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Silicon rod sticking improving process

A silicon rod and process technology, applied in the field of improving the process and quality of viscose silicon rods, can solve the problems such as the inability to observe pores, achieve the effects of reducing curing time, quality assurance, and improving work capacity

Inactive Publication Date: 2014-12-10
无锡尚品太阳能电力科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, it is impossible to observe whether there are air holes in the bonding of the ingot and the glass. If there are air holes, the glue will act as a buffer, resulting in a large number of chipping after the silicon ingot is sliced. rod surface friction

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] (1) Select a silicon rod with a length of 250-300mm, and wipe the surface of the crystal rod with alcohol to avoid dust and debris.

[0025] (2) Select the frosted glass with the same specifications as the ingot, and wipe the surface of the frosted glass with alcohol, free of dust and debris.

[0026] (3) Wrap the wiped crystal ingot with masking tape at the chamfer to prevent glue from dripping.

[0027] (4) Spread the glue evenly on the surface of the silicon rod. After the glue is applied evenly, press the wiped frosted glass surface on the surface of the crystal rod, and use the glue to bond the crystal rod and the frosted glass together. The weight of the crystal rod itself is (35-40kg) for extrusion, curing time is 6h.

[0028] (5) After the crystal rod and the frosted glass are solidified, wipe the side of the glass without glue with alcohol and toilet paper. If the glue on the bonding surface of the crystal rod and the glass is unevenly applied, pores will be s...

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PUM

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Abstract

The invention relates to a silicon rod sticking improving process belonging to the technical field of silicon rod cutting. The silicon rod sticking improving process comprises the steps of uniformly smearing glue (epoxy glue) on the surface of a crystal rod, and then, pressing ground glass on the crystal rod to ensure that whether air bubbles are generated on the glass can be directly seen after the glass is stuck; if no air bubbles are generated, continuing to stick the glass to a workpiece plate; and if air bubbles are generated, directly separating in water with the high temperature of 100 DEG C. By using the silicon rod sticking improving process, the time consumed by using the traditional sticking process is shortened, the quality problem of edge breakage caused when the silicon rod is processed is reduced, and the risks of overhigh single battery piece cost caused by silver paste leakage from an edge breakage position when silicon wafers are put into production of battery pieces and relatively short service life of silk screen printing equipment are also reduced.

Description

technical field [0001] The invention relates to a process for improving viscose silicon rods, in particular to a process for saving energy and reducing consumption while improving the quality of chipping on the surface of silicon wafers, and belongs to the technical field of silicon rod cutting. Background technique [0002] The existing method of sticking silicon rods is to first glue the frosted glass on the workpiece plate with glue (epoxy glue), and cure for half an hour; after it is completely fixed, fix the crystal rod on the glass with epoxy glue; after complete curing Cutting on the machine. In this way, it is impossible to observe whether there are air holes in the bonding of the ingot and the glass. If there are air holes, the glue will act as a buffer, resulting in a large number of chipping after the silicon ingot is sliced. Stick surface friction. Contents of the invention [0003] The object of the present invention is to aim at the deficiencies in the prio...

Claims

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Application Information

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IPC IPC(8): C30B33/00B28D5/00
Inventor 杜正兴李靖华冰
Owner 无锡尚品太阳能电力科技有限公司
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