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Heterogeneous fixed abrasive wire saw for multi-line cutting

A fixed abrasive, multi-wire cutting technology, applied in fine working devices, stone processing equipment, manufacturing tools, etc., can solve the problems of the failure of the abrasive consolidation layer, the easy removal of saw wire abrasive particles, etc. The effect of cracking, reducing the breakage rate and alleviating stress concentration

Active Publication Date: 2015-05-27
FUNDANT JIANGSU ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The technical problem to be solved by the present invention is to overcome or alleviate the failure of the abrasive consolidation layer caused by the stress generated by the bending of the saw wire in the existing consolidated abrasive technology, which in turn causes the abrasive particles on the saw wire to be easily pulled out and fall off, resulting in user-side problems. Applied Risk Questions

Method used

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  • Heterogeneous fixed abrasive wire saw for multi-line cutting
  • Heterogeneous fixed abrasive wire saw for multi-line cutting
  • Heterogeneous fixed abrasive wire saw for multi-line cutting

Examples

Experimental program
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Effect test

Embodiment 1

[0031] Such as figure 1 , figure 2As shown, a heterogeneous consolidated abrasive sawing wire for multi-wire cutting designed for a 350mm diameter guide wheel. The surface of the bus bar 1 is regularly and intermittently covered with an abrasive consolidation layer 2 for fixing the cutting abrasive 2-1. The shape of the abrasive consolidation layer 2 is approximately annular around the axis of the saw wire. The abrasive consolidation layer 2 For metal plating and alloy layers. The busbar 1 is a brass-plated wire with a diameter of 105 μm, and the cutting abrasive 2-1 uses diamond sand with an average particle size of 12 μm.

[0032] The part that does not cover the abrasive consolidation layer 2 is the stress relief gap 3, and the stress relief gap 3 is only composed of the busbar 1; the length L1 of each stress relief gap 3 is equal to 2mm; each abrasive consolidation layer 2 The length L2 is equal to 20mm. The length L1 of the stress relief gap 3 and the length L2 of th...

Embodiment 2

[0046] Such as Figure 4 As shown, this embodiment is basically the same as Embodiment 1, except that it is designed for a guide wheel with a diameter of 100 mm. The stress release gap 3 is composed of the busbar 1 and the electroplating layer 3-1 on the surface of the busbar 1. The electroplating layer is a Young's modulus much smaller than that of the abrasive consolidation layer 2. The length L1 of each stress relief gap 3 is equal to 0.7 mm; the length L2 of each abrasive consolidation layer 2 is equal to 22 mm.

[0047] The preparation method of this example is based on the method of Example 1, adding a step of electroplating the additional electroplating layer 3-1 after step (c).

Embodiment 3

[0049] Such as Figure 5 As shown, this embodiment is basically the same as Embodiment 1, the difference lies in that the shape of the abrasive consolidation layer 2 is a spiral around the axis of the saw wire. The length L1 of each stress relief gap is equal to 1.5 mm; the length L2 of each abrasive consolidation layer is equal to 35 mm. Both the length L1 of the stress release gap and the length L2 of the abrasive consolidation layer are along the axis of the generatrix.

[0050] Correspondingly, in the heterogeneous consolidated abrasive saw wire manufacturing equipment, the busbar pretreatment device sprays a spiral insulating tape 5 on the surface of the busbar 1 passing through it, such as Figure 8 As shown, the nozzle 4 can rotate around the busbar 1 in a circumferential direction, and the busbar 1 passes through at a constant speed to form a spiral insulating belt 5 on the surface.

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Abstract

The invention relates to a heterogeneous fixed abrasive wire saw which is applicable to machining hard materials such as crystal silicon, silicon carbide, crystal and sapphire by a multi-line cutting method. According to the wire saw, a metal wire with a circular or similarly circular section is used as a generating line, a stress release clearance is reasonably reserved between abrasive cutting fixed layers, and stress concentration of the abrasive cutting fixed layers in the cutting process is reduced. By relieving stress concentration in the abrasive cutting fixed layers, the risk of cracking of the abrasive cutting fixed layers and adjoint abrasive cutting particle detachment in existing wire saw technology is remarkably reduced, and the breakage rate of the fixed abrasive wire saw can be reduced.

Description

technical field [0001] The invention relates to a heterogeneous solidified abrasive saw wire for multi-wire cutting, which is suitable for processing crystal silicon, silicon carbide, crystal, sapphire and other hard materials by multi-wire cutting. Heterogeneous sawing wire with varying bonded abrasive segments and gap segments. Background technique [0002] There are two main processing routes when using multi-wire cutting machines to process thin slices of crystalline silicon, sapphire, silicon carbide, and other high-hardness solids. One is to use a smooth saw wire and free abrasive dispersed in a liquid; the other is to use a consolidated saw wire that fixes abrasive particles on the saw wire. The most representative of the consolidated saw wire is the diamond saw. Wire. Compared with the process route using free abrasives, the consolidated sawing wire has greater advantages in terms of cutting cost and environmental protection. [0003] In the currently used fixed a...

Claims

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Application Information

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IPC IPC(8): B28D5/04
CPCB28D5/04
Inventor 钱海鹏
Owner FUNDANT JIANGSU ADVANCED MATERIALS CO LTD
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