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Silicon slice cutting fluid and preparation method thereof

A silicon wafer cutting fluid and anti-oxidant technology, applied in the petroleum industry, additives, lubricating compositions, etc., can solve the problem of poor dispersion and redispersion of silicon carbide powder, deposition and agglomeration of silicon carbide powder, inability to disperse silicon carbide powder, etc. Problems, achieve the effect of improving cutting yield, easy operation, ensuring stability and durability

Inactive Publication Date: 2015-04-08
LESHAN TOPRAYCELL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing silicon wafer cutting fluid mainly uses polyethylene glycol, which has high cost and poor ability to disperse and redisperse silicon carbide powder. Even if it is stirred again, the silicon carbide powder cannot be dispersed in the cutting fluid again.

Method used

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  • Silicon slice cutting fluid and preparation method thereof
  • Silicon slice cutting fluid and preparation method thereof
  • Silicon slice cutting fluid and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] In the silicon wafer cutting fluid in this example, the defoamer is polyether, the dispersant is sodium polyacrylate, and the antioxidant is antioxidant 264. The components are shown in Table 1:

[0024] The component table of table 1 embodiment 1

[0025]

[0026] Among them, diethylene glycol, polyethylene glycol and glycerin are used as lubricants, and fatty alcohol polyoxyethylene ethers are used as emulsifiers.

[0027] Its preparation method is as figure 1 As shown, the above three lubricants are mixed according to the above mass percentages, and stirred at room temperature to form a uniform mixed solution 1; the antioxidant, emulsifier and deionized water are mixed according to the above mass percentages and stirred evenly , added to the mixed solution 1 to form a basic cutting fluid; the dispersant and defoamer were added to the basic cutting fluid according to the mass percentage, and fully stirred to form a uniform silicon wafer cutting fluid.

Embodiment 2

[0029] In the silicon chip cutting fluid in this example, its defoamer is polyether, its dispersant is sodium polyacrylate, its antioxidant is antioxidant 264, and its components are as follows:

[0030] The component table of table 2 embodiment 2

[0031]

[0032]

[0033] Its preparation method is to mix diethylene glycol, polyethylene glycol and glycerin according to the mass percentage, and stir at room temperature to form a uniform mixed solution 1; mix antioxidant 264, fatty alcohol polyoxyethylene ether and deionized water are mixed according to the above mass percentage and stirred evenly, then added to the mixed solution 1 to form a basic cutting fluid; sodium polyacrylate and polyether are added to the basic cutting fluid according to the above mass percentage, and fully stirred to form Uniform wafer cutting fluid.

Embodiment 3

[0035] Silicon chip cutting fluid in this example, its antifoaming agent adopts polyether, dispersant adopts sodium polyacrylate, antioxidant adopts antioxidant 264, and lubricant includes diethylene glycol, polyethylene glycol and glycerol, the composition The points are shown in Table 3:

[0036] The component table of table 3 embodiment 3

[0037]

[0038] Its preparation method is to mix the lubricant according to the mass percentage, and stir at room temperature to form a uniform mixed solution 1; mix the antioxidant 264, fatty alcohol polyoxyethylene ether and deionized water according to the above mass percentage and After stirring evenly, add it to the mixed solution 1 to form a basic cutting fluid; add sodium polyacrylate and polyether to the basic cutting fluid according to the mass percentage, and fully stir to form a uniform silicon wafer cutting fluid.

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Abstract

The invention belongs to the technical field of new energy resources of photoelectric materials, relates to a silicon slice cutting fluid and a preparation method thereof, and provides a silicon slice cutting fluid to overcome the defects that an existing silicon slice cutting fluid is high in cost, and relatively poor in dispersion and redispersion abilities on silicon carbide micro-powder. The silicon slice cutting fluid comprises the following raw materials in percentage by weight: 76wt%-80wt% of diethylene glycol, 15wt%-17wt% of polyethylene glycol, 2wt%-3.5wt% of glycerol, 0.5wt%-1.5wt% of fatty alcohol-polyoxyethylene ether, 0.7wt%-1.2wt% of deionized water, 0.2wt%-0.5wt% of a defoaming agent, 0.2wt%-0.5wt% of a dispersing agent and 0.1wt%-0.3wt% of an antioxidant. The main raw material is diethylene glycol, so that the preparation process is simple, easy to operate and low in cost; the dispersibility and the redispersibility of the silicon carbide micro-powder are effectively improved; the stability and the durability of slurry are ensured; the silicon slice cutting fluid has a good lubricating effect; the surface loss during cutting is effectively reduced; the cutting yield is improved; and the silicon slice cutting fluid is suitable for a silicon slice cutting process.

Description

technical field [0001] The invention belongs to the technical field of photoelectric material new energy, and in particular relates to a silicon chip cutting fluid and a preparation method thereof. Background technique [0002] In the cutting process of photovoltaic solar silicon wafers, silicon wafer cutting fluid is an auxiliary consumable product that must be used in the process of silicon wafer cutting, and its consumption is expanding with the growth of the photovoltaic solar energy industry and China's silicon wafer processing industry. When cutting silicon wafers, silicon carbide micropowder with high hardness, small particle size and concentrated particle size distribution is generally used as the main cutting medium. , it is usually necessary to add silicon carbide micropowder to the silicon wafer cutting fluid in a certain proportion, fully disperse it, configure it into a uniform and stable cutting mortar, and then use it for silicon wafer cutting. However, the e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C10M169/04C10M161/00
Inventor 陈五奎李军耿荣军徐文州陈磊冯加保
Owner LESHAN TOPRAYCELL
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