a paste for solder using the powder. More specifically, it relates to a fine SnAgCu-based solder powder having an average particle diameter of 5 μm or less, and a solder paste using the powder. In addition, this international application claims priority based on Japanese Patent Application No. 012970 (Japanese Patent Application No. 2013-012970) filed on January 28, 2013, and uses all the contents of Japanese Patent Application No. 2013-012970 in this international application. Background technique [0002] From environmental considerations, lead-free solder is being promoted for joining electronic components, and currently solder powder mainly composed of tin is used. As a method of obtaining fine metal powder such as solder powder, in addition to spraying methods such as gas spraying method and rotating disk method, melt spinning method, rotating electrode method, mechanic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/14B22F1/02B23K35/22B23K35/26C22C13/00H05K3/34B22F1/05B22F1/107
CPCB22F1/0074B23K35/26B22F1/0011H05K2203/0425C22C1/0483B23K35/22H05K3/3463C22C13/00B22F1/05B22F1/107B23K35/3612B23K35/362B23K35/262B23K35/0244B23K35/025B23K35/3618
Inventor 岩田广太郎村冈弘树久芳完治
Owner MITSUBISHI MATERIALS CORP
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