An epoxy-terminated polysulfide polymer, its preparation method and use, and room temperature fast-curing epoxy resin adhesive containing it

An epoxy resin and epoxy-based technology, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of reducing the cohesive strength of the resin, unfavorable industrialization, slow curing reaction, etc., and improve the impact resistance. properties and fracture toughness, avoid irritating odors, improve oil stain resistance

Active Publication Date: 2017-07-25
ZHENGZHOU ZHONGYUAN SILANDE HIGH TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, nitrile rubber is generally viscous and expensive, and is not suitable for low-viscosity epoxy resin adhesives and is not suitable for uniform mixing; for carboxyl-terminated nitrile rubber-modified epoxy resins, although it can method to improve toughness, but the process of rubber-resin prepolymerization is too complicated, which is not conducive to industrialization
The curing reaction of polysulfide rubber toughened epoxy resin is slow, and it will reduce the cohesive strength of the resin, which cannot meet the performance requirements of tensile shear strength and impact strength at the same time, and polysulfide rubber is terminated with mercapto groups, which is irritating The smell is strong, and the production and construction use of the product have a great impact on personnel and the environment

Method used

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  • An epoxy-terminated polysulfide polymer, its preparation method and use, and room temperature fast-curing epoxy resin adhesive containing it
  • An epoxy-terminated polysulfide polymer, its preparation method and use, and room temperature fast-curing epoxy resin adhesive containing it
  • An epoxy-terminated polysulfide polymer, its preparation method and use, and room temperature fast-curing epoxy resin adhesive containing it

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Effect test

preparation example Construction

[0064] The preparation process of epoxy adhesive is:

[0065] Component A: First, add epoxy resin and epoxy-terminated polysulfide polymer into a double planetary stirring tank, vacuumize and stir, add filler after the temperature rises to about 50°C, and stir at a high speed of 800-1000rpm for 10 ~20min to make component A.

[0066] Component B: First, add the curing agent, accelerator and filler into the dual planetary stirring tank in sequence, the vacuum degree is 0.1Mpa, the rotation speed is 500-1000rpm, the stirring time is 30-60min, and the temperature does not exceed 70°C throughout the process. Finally, add the coupling agent, vacuumize and stir for 5-10 minutes to make component B.

Embodiment 1

[0068] In a nitrogen atmosphere, add 1200g of dithiol-terminated liquid polysulfide rubber (polysulfide rubber LP-3 from Japan Toray Polysulfide Co., Ltd. The molecular weight is 1000, the number of moles is 1.2mol, and the content of mercapto groups is 6.6%), heating and stirring until the temperature is 50°C, adding a total amount of 106.7g (the number of moles is 0.75mol) 1,4-butanediol divinyl within 1 hour ether, and 0.05 g of catalyst 2,2'-azobisisobutyronitrile was added, and the reaction was maintained for 3 h under airtight conditions. Track and measure the vinyl content. When the vinyl content drops to 0, add 110g (1.12mol) of 1,2-epoxy-5-hexene within 1 hour at 70°C and keep the reaction for 3h , measure the content of thiol group, when the content of thiol group is 0, remove the unreacted 1,2-epoxy-5-hexene in the reaction mixture for 2 hours under the vacuum condition of 70 ℃ and 1kPa, and cool After reaching room temperature, a light yellow transparent epoxy-ter...

Embodiment 2

[0070] In a nitrogen atmosphere, add 1375g (0.55mol in moles, 3.9% in mercapto group) trimercapto-terminated liquid polysulfide rubber (Japan Toray Polysulfide Co., Ltd. polysulfide rubber LP-980, molecular weight 2500), heating and stirring until the temperature is 50 ° C, adding a total amount of 75.84g (molar number is 0.48mol) diethylene glycol divinyl ether within 50 minutes, And add 0.05 g of catalyst 2,2'-azobisisobutyronitrile, and maintain the reaction for 3 hours under airtight conditions. Follow up and measure the vinyl content. When the vinyl content drops to 0, add 86.64g (0.76mol moles) of allyl glycidyl ether within 50 minutes at 70°C, keep the reaction for 3h, and measure the thiol group content, when the thiol group content is 0, remove the unreacted allyl glycidyl ether in the reaction mixture for 2 hours at 70°C and 1kPa vacuum conditions, and cool to room temperature to obtain a light yellow transparent liquid ring Oxygen-terminated polysulfide polymers of...

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Abstract

The present invention provides an epoxy-terminated polysulfide polymer represented by the general formula (I), its preparation method and its use as a toughening agent for epoxy resin adhesives. The present invention also provides an epoxy adhesive comprising the epoxy-terminated polysulfide polymer. The polysulfide polymer provided by the present invention contains epoxy terminal groups and polysulfide bonds. When used in epoxy resin adhesives, it can increase the curing speed of the adhesive, and can also improve the impact resistance, fracture toughness, and oil resistance of the cured product after curing. performance, and also avoid the pungent smell brought by mercapto. The epoxy resin adhesive provided by the invention has no special smell during preparation and use and after the adhesive is cured, has good product performance, has no pollution to the environment, and is suitable for large-scale industrial production. .

Description

technical field [0001] The present invention relates to the field of epoxy resin adhesives, in particular to an epoxy-terminated polysulfide polymer, its preparation method and application, and a room temperature fast-curing epoxy resin adhesive comprising the epoxy-terminated polysulfide polymer . Background technique [0002] Room temperature fast-curing epoxy resin adhesive can effectively reduce the use cost of the adhesive because of its fast curing speed, high bonding strength, stable storage, good durability, and wide range of bonding materials. It is especially suitable for aviation, aerospace, automotive, etc. Rapid positioning and bonding of materials such as ships, large equipment, building structures, electronics and sports equipment. However, after curing, the epoxy resin has high crosslinking density, high brittleness, and poor impact toughness. Therefore, the development of toughened and modified room temperature fast-curing epoxy resin adhesives is a hot spo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G75/14C09J163/00C09J181/04
Inventor 张燕红曹兴园胡生祥吴欢秦瑞瑞宫祥怡屈雪艳
Owner ZHENGZHOU ZHONGYUAN SILANDE HIGH TECH CO LTD
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