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Patch type white LED light curing and packaging device and application thereof

A packaging device and patch-type technology, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems that the cured products do not have the ability to resist sunlight UVA damage, cannot add anti-yellowing agents, and white LED light decay. Achieve the effect of improving the consistency of optical performance, reducing light attenuation, and irradiating area

Inactive Publication Date: 2015-03-11
OCEAN UNIV OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are two problems in the use of UV light sources in this band. First, the spectral range emitted by the high-pressure mercury lamp is relatively wide, and the effective wavelength used for UV light curing is less than 1 / 5 of the entire spectral energy, and the effective utilization rate is relatively low. The spectrum contains a large amount of infrared spectrum, which will emit a lot of heat during use, and photocuring at high temperatures will also cause phosphor precipitation; second, because the absorption band of this type of glue photoinitiator is UVA, it cannot be used like heat curing glue. Also add anti-yellowing agent and light stabilizer, otherwise it will not be cured
As a result, the cured product does not have better resistance to sunlight UVA damage, causing yellowing, which in turn causes white LED light decay

Method used

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  • Patch type white LED light curing and packaging device and application thereof
  • Patch type white LED light curing and packaging device and application thereof
  • Patch type white LED light curing and packaging device and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Such as figure 1 As shown, the machine 1 is made of stainless steel, and the conveyor belt 2 of the metal mesh chain is driven by the speed-regulating motor 3 and controlled by the single-chip microcomputer system in the electric control box 4. The speed of the conveyor belt 2 can be changed to determine the curing time, and the conveyor belt can also be set 2. Work in the intermittent traveling mode, and determine the intermittent time as the curing time. The middle part of the conveyor belt 2 is fixed with a UV-LED light source box 5, on which a fan 6 and an exhaust pipe 7 are housed, and the fan 6 can regulate the temperature in the light source box 5 by adjusting the speed of the single-chip microcomputer system. A visor 8 that can move up and down is respectively installed on both sides of the light source box. A light source maintenance port 9 for easy maintenance is left on the side of the light source box 5 . exist figure 2 Among them, a high-power deep ultr...

Embodiment 2

[0033] In the E-51 type epoxy resin of 100 mass parts, add 100 mass parts hexahydrophthalic anhydride curing agent, 4 mass parts polyether toughening agent, 4 mass parts [10-(4-biphenyl)- 2-isopropylthioxanthone hexafluorophosphate] cationic photoinitiator (omnicat550 photoinitiator, absorption wavelength 280nm), 2 parts by mass of antioxidant and ultraviolet absorber binary compound anti-yellowing agent V76- P. 1 part by mass of hindered amine light stabilizer Tinuvin292. Then add 4 parts by mass of YAG yellow fluorescent powder, fully mix, stir and vacuumize to remove air bubbles, and then apply it to the SMD LED cup groove where the blue chip has been fixed and the gold wire is welded, until the cup groove is completely covered, and the 10 as the experimental group. In the cured glue of the control group, the anti-yellowing agent and light stabilizer were removed, and the rest of the process and formula were the same, and 10 were produced. The two groups of coated LEDs we...

Embodiment 3

[0035] The light-curing adhesive formula and process of the device in Example 1 and the experimental group in Example 2 were used. The light intensity is adjusted to 160mW / cm 2 , the temperature is controlled at 120°C. Adjust the speed of the conveyor belt 2 so that the cured SMD LEDs stay in the light source box 5 for 120 seconds, 150 seconds, 180 seconds, 210 seconds, 240 seconds, and 270 seconds respectively, and 10 of the 6 cured samples are made respectively, and cured and packaged The completed LED is placed in the light aging machine and turned on for 60 days. After testing, the light decay curve is as follows: Figure 4 . It can be seen that the curing time of 180 seconds has the smallest light decay, so 180 seconds is the best curing time under the corresponding light intensity and temperature.

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Abstract

The invention aims to provide a patch type white LED light curing and packaging device and application thereof. The packaging device comprises a conveying belt and a light source box, wherein the conveying belt is mounted on a machine table and controlled by an electric cabinet and a conveying belt speed regulating motor, and the light source box is mounted above the conveying belt; a UV-LED light source is mounted in the light source box, and a UV light sensor and a temperature sensor are also mounted in the light source box. The high-power deep ultraviolet (UVC) LED light source is adopted and is matched with the absorption wavelength of a photoinitiator in a curing adhesive, so that the packaging device has the advantages of being low in heating, high in efficiency, long in service life, large in irradiation area and uniform in irradiation. The illumination intensity can be adjusted by adjusting LED operating current. The packaging device can keep the independent stability of curing temperature, curing time and curing light intensity, and the optical performance consistency of packaged products is improved. By optimization of light curing adhesive components and ratio, the stability of luminous flux is improved, and the light attenuation is reduced.

Description

technical field [0001] The invention belongs to the technical field of LED packaging devices, and in particular relates to a chip-type white light LED photocuring packaging device and its application. Background technique [0002] There are three packaging methods for white LEDs: low-power in-line, low-power SMD and high-power. Regardless of the method, the production of white light adopts the process of coating yellow phosphor powder on the blue light chip. The specific process is as follows: first, the chip is fixed on the bracket, and the chip electrode is connected to the bracket with a gold wire on an ultrasonic welder; A certain proportion of fluorescent powder and silica gel (or epoxy glue) are uniformly mixed, and the air bubbles are discharged in a vacuum machine with negative pressure, and then the mixture of powder and glue is applied to the chip and heated to cure it. For low-power in-line and high-power types, overall potting is required to make white LED produ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/56
CPCH01L33/56H01L33/005H01L33/52H01L2933/005
Inventor 苗洪利王晶孙海港
Owner OCEAN UNIV OF CHINA
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