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Graphene composite conductive adhesive

A graphene composite and conductive adhesive technology, which is applied in the direction of conductive adhesives, circuits, electrical components, etc., can solve the problems of poor thermal conductivity, limited development, high curing temperature, etc., to avoid settlement, save energy and cost, and sintering temperature low effect

Inactive Publication Date: 2014-12-03
NANO TOP ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, conductive adhesives also generally have the following problems, such as high curing temperature, poor electrical conductivity, and poor thermal conductivity, which limit their development.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Graphene composite micron silver powder to prepare conductive adhesive, accurately weigh 2g polymethacrylic acid, add it to 9g carbitol acetate, stir in a planetary power mixer for 2h; combine 10g flake silver powder with a particle size of 2μm and 1g graphite The olefin powder Morsh-P2 (Ningbo Mexi Technology) was added to the above solution in sequence, ultrasonicated for 30 minutes, 0.1g leveling agent, 0.1g sodium dodecylbenzene sulfonate and 0.05g triethanolamine were added, and the mixture was stirred for 1h to obtain Graphene composite conductive adhesive; using RTS-9 four-probe tester to measure the resistance of the conductive adhesive after sintering at 150°C for 3 minutes, it is 11.2mΩ / □.

Embodiment 2

[0027] Graphene composite micro-nano silver powder to prepare conductive adhesive, accurately weigh 2g polyester resin, add it to 10g ethylene glycol phenyl ether, stir for 2h in a planetary power mixer; combine 9g flake silver powder with a particle size of 2μm and 1g particle size 50nm nano silver powder and 1.5g graphene powder Morsh-P2 (Ningbo Mexi Technology) were added to the above solution in turn, ultrasonicated for 30 minutes, 0.1g leveling agent, 0.2g sodium dodecylbenzene sulfonate and 0.1g The 30% ammonia solution was continuously stirred for 1.5 hours to obtain a graphene composite conductive adhesive; the resistance of the conductive adhesive after sintering at 150°C for 3 minutes was 2.6mΩ / □ using the RTS-9 four-probe tester.

Embodiment 3

[0029] Graphene composite micron silver powder to prepare conductive adhesive, accurately weigh 3.5g polymethacrylic acid, add it to 15g carbitol acetate, stir in a planetary power mixer for 2h; combine 10g flake copper powder with a particle size of 2μm and 1.5g imported CVD copper-based single-layer graphene (Nanjing Xianfeng Nanomaterials) was added to the above solution in turn, ultrasonicated for 30 minutes, added 0.15g leveling agent, 0.3g sodium dodecylbenzene sulfonate and 0.1g triethanolamine , Continue to stir for 1 hour to obtain a graphene composite conductive adhesive; using the RTS-9 four-probe tester to measure the resistance of the conductive adhesive after sintering at 150°C for 3 minutes, it is 3.4mΩ / □.

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Abstract

The invention provides a graphene composite conductive adhesive which is characterized by comprising the following components by the mass percentage: 30-65% of a conductive filler, 1-50% of grapheme, 1-20% of resin, 0.1-5% of an additive, and 10-67% of a main solvent. With combination of the graphene advantage of high thermal conductivity and the nano metal advantage of low melting point, the sintering temperature of the conductive adhesive can be allowed to be lower, and thus energy and costs are saved; with super large specific surface area of the graphene, nano particles can be uniformly dispersed between graphene sheet layers, the problems of graphene agglomeration and nano particle settlement in the conductive adhesive are avoided, and the conductive property and bonding strength of the conductive adhesive are improved. The conductive adhesive is simple in preparation process and suitable for mass production.

Description

Technical field [0001] The invention relates to a conductive adhesive, in particular to a graphene composite conductive adhesive, and belongs to the field of electronic device packaging and manufacturing. Background technique [0002] Graphene is currently the material with the best electrical and thermal conductivity, with a resistivity of about 10 -6 Ω·cm, lower than copper or silver, is currently the world's smallest resistivity material; thermal conductivity is as high as 3000W / m·K, higher than carbon nanotubes and diamond, and its electron mobility exceeds 15000cm at room temperature 2 / V·s, which is higher than carbon nanotubes or silicon crystals. Because of its extremely low resistivity and extremely fast electron migration, it is expected to be used to develop a new generation of thinner and faster conducting electronic components or transistors. [0003] With the development of the semiconductor integrated circuit packaging industry, the choice of electronic packaging mat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J9/02C09J11/04H01L23/29
Inventor 张兴业邱雄鹰吴丽娟宋延林
Owner NANO TOP ELECTRONICS TECH
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