Low-temperature polymer conductive paste and preparation method thereof

Abstract

The invention provides low-temperature polymer conductive paste and a preparation method thereof. The low-temperature polymer conductive paste comprises conductive filler and carrier adhesives for carrying the conductive filler, wherein the carrier adhesives comprise functional resin including phenoxy resin and fluorine resin. The low-temperature polymer conductive paste has the advantages that a mixed resin system is adopted, wherein the phenoxy resin has excellent carrying capacity for the conductive filler and is good in adhesion force, and the fluorine resin is excellent in conductive filler dispersing performance, has low surface energy and is good in base material wetting performance and high in flexibility, therefore, high filling for conductive powder can be achieved, wetting and dispersing the conductive powder are also benefited, and further, achievement of high conductivity, low wire resistance, low contact resistance, good adhesion force and high weatherability after the paste is cured are facilitated.

Description

technical field [0001] The invention relates to a low-temperature polymer conductive paste and its preparation method. More specifically, the conductive paste involved in the present invention is mainly used in high-performance heterojunction, dye sensitization, amorphous silicon thin film, cadmium telluride, etc. The front conductive electrodes of thin-film solar cells can also be applied to substrates of transparent conductive films such as thin films and substrates used in touch screens and electroluminescence (EL) elements, and conductive electrodes are formed by coating or printing on the substrates , Line pattern. Background technique [0002] During the manufacture of solar cells, the conductive filler is usually mechanically mixed with the carrier binder to form a composition with suitable viscosity and rheology for printing, called "conductive paste". [0003] The conductive paste for thin-film photovoltaic cells is usually used to print grid lines on transparent c...

AI Technical Summary

Problems solved by technology

Since there is no high-temperature sintering process, the resistivity of the electrode after printing and curing, the contact resistance of the conductive film, and the adhesion will be affected

[0005] Traditional low-temperature polymer conductive pastes generally use thermoplastic resins with good silver powder carrying capacity, such as saturated acrylate, high molecular weight epoxy resin, polyurethane, polyimide, phenolic resin, saturated polyester, polyvinyl acetate, polyacetic acid Vinyl alcohol, cellulose and other resins are used as functional resins in the carrier adhesive. After dissolving, the silver powder is dispersed and wrapped, and the corresponding patterns are formed after dissolving and volatilizing. However, the adhesion between these resins and the substrate is relatively poor.

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