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Alloy material liquid forging release agent and preparing method thereof

A liquid die forging, alloy material technology, applied in metal processing equipment, manufacturing tools, casting and molding equipment, etc., can solve the problems affecting the process yield and secondary processing operations, unenvironmental operator health, and high organic matter volatility. Achieve the effect of preventing the mold temperature from passing out too quickly, improving the suspension, and increasing the softening temperature

Active Publication Date: 2014-12-24
GUANGDONG DONGGUAN TEAMRUN ELECTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] There are many types of release agents for alloy materials, which are mainly divided into high polymer release agents (such as silicone oil, silicone grease, etc.), organic release agents (such as fatty acid soap, paraffin, etc.), and inorganic solvent release agents. (such as talcum powder, kaolin, etc.), liquid die forging is a high-temperature operation, and the release agent rich in organic matter has insufficient heat resistance during use, is easy to decompose, has high volatility of organic matter, strong odor, is not environmentally friendly and is harmful to operators. It is unfavorable to health. At the same time, due to the limitation of the chemical properties of this kind of release agent, the molding is poor and the demoulding is difficult, so that the castings generally have the phenomenon of sticking mold, cold shut and uneven surface gloss, which affects the process yield and secondary processing. operate

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] A liquid die forging release agent for alloy materials, which is made of the following components by weight percentage: mullite 6%; talc powder 1%; light silicon dioxide 0.5%; diatomite 1%; Sodium polycarboxylate 0.5%; Isomerized tridecyl alcohol polyoxyethylene ether 0.1%; Sodium polyacrylate 0.05%; N-octanoic acid 0.05%; N-capric acid 0.05%; Magnesium hydrogen phosphate trihydrate 0.02%; Oxyethylene ether phosphate potassium salt 0.05%; polyether silicone 0.5%; dialkyl sulfosuccinate 0.01%; the balance is deionized water.

[0027] Its preparation method comprises the following steps in turn:

[0028] a. Add isomeric tridecyl alcohol polyoxyethylene ether, polyether silicone, polyoxyethylene ether phosphate potassium salt, n-octanoic acid, and n-decanoic acid to water in sequence, and then stir for 0.5 hours to obtain a mixed solution;

[0029] b. Use a high-speed emulsifier to emulsify the mixed solution obtained in step a until it is uniform. The emulsification time...

Embodiment 2

[0035] A liquid die forging release agent for alloy materials, which is made of the following components by weight percentage: 18% mullite; 5% talc; 5% light silicon dioxide; 5% diatomaceous earth; Sodium polycarboxylate 1%; Isomerized tridecanol polyoxyethylene ether 1.5%; Sodium polyacrylate 0.1%; N-octanoic acid 1.5%; N-decanoic acid 1.5%; Magnesium hydrogen phosphate trihydrate 0.6%; Gum Arabic 1.5%; Oxyethylene ether phosphate potassium salt 0.8%; polyether silicone 1.5%; dialkyl sulfosuccinate 0.3%; the balance is deionized water.

[0036] Its preparation method comprises the following steps in turn:

[0037] a. Add isomeric tridecyl alcohol polyoxyethylene ether, polyether silicone, polyoxyethylene ether phosphate potassium salt, n-octanoic acid, and n-decanoic acid to water in sequence, and then stir for 1 hour to obtain a mixed solution;

[0038] b. Emulsify the mixed solution obtained through step a until uniform with a high-speed emulsifier, and the emulsification ...

Embodiment 3

[0044] A liquid mold release agent for alloy materials, which is made of the following components by weight percentage: 10% of mullite; 3% of talc; 2.5% of light silicon dioxide; 3% of diatomite; Sodium polycarboxylate 0.7%; Isomerized tridecanol polyoxyethylene ether 0.9%; Sodium polyacrylate 0.08%; N-octanoic acid 1.2%; N-decanoic acid 1.4%; Magnesium hydrogen phosphate trihydrate 0.35%; Gum Arabic 0.7%; Oxyethylene ether phosphate potassium salt 0.6%; polyether silicone 1.2%; dialkyl sulfosuccinate 0.15%; the balance is deionized water.

[0045] Its preparation method comprises the following steps in turn:

[0046] a. Add isomeric tridecyl alcohol polyoxyethylene ether, polyether silicone, polyoxyethylene ether phosphate potassium salt, n-octanoic acid, and n-decanoic acid to water in sequence, and then stir for 0.8 hours to obtain a mixed solution;

[0047] b. Emulsify the mixed solution obtained through step a until uniform with a high-speed emulsifier, and the emulsific...

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PUM

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Abstract

The invention relates to an alloy material liquid forging release agent. The alloy material liquid forging release agent is prepared from the following ingredients: 6-18% of mullite, 1-5% of talcum powder, 0.5-5% of light silicon oxide, 1-5% of diatomite, 0.5-1% of sodium polycarboxylate, 0.1-1.5% of iso-tridecanol polyoxyethylene ether, 0.05-0.1% of sodium polyacrylate, 0.05-1.5% of n-octanoic acid, 0.05-1.5% of n-capric acid, 0.02-0.6% of magnesium hydrogen phosphate trihydrate, 0.5-1.5% of arabic gum, 0.05-0.8% of potassium polyoxyethylene ether phosphate, 0.5-1.5% of polyether organic silicone, 0.01-0.3% of dialkyl sulfosuccinate and the rest of deionized water. The invention further provides a preparing method of the release agent. The alloy material liquid forging release agent can avoid die attaching, cold shut and air vent phenomena in the liquid forging process, and the technology of the preparing method is easy to operate and low in cost.

Description

technical field [0001] The invention relates to a release agent and a preparation method thereof, in particular to an alloy material liquid die forging release agent and a preparation method thereof. Background technique [0002] Alloy material liquid die forging release agent is a functional substance between the abrasive tool and the casting. It has chemical resistance and will not be dissolved when in contact with the chemical composition of different resins. It also has heat and stress resistance. High performance, not easy to decompose or wear, bonded to the mold during use and not transferred to the processed casting, which is conducive to the smooth removal of the casting from the mold, and at the same time does not hinder the secondary processing operation of the casting, widely used Automotive, aircraft, electrical appliances, electrical equipment and other industrial fields. [0003] There are many types of release agents for alloy materials, which are mainly divi...

Claims

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Application Information

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IPC IPC(8): B22C3/00
Inventor 纪玉信许俊伟张树鸿
Owner GUANGDONG DONGGUAN TEAMRUN ELECTRONICS MATERIAL
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