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Base plate for printed circuit board drilling and preparation method for base plate

A technology for printed circuit boards and backing plates, which is applied in printed circuit manufacturing, printed circuits, drilling/drilling equipment, etc., can solve the problems of insufficient lubrication and heat dissipation capacity of drilling backing plates, and achieve good industrial production value and application prospects. , The effect of improving the quality of the hole wall and increasing the accuracy of the hole position

Active Publication Date: 2014-12-03
YANTAI NEWCCESS NEW MATERIALS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above deficiencies in the prior art, the object of the present invention is to provide a preparation method of a backing plate for drilling printed circuit boards and the backing plate, aiming to solve the problem of insufficient lubrication and heat dissipation capacity of the drilling backing plate

Method used

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  • Base plate for printed circuit board drilling and preparation method for base plate

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Effect test

Embodiment 1

[0036] In parts by weight, 95 parts of the main component of the lubricating and heat-dissipating resin are mixed with 5 parts of additives to form an emulsion. The main component of the lubricating and heat-dissipating resin is composed of 10 parts of polyethylene oxide, 10 parts of polyethylene glycol, 3 parts of glycerin, and 30 parts of vinyl acetate in parts by weight, and the auxiliary agent is a silicone surfactant. The emulsion is sprayed on the surface of the wood fiber board by a coating machine. Before the emulsion is completely dry, paste the wood pulp paper on the lubricating heat dissipation resin, and then dry it.

[0037] In parts by weight, 100 parts of unsaturated polyester, 2 parts of initiator and 0.4 part of accelerator are taken, wherein the unsaturated polyester is synthesized from maleic anhydride, phthalic anhydride and propylene glycol. The initiator is cyclohexanone peroxide, and the accelerator is cobalt naphthenate. The mixed components are coate...

Embodiment 2

[0039] In parts by weight, 95 parts of the main component of the lubricating and heat-dissipating resin are mixed with 5 parts of additives to form an emulsion. The main component of the lubricating and heat-dissipating resin is composed of 10 parts of polyethylene oxide, 10 parts of polyethylene glycol, 2 parts of glycerin, and 40 parts of polyvinyl alcohol, and the auxiliary agent is silicone surfactant. The emulsion is sprayed on the surface of the wood fiber board by a coating machine. Before the emulsion is completely dry, paste the wood pulp paper on the lubricating heat dissipation resin, and then dry it.

[0040] In parts by weight, get 100 parts of unsaturated polyester, 2 parts of initiator, 0.4 part of accelerator, and 0.5 part of inhibitor, wherein the unsaturated polyester is composed of maleic anhydride, phthalic anhydride and propylene glycol Synthesized. The initiator is cyclohexanone peroxide, the accelerator is cobalt naphthenate, and the inhibitor is hydro...

Embodiment 3

[0042]In parts by weight, 95 parts of the main component of the lubricating and heat-dissipating resin are mixed with 5 parts of additives to form an emulsion. The main component of the lubricating and heat-dissipating resin is composed of 30 parts of polyethylene oxide, 30 parts of polyethylene glycol, 8 parts of glycerin, and 60 parts of vinyl acetate in parts by weight, and the auxiliary agent is a silicone surfactant. The emulsion is sprayed on the surface of the wood fiber board by a coating machine. Before the emulsion is completely dry, paste the wood pulp paper on the lubricating heat dissipation resin, and then dry it.

[0043] In parts by weight, 100 parts of unsaturated polyester, 4 parts of initiator and 2 parts of accelerator are taken, wherein the unsaturated polyester is synthesized from maleic anhydride, phthalic anhydride and propylene glycol. The initiator is cyclohexanone peroxide, and the accelerator is cobalt naphthenate. The mixed components are coated ...

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Abstract

The invention discloses a base plate for printed circuit board drilling and a preparation method for the base plate. The preparation method comprises the steps of respectively coating the upper surface and the lower surface of a wood fiber board with lubricating heat dissipation resin to form lubricating heat dissipation resin layers, attaching wood pulp paper to the surfaces of the lubricating heat dissipation resin layers when the lubricating heat dissipation resin is not completely dried, and then preparing the base plate for printed circuit board drilling after the surfaces of the wood pulp paper are coated with non-saturated polyester resin to form non-saturated polyester resin layers, wherein the lubricating heat dissipation resin is prepared from the following components in parts by weight: 95 parts of a main component and 5 parts of a non-ion surfactant; the main component consists of two or more than two out of polyoxyethylene, polyethylene glycol, glycerinum, vinyl acetate and polyvinyl alcohol. Due to the lubricating heat dissipation resin, the base plate has a good lubricating heat dissipation function, so that the hole site precision during drilling of a drilling needle is improved, the quality of a hole wall is improved, and the temperature of the drilling needle is reduced.

Description

technical field [0001] The invention relates to the field of PCB processing and preparation, in particular to a backing plate for drilling printed circuit boards and a preparation method thereof. Background technique [0002] In the PCB manufacturing process, in order to conduct the upper and lower layers, it is necessary to use a drill to penetrate the insulating layer in a small area, and then electroplate the conductive layer. When drilling, in order to improve drilling accuracy and reduce drilling burrs, an aluminum cover plate is placed above the copper clad laminate to be drilled and a backing plate is placed under the copper clad laminate to play the role of heat dissipation, guidance and protection of the drill pin . In the prior art, lubricating and heat-dissipating resins are mainly used in cover plates, but after the drill passes through the cover plate and PCB board, the lubricating and heat-dissipating functions have basically been exhausted, and the PCB genera...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B21/02B32B21/08B32B27/30B32B27/18B32B37/15
CPCB23B47/32B23B2222/21H05K3/0047H05K2203/0214B32B21/02B32B21/08B32B27/18B32B37/15C10M7/00C10M111/00C10M2209/00
Inventor 罗小阳杨柳唐甲林秦先志
Owner YANTAI NEWCCESS NEW MATERIALS TECH CO LTD
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