Low-silver-content composite conductive silver paste and preparation method thereof

A technology of composite conductivity and silver content, which is applied in the manufacture of cables/conductors, conductive materials dispersed in non-conductive inorganic materials, circuits, etc. The effect of production cost, improved electrical conductivity, and improved packing density

Inactive Publication Date: 2015-01-14
肖淑勇
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The conductive silver pastes prepared by the above two patents both use nanoparticles, including nano-silver particles and nano-copper particles. The preparation process of these nanoparticles is relatively complicated, and the production cost itself is also high, which is obviously not conducive to widespread application.

Method used

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  • Low-silver-content composite conductive silver paste and preparation method thereof
  • Low-silver-content composite conductive silver paste and preparation method thereof

Examples

Experimental program
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Effect test

preparation example Construction

[0027] (1) Preparation of organic carrier

[0028] Add 80 grams of 1,4-dimethylnaphthalene to a three-necked round-bottomed flask, heat it in a water bath to 60°C, measure 20 grams of polyvinyl acetate particles and slowly add it to the above solution, and keep stirring. After the resin is added, put it in a water bath The temperature was raised to 80° C. for 8 hours to obtain a light yellow transparent viscous resin solution.

[0029] (2) Preparation of base silver paste

[0030] Take 30 grams of the organic carrier solution prepared in (1), add it to a 200 ml beaker, keep stirring slowly, successively measure 2 grams of turpentine oil and 0.3 grams of methyl silicone oil into the carrier solution, stir at a high speed until the mixture is uniform, and then weigh 10 gram silver-plated copper powder (silver-plated weight ratio is 10%), add slowly, keep stirring, after adding, stir at a high speed until the silver-plated copper powder is evenly dispersed in the carrier, then m...

Embodiment 1

[0033] Take 20 grams of the base silver paste prepared in (2), add 1 gram of 1,4-dimethylnaphthalene, and mix at a high speed in a high-speed disperser until the slurry is uniform. After cooling to room temperature, measure its viscosity to be about 50,000 centimeters moor. The silver paste was printed onto the PET film by screen printing (220 mesh screen), dried in a constant temperature oven at 120°C for 10 minutes to obtain a conductive film with a thickness of about 25 μm, and then the conductivity of the conductive film was measured. The various performance data of silver paste and conductive film are summarized in Table 1.

Embodiment 2

[0035] Take 20 grams of the base silver paste prepared in (2), add 2 grams of 1,4-dimethylnaphthalene, and mix at a high speed in a high-speed disperser until the slurry is uniform. After cooling to room temperature, measure its viscosity to be about 40,000 centimeters moor. The silver paste was printed onto the PET film by screen printing (220 mesh screen), dried in a constant temperature oven at 120°C for 10 minutes to obtain a conductive film with a thickness of about 25 μm, and then the conductivity of the conductive film was measured. The various performance data of silver paste and conductive film are summarized in Table 1.

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Abstract

The invention relates to a low-silver-content composite conductive silver paste and a preparation method thereof, and belongs to the technical field of electroconductive slurry. The low-silver-content composite conductive silver paste can be used for screen printing. At present, the conductive silver paste preparation technology in China is high in production cost, complex in preparation technology and the like. According to the low-silver-content composite conductive silver paste, silver-plated copper powder and silver-plated glass powder are adopted to replace pure silver powder, so that the production cost of the silver paste is effectively reduced; the mode that spherical particles and platy particles are combined is selected, so that the conductivity of the silver paste is improved; the silver-plated glass powder with the low specific density is adopted, so that the stability of the conductive silver paste is improved, and the storage life of the silver paste is prolonged. The problems existing in silver paste production at present in China are well solved, the sliver paste preparation technology is simple, the silver paste is good in conductivity and impressionability (including automatic and semi-automatic screen printing and the like), and high in adhesion capacity with various substrates such as a PET film, and has significant application value.

Description

technical field [0001] The invention belongs to the technical field of conductive paste, and relates to a composite conductive silver paste with low silver content and a preparation method thereof which can be used for screen printing. Background technique [0002] In the field of conductive paste, silver-based paste has the characteristics of high conductivity, stable performance, good printability, and strong bonding strength with the substrate, and is widely used in the production of various electronic components, such as integrated circuits, membrane switches, Electric heating diaphragm, etc. Conductive silver paste is generally composed of silver powder, organic vehicle and other additives. In order to achieve the conductivity required by the application, usually the weight ratio of silver powder in the entire paste must reach 60-85%. This part of the cost accounts for the entire cost of conductive silver paste. more than 90 percent. In the production of many electron...

Claims

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Application Information

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IPC IPC(8): H01B1/22H01B13/00
Inventor 肖淑勇吴开李智慧
Owner 肖淑勇
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