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Etching method

A technology of etching and resist film, which is applied in the direction of photolithography mask, pattern and photolithography, resist parts, etc., can solve the problem of poor yield and achieve the effect of improving yield

Active Publication Date: 2017-02-15
MIMAKI ENG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

That is, the existing etching method has the problem of poor yield

Method used

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Experimental program
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Embodiment Construction

[0024] Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

[0025] First, the structure of the processed product manufactured by the etching method of this embodiment is demonstrated.

[0026] figure 1 It is a side sectional view of the processed product 10 manufactured by the etching method of this embodiment.

[0027] Such as figure 1 As shown, the processed product 10 is an article produced by denting the surface 11 a of the object 11 . For example, the processed product 10 is a printed wiring board in which a conductor layer 11c which is a conductor layer such as copper is coated on an insulator base material 11b.

[0028] Next, the configuration of the inkjet printer used to manufacture the processed product 10 will be described.

[0029] figure 2 It is a perspective view of the inkjet printer 20 for manufacturing the processed product 10 .

[0030] Such as figure 2 As shown, the inkjet printer 20 includes a p...

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PUM

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Abstract

A solution is characteristic in being an etching method that processes a surface of a target object by corroding the surface by a corrosive, and the etching method includes: a resist forming step of forming a resist on the surface using resist liquid by ink jet printing the resist liquid on the surface; a surface corroding step of corroding a portion of the surface where the resist is not formed by bringing the corrosive into contact with a surface side of the target object where the resist has been formed in the resist forming step; and a resist detaching step of detaching the resist from the surface after the surface corroding step, wherein the resist forming step is a step of forming the resist by the resist liquid containing monofunctional monomers or monofunctional oligomers, and polyfunctional monomers or polyfunctional oligomers.

Description

technical field [0001] The present invention relates to an etching method for processing the surface of an object by etching the surface of the object with an etchant. Background technique [0002] Conventionally, as an etching method for processing the surface of an object by corroding the surface of the object with an etchant, a method including the following steps is known: a step of forming a resist film: inkjet printing of an oil-based resin solution, ultraviolet rays, etc. on the surface of an object; Resist liquid such as solidified resin liquid, forms resist film with resist liquid on the surface of object; Partial etching in which the resist film is not formed on the surface of the object; and resist film stripping step: peeling the resist film from the surface of the object after the surface etching step (see Patent Document 1). [0003] prior art literature [0004] patent documents [0005] Patent Document 1: Japanese Patent Application Laid-Open No. 6-228774 ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23F1/00B05D3/10H01L21/027H05K3/06
CPCH05K3/064G03F7/0002H05K3/0076H05K2203/013H05K2203/0551H05K2203/0562
Inventor 中村纪和
Owner MIMAKI ENG
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