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Chlorite powder conductive silver paste and manufacturing method thereof

A technology of chlorite powder and conductive silver paste, which is applied in the manufacture of cables/conductors, conductive materials dispersed in non-conductive inorganic materials, circuits, etc., and can solve problems such as poor soldering resistance, poor sintering performance, and environmental pollution , to achieve the effects of low cost, improved production efficiency, and excellent welding resistance

Active Publication Date: 2014-11-19
徐州华锌际新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The characteristics that conductive silver paste needs to have are: good conductivity (antistatic property), strong adhesion, good printing adaptability and excellent solvent resistance. However, the existing conductive silver paste on the market has many shortcomings, not only containing lead , cadmium, etc. and are toxic, pollute the environment, and when used on conductive substrates, the adhesion is low, the soldering resistance is not good, and the sintering performance is poor

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0012] The conductive silver paste of a kind of chlorite powder is characterized in that it is made of the following raw materials in parts by weight: silver powder 42, chlorite powder 4, calcium carbonate whisker 3, benzotriazole 2.1, ammonium molybdate 0.8 , boric acid 3.2, citric acid 1.1, boron carbide 3, dioctyl sodium sulfosuccinate 2.7, additive 33, appropriate amount of water.

[0013] The auxiliary agent is made of the following raw materials in parts by weight: aluminum oxide 2, boron oxide 4, polyvinyl alcohol 7, rosin 15, 3-aminopropyltrimethoxysilane 1.5, polydimethylsiloxane 0.3 , acetone 12, cyclohexanone 8, the preparation method is to put aluminum oxide and boron oxide in a calciner and calcinate at 520-610°C for 1-2 hours, take it out and cool to room temperature, add polyvinyl alcohol and grind for 20- 40 minutes; mix cyclohexanone and rosin, react at 100-120°C for 2-3 hours, cool to 40-50°C, add acetone, 3-aminopropyltrimethoxysilane, polydimethylsiloxane ...

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PUM

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Abstract

The invention discloses chlorite powder conductive silver paste. The chlorite powder conductive silver paste is characterized by comprising the following materials in parts by weight: 40-50 parts of silver powder, 4-6 parts of chlorite powder, 2-4 parts of calcium carbonate whisker, 2.1-3.5 parts of benzotriazole, 0.4-0.8 part of ammonium molybdate, 1.2-3.2 parts of boric acid, 1.1-2.2 parts of citric acid, 3-5 parts of boron carbide, 1.4-2.7 parts of dioctyl sodium sulfosuccinate, 30-40 parts of an assistant and appropriate amount of water. The chlorite powder conductive silver paste provided by the invention has the advantages that the resistance is low, the welding resistance is excellent and the like; the printing resolution can be increased, the production efficiency is improved, the cost is low and the environmental protection is facilitated.

Description

technical field [0001] The invention relates to the field of conductive silver paste, in particular to a conductive silver paste of chlorite powder and a preparation method thereof. Background technique [0002] Conductive silver paste refers to the silver paste printed on the conductive substrate to make it have the ability to conduct current and eliminate the accumulated static charge. It is generally printed on non-conductive substrates such as plastic, glass, ceramics or cardboard. It is made of conductive Filler, binder, solvent and additive composition. The characteristics that conductive silver paste needs to have are: good conductivity (antistatic property), strong adhesion, good printing adaptability and excellent solvent resistance. However, the existing conductive silver paste on the market has many shortcomings, not only containing lead , cadmium, etc., are toxic, pollute the environment, and when used on conductive substrates, have low adhesion, poor soldering ...

Claims

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Application Information

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IPC IPC(8): H01B1/16H01B1/22H01B13/00
Inventor 蒋智谋周施峰周梅永胡加峰谢水兵张超崔海威吴华董子侠
Owner 徐州华锌际新材料科技有限公司
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