Design method enabling main board to be resistant to corrosion at high temperature

Abstract

The invention provides a design method enabling a main board to be resistant to corrosion at high temperature, and belongs to the field of server main boards. The design method mainly comprises the steps of (1) layout of a PCBA, (2) design of a machine case structure, (3) selection of materials of a PCB and materials used in elements, and (4) spraying of tri-proof paint and corrosion-resistance testing. By modifying the layout of a system, introducing NP-175FM/NPGN-170 materials and optimizing the materials of the elements, the main board can be used in a fresh air refrigerating station, the PUE index is effectively lowered, stable operation at 40 DEG C is realized, performance can be kept at 45 DEG C, and the MTBF time can reach five years. Signals keep stable at high temperature, and insertionLOSS and impedance are effectively controlled.

Description

technical field [0001] The invention relates to the field of server motherboards, in particular to a design method for making the motherboard high temperature and corrosion resistant. Background technique [0002] The Internet business is growing rapidly, and the construction and operation and maintenance of data centers account for 50% of the capital investment of data centers; Internet customers are looking for data centers with low PUE to reduce the capital investment brought by power consumption of data centers, and construction through A data center cooled by fresh air can greatly reduce the capital investment in data center construction; appropriately increasing the ambient temperature of the data center can greatly reduce the PUE of the data center and reduce the capital investment in data center operation and maintenance. [0003] Phenomenon or factors of high PUE value in the existing data center: (1) Basically, it is air-conditioning cooling and heat dissipation, a...

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Problems solved by technology

[0003]Phenomenon or factors of high PUE value in the existing data center: (1) It is basically air-conditioning cooling and heat dissipation, and the cooling energy efficiency is low (2) The air duct design is unreasonable, Or the design of the air duct is wrong (3) The design of the air conditioner is excessively redundant (4) The temperature and humidity design in the computer room is unreasonable, and the humidification and dehumidification of the air conditioner are carried out at the same time (5) The temperature in the computer room is too low (6) The design of the enclosure structure is unreasonable or no design (7) There is no air-conditioning refrigeration control, and the invalid operation time of the air conditioner is long. (8) Equipment with different ambient temperatures are placed in the same space, and a low-temperature environment is set

[0004] As a result, the signal of the motherboard is unstable during high-temperature operation, which also leads to high power consumption, a high proportion of the cooling system to the PUE, and a failure rate higher

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