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High-power LED (light emitting diode) grapheme-based heat radiation device

A graphene-based, heat-dissipating device technology, applied in the direction of cooling/heating device, lighting device, lighting and heating equipment of lighting device, etc., to achieve the effect of improved capacity, enhanced heat dissipation effect, and high utilization rate

Inactive Publication Date: 2014-12-17
ZHEJIANG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the heat dissipation problem of the existing high-power LED light source, the present invention provides an integrated package type high-power LED graphene-based heat dissipation device with high heat dissipation efficiency, good heat dissipation effect and uniform temperature

Method used

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  • High-power LED (light emitting diode) grapheme-based heat radiation device

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Embodiment Construction

[0019] refer to figure 1 , a high-power LED graphene-based heat dissipation device, including a substrate 2 for heat conduction attached to the bottom surface of the LED light source 1, the substrate 2 is provided with fins 6 for heat dissipation, and the bottom surface of the substrate 2 is provided There is a single-layer graphene-based interface 3, and the contact interface between the bottom surface of the LED light source 1 and the single-layer graphene-based interface 3 is filled with a composite layer 4 of graphene and thermally conductive adhesive.

[0020] Further, the LED light source 1 and the substrate 2 are tightened and reinforced by screws 5 .

[0021] Further, the thermally conductive adhesive may be thermally conductive silica gel, thermally conductive silicone grease or epoxy resin.

[0022] Further, the said fins are sheet-type fins, and corrugations 7 are provided on the fins.

[0023] The heat generated at the center of the integrated high-power LED ligh...

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Abstract

The invention discloses a high-power LED (light emitting diode) grapheme-based heat radiation device, which comprises a base plate, wherein the base plate is pasted on the bottom surface of an LED light source and is used for heat conduction, fins for achieving the heat radiation effect are arranged on the base plate, the bottom surface of the base plate is provided with a single-layer grapheme-based interface, and contact interfaces of the bottom surface of the LED light source and the single-layer grapheme-based interface are filled with composite layers of grapheme and heat conduction bonding agents. The high-power LED grapheme-based heat radiation device has the advantages that the horizontal direction of the single-layer grapheme-based interface has very high heat conductivity, a great amount of concentrated heat can be fast conducted to the base plate and the fins, and through the corrugated design and the reasonable layout of the fins, the convection heat exchange capability of the fins and the air can be improved, so a great amount of concentrated heat is fast conducted out, in addition, the convection heat exchange heat is radiated out, the heat radiation efficiency is high, the heat radiation effect is good, and the temperature of the heat radiation device is uniform.

Description

technical field [0001] The invention relates to a high-power LED graphene-based heat dissipation device, in particular to a graphene-based heat dissipation device for an integrated and packaged high-power LED. Background technique [0002] With the continuous improvement of LED luminous efficiency, LED light source shows a wide range of application prospects with its obvious advantages, such as the application of lighting fixtures for roads, tunnels, and landscapes. Lighting fixtures using high-power LEDs as light sources have become a research hotspot in recent years. However, due to the particularity of LED light emission, its chip will generate a lot of heat while emitting light. These heats will cause the light attenuation of the LED chip, reduce the luminous efficiency, and even cause the LED to fail in severe cases. These seriously restrict the development and application of LED light sources in lamps. Therefore, heat dissipation is one of the key problems that need...

Claims

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Application Information

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IPC IPC(8): F21Y101/02F21V29/00
Inventor 蒋兰芳刘红庞鑫培谷云庆郑水华
Owner ZHEJIANG UNIV OF TECH
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