A kind of palladium-containing less and less clean sn-zn solder and preparation method thereof

Abstract

The invention discloses a clean Sn-Zn brazing material containing palladium. The weight percent composition of each metal element is as follows: Pd: 0.05%-0.3%, Ga: 0.1%-0.5%, In: 6%-10% %, Ag: 0.1% to 3.5%, Zn: 7% to 10%, and the balance is Sn. During preparation, the palladium is first absorbed hydrogen and ground into powder for later use; the metal silver and tin are smelted in proportion to form a silver-tin intermediate alloy; After ~450℃, add the raw material zinc and keep it warm to obtain the Sn-Zn-Ag intermediate alloy liquid; add the raw materials indium and gallium in sequence, and when the temperature of the melt drops to 250~350℃, keep it warm to get the Sn-Zn-Ag-In -Ga intermediate alloy liquid; add palladium powder, fully melt it, cover it with a mixture of zinc chloride and vegetable oil, keep warm, and pour it into an ingot; after extrusion, drawing / rolling, it can be made into a filament / sheet shape. The solder has the characteristics of high cleanliness, strong wettability, less brazing seam defects, and low melting point.

Description

technical field [0001] The invention relates to a brazing filler metal for zinc-aluminum alloy brazing, in particular to a palladium-containing poorly clean Sn-Zn brazing filler metal, and also relates to a preparation method of the brazing filler metal. Background technique [0002] Zinc alloys, especially wrought zinc alloys, have excellent comprehensive properties and become ideal substitutes for copper alloys in some fields, and have broad application prospects in cluster industries such as electronic communications, sanitary ware, hardware construction, electromechanical, and clothing. Many industries such as sanitary ware, hardware, home appliances and other light industries have used wrought zinc alloys to manufacture structural parts, so replacing copper structures with zinc-aluminum alloys is bound to become a development direction of the manufacturing industry. [0003] At present, low-temperature soft soldering is generally used for zinc alloy brazing at home and ...

AI Technical Summary

Problems solved by technology

For example, "Sn-Zn-Ga-Ce lead-free solder" has been developed on the basis of Sn-Zn, such as Chinese invention patent: a kind of tin-zinc-based lead-free solder alloy announced by publication number CN101585120, published by publication number CN101058131 A kind of Sn-Zn lead-free solder alloy of Sn-Zn system and its preparation method and the Sn-Zn solder alloy of multiple "multi-alloy system" such as tin-zinc-based lead-free solder alloy containing rare earth elements announced by Publication No. CN1390672, they are combined with Compared with the binary Sn-Zn alloy solder, some properties have been improved, but the overall performance is not as good as the traditional Sn-Pb solder. Therefore, the Sn-Zn solder still needs further improvement.