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Photocatalytic auxiliary cutter sharpening method and device for diamond cutter

A diamond tool, photocatalytic technology, applied in the direction of manufacturing tools, other manufacturing equipment/tools, polishing compositions containing abrasives, etc., can solve the problems of low production cost, high surface roughness, long sharpening time, etc. The effect of good sharpening quality, high polishing efficiency and simple structure

Active Publication Date: 2015-06-03
SHENYANG POLYTECHNIC UNIV
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Problems solved by technology

[0005] The purpose of the present invention is to provide an ultra-smooth, low-damage, high-efficiency diamond grinding tool for technical problems such as nano-level blunt circle radius, high surface roughness, large sub-surface damage, and long grinding time when the existing diamond is sharpened. The diamond tool sharpening method and a photocatalytic sharpening device with simple mechanism, good sharpening quality, high sharpening efficiency, low production cost and no pollution

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Embodiment Construction

[0020] The polishing principle of the present invention is: when the nano-titanium dioxide is irradiated by ultraviolet light with a wavelength less than 387.5nm, the electrons in the valence band will be excited to the conduction band, and electrons and holes will be generated on the surface of the titanium dioxide particles. Electrons can be captured by electron capture agents such as potassium ferrate or hydrogen peroxide to avoid recombination with holes and reduce chemical interactions. The standard oxidation-reduction potential of the hole is 3.2V, which has a strong oxidizing property and can convert the OH adsorbed on the surface of titanium dioxide particles to - and H 2 O is oxidized to generate strong oxidizing hydroxyl radical·OH (the standard redox potential is 2.76V). Diamond can be oxidized when hydroxyl radicals come into contact with diamond. When polishing, the diamond tool is installed on the fixture, and the diamond tool is driven by a motor to rotate t...

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Abstract

The invention belongs to the field of ultra-precision cutting machining and discloses a photocatalytic auxiliary cutter sharpening method and a photocatalytic auxiliary cutter sharpening device for a diamond cutter. The photocatalytic auxiliary cutter sharpening method and the photocatalytic auxiliary cutter sharpening device for the diamond cutter are characterized in that nano titanium dioxide is used as a main component and right amounts of electron capturer and abrasive particles are added to prepare polishing solution. When ultraviolet rays irradiate the polishing solution on the surface of a polishing disk, hydroxyl free radicals with strong oxidizability are generated on the surfaces of titanium dioxide particles in the polishing solution and under the synergistic action of mechanical friction of the polishing disk, trace removal of materials on the surface of diamond is implemented. by changing an input voltage of an ultraviolet ray generator, the chemical oxidation effect of the polishing solution is regulated. The photocatalytic auxiliary cutter sharpening method and the photocatalytic auxiliary cutter sharpening device for the diamond cutter have the effects and benefits that a rounded edge radius of below 100 nanometers, nanometer and sub-nanometer scale surface roughness and ultralow damage surface quality of a cutter can be realized; the photocatalytic auxiliary cutter sharpening method and the photocatalytic auxiliary cutter sharpening device are helpful for improving the service life of the cutter and workpiece machining quality. Moreover, titanium dioxide and potassium ferrate are used as the main components of the polishing solution, and thus, human bodies and the environment cannot be damaged and the environment pollution can be improved to a certain degree.

Description

technical field [0001] The invention belongs to the field of ultra-precision cutting processing. In particular, it relates to a photocatalytic auxiliary sharpening method and device for diamond tools. Background technique [0002] With the application and promotion of ultra-precision machining technology, the machining accuracy of ultra-precision machining is gradually developing towards the nanometer scale and its ultimate precision. In ultra-precision cutting, in order to obtain the processing accuracy of nanometer and sub-nanometer features, in addition to ultra-precision machine tools, high-resolution testing instruments and ultra-stable processing environments, high-precision, low-damage diamond tools are A must-have, especially for arc-edged diamond tools. For example, in the ultra-precision machining of optical mirrors and optical molds, not only the radius of the blunt circle of the cutting edge of the diamond tool is required to be less than 100nm, but also the ac...

Claims

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Application Information

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IPC IPC(8): B24B3/00G09G1/02
CPCB24B3/00C09G1/02
Inventor 苑泽伟温泉于慎波杨赫然
Owner SHENYANG POLYTECHNIC UNIV
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