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A kind of room temperature curing epoxy resin flexible potting glue

An epoxy resin, curing technology at room temperature, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of low viscosity of colloid, environmental pollution, high viscosity, etc., and achieve simple preparation process, convenient use and operation, smooth surface effect

Active Publication Date: 2016-08-03
HUNAN HAOZHI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Patent CN101007937A introduces a room temperature curing battery sealant, the viscosity of which is 540cp at 25°C, which can be self-leveling, but the solvent volatilization during curing will pollute the environment, and this viscosity value is easy for potting and sealing of LED flexible light strips without border protection Glue overflow
Patent CN102417805A discloses a room-temperature-curable epoxy resin flexible sealant. The sealant uses high-molecular-weight polyetheramine as a curing agent, and the cured product has high transparency and flexibility. However, the viscosity of the colloid is too low and the curing is too slow. It is easy to cause low production efficiency, glue overflow, whitening and other performance defects
Patent CN102936478A reports "a two-component room temperature curing elastic epoxy resin adhesive and its preparation method". fiber, which makes the product have strong thixotropy and high viscosity, which makes it difficult to meet the transparency and fluidity requirements of optoelectronic semiconductor potting

Method used

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  • A kind of room temperature curing epoxy resin flexible potting glue

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034](1) Preparation of component A: 70g bisphenol A type epoxy resin E51, 23g benyl glycidyl ether, 5g dioctyl phthalate, 1.5g2,6-di-tert-butyl-4-methylphenol , 0.5g of ultraviolet absorber UV531 was added to the three-necked flask, heated to 70-80°C, and fully stirred. After the solid raw material was completely dissolved, 1g of epoxycyclohexylmethyltrimethoxysilane (KH-530), 0.5 g antifoaming agent BYK-A530, keep stirring to make it transparent and clear liquid, vacuum defoaming for 15 minutes (under vacuum degree -0.1Mpa) and then cool to room temperature to obtain component A, set aside;

[0035] (2) Preparation of component B:

[0036] 1. Preparation of modified amine prepolymer I: Slowly add 30g of isophorone diamine (IPDA) dropwise into a three-necked flask filled with 100g of bisphenol A epoxy resin E51 and equipped with a stirring paddle and a thermometer, and stir 1. Heating to 50-60°C and reacting for 2 hours, the obtained colorless, transparent and viscous targe...

Embodiment 2

[0040] (1) Preparation of component A: add 60g bisphenol A type epoxy resin E54, 27g butyl glycidyl ether, 10g epoxy soybean oil, 1.2g pentaerythritol ester, 0.8g ultraviolet absorber UV326 into a three-necked flask respectively, and heat To 70-80 ℃, and stir well, after the solid material is completely dissolved, add 2g of aminoethylaminopropyl trimethoxy silicon (KH-540), 1g of defoamer BYK-A141, continue to stir to make it transparent and clear Liquid, vacuum defoaming for 15 minutes (under vacuum degree -0.1Mpa) and then cooled to room temperature to obtain component A, which is set aside;

[0041] (2) Preparation of component B:

[0042] ①. Preparation of modified amine prepolymer II: Slowly add 30g of polyetheramine D230 dropwise into a three-neck flask filled with 100g of polyurethane modified epoxy resin and equipped with a stirring paddle and a thermometer, stir and heat to 45-50°C After reacting for 1.5 hours, the obtained colorless, transparent and viscous target p...

Embodiment 3

[0046] (1) Preparation of component A: 68g bisphenol A epoxy resin E51, 22g C12-14 aliphatic glycidyl ether (AGE), 7g dibutyl phthalate, 0.5g2,6-di-tert-butyl- 4-Hydroxyphenyl propionate isooctyl ester, 1g ultraviolet absorber UV1130, 2g glycidyl ether propyl trimethoxy silicon (KH-560), 1g defoamer BYK-A530, fully stirred into a transparent clear liquid, Vacuum degassing for 15 minutes (vacuum degree -0.1Mpa) and then cooling to room temperature to obtain component A, set aside;

[0047] (ii) Preparation of component B: 1.5g of DMP-30, 37g of polyetheramine D400, 28g of modified amine prepolymer I prepared by the method of Example 1, 35g of modified amine prepolymer prepared by the method of Example 2 Body II was fully stirred evenly at room temperature, and then vacuum degassed for 15 minutes (under vacuum degree -0.1Mpa) to obtain component B, which was set aside;

[0048] Ⅲ. Use: Store the spare A and B components in dry, airtight plastic containers respectively. When usi...

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Abstract

The invention discloses a normal-temperature-curing epoxy resin flexible pouring sealant and relates to the technical field of polymer materials. The normal-temperature-curing epoxy resin flexible pouring sealant is prepared by mixing a component A and a component B in equal parts by weight, wherein the component A comprises 60-90 parts of epoxy resin, 10-30 parts of reactive diluent, 5-10 parts of a plasticizer, 1-5 parts of a silane coupling agent, 0.5-2 parts of a defoaming agent, 0.5-2 parts of an antioxidant and 0.5-1 part of an ultraviolet absorber; and the component B comprises 1-3 parts of an accelerator, 30-60 parts of polyether amine and 0-50 parts of modified amine prepolymer I and 0-55 parts of modified amine prepolymer II. The ambient-curing epoxy resin flexible pouring sealant has the characteristics that the pouring sealant can be rapidly cured under the room temperature condition and is especially suitable for pouring LED flexible strips and the cured substance has better flexibility and higher elongation at break and transparency and the like and is suitable for pouring and sealing the surfaces of products having requirements on flexibility and transparency, for example, surface coating of LED flexible strips, LED module strips, flexible circuit boards and the like.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a room temperature curing epoxy resin flexible potting glue applied in the technical field of new energy. Background technique [0002] In recent years, epoxy resin has been widely used in casting and potting of integrated circuits, relays, transformers, and electronic components because of its excellent adhesion, electrical insulation, and chemical corrosion resistance. Depending on the application field, there are large differences in the performance requirements of the potting compound. In the packaging of optoelectronic semiconductors such as LEDs and digital dot matrix display modules, the encapsulant is required to have a specific viscosity, high transparency, and low haze. For epoxy potting adhesives for this purpose, if acid anhydrides are used as curing agents, the curing reaction generally needs to be carried out above 100°C, which consumes more energy. Altho...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J171/00C09J11/08H01L33/56
Inventor 林益军巩强欧阳飞
Owner HUNAN HAOZHI TECH
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