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Epoxy molding compound and preparation method thereof

An epoxy molding compound and epoxy technology, applied in the field of integrated circuit packaging, can solve the problems of unsatisfactory thermal properties, mechanical properties and electrical properties of epoxy molding compounds

Active Publication Date: 2015-06-03
GUANGDONG DANBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, the thermal, mechanical and electrical properties of current epoxy molding compounds are not ideal.

Method used

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  • Epoxy molding compound and preparation method thereof
  • Epoxy molding compound and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] The purpose of this embodiment is to study the influence of the amount of fused silica powder on the thermal, mechanical and electrical properties of EMC. That is, use 5% (mass percentage) coupling agent solution to carry out coupling modification on the molten silicon powder (the average particle size obtained after ball milling for 24 hours is 2 μm) of ball milling 24h (2μm), and the test is different. The linear expansion coefficient, thermal conductivity, bending strength, elastic modulus, dielectric constant and dielectric loss of the EMC with the amount of silica powder.

[0039]

[0040] Electronic analytical balance; JJ-3 constant temperature electric stirrer; DK-8B type electric heating constant temperature water tank; KQ5200DE type numerical control ultrasonic cleaner; NP-C-20-1500 in-line ultrasonic disperser; DZF-6020 vacuum drying oven.

[0041] Experimental steps:

[0042] 1. Weigh a certain amount of silica powder, put it in a drying oven at 110°C, an...

Embodiment 2

[0058] The purpose of this example is to study the influence of particle size of fused silica powder on the thermal and mechanical properties of EMC. That is, use 5% coupling agent solution to couple and modify the molten silicon micropowder milled for 16h, 24h, 30h, 38h, and 48h, and test the linear expansion coefficient, bending strength, and elastic modulus of EMC with an addition of 50%. quantity.

[0059] Experimental materials and steps:

[0060] Except that the addition amount of molten silicon micropowder is fixed at 50%, the others are the same as in Embodiment 1.

[0061] Experimental Results and Discussion:

[0062] Table 2 The effect of particle size of molten silicon micropowder on the thermal and mechanical properties of EMC

[0063] Silica powder particle size (μm)

Coefficient of linear expansion (×10 -6 / K)

Bending strength (MPa)

Elastic modulus (GPa)

[0064] no filler

71.4

37.6

1.86

Ball milling 16...

Embodiment 3

[0069] The purpose of this embodiment is to study the influence of different types of silica powder on the EMC linear expansion coefficient. That is, use 5% coupling agent solution to carry out coupling modification on silicon powder made from kaolin tailings, high-purity crystalline silicon powder, molten silicon powder, and silicon powder after secondary firing, and the test dosage is 60% When EMC linear expansion coefficient and thermal conductivity.

[0070] Experimental materials and procedures

[0071] Except that the added amount of various types of silicon micropowder is fixed at 60%, the others are the same as in the first embodiment.

[0072] Experimental Results and Discussion

[0073] Table 3 Effects of different silicon micropowders on EMC linear expansion coefficient and thermal conductivity

[0074] Types of Silica Powder

Coefficient of linear expansion (×10 -6 / K)

Thermal conductivity (W / m.K)

Silica powder made from kaolin tailings ...

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Abstract

The invention discloses an epoxy molding compound and a preparation method thereof. The epoxy molding compound comprises the following components: epoxy resin, a coupling agent, a curing agent, a curing accelerator and filler, wherein the epoxy resin is o-cresol formaldehyde epoxy resin (ECN); a diluent is an epoxyactive diluent; the coupling agent is a silane coupling reagent; the curing agent is a latent curing agent; the curing accelerator is a latent curing accelerator; and the filler is silica powder. The thermal property, the mechanical property, the electric property and the like of the epoxy molding compound reach a balanced and relatively good level and can meet the requirements of the modern microelectronics packaging technology.

Description

【Technical field】 [0001] The invention relates to the field of integrated circuit packaging, in particular to an epoxy molding compound and a preparation method thereof. 【Background technique】 [0002] In the 1950s, with the rapid development of semiconductor devices and integrated circuits, packaging such as ceramics, metals, and glass was difficult to meet the requirements of industrialization, and the cost was high. People wanted to use plastics to replace the above packages. The United States first started research in this area, and then spread to Japan. By 1962, plastic packaged transistors had begun to take shape in the industry. Companies such as Japan and the United States continue to select raw materials and production processes, and finally determine the epoxy molding compound processed with o-cresol epoxy resin as the main material. At present, the main manufacturers of epoxy molding compound in the world include Nitto Denko, Sumitomo Bakelite (including Singapor...

Claims

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Application Information

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IPC IPC(8): C08L63/04C08K9/06C08K3/36
Inventor 张双庆刘萍
Owner GUANGDONG DANBOND TECH
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