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Addition-type bi-component heat-conducting pouring sealant and preparation method thereof

A thermally conductive potting, two-component technology, used in adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of poor substrate adhesion, no adhesion, and poor adhesion. , to achieve the effect of improving adhesive properties, excellent adhesive properties and low viscosity

Active Publication Date: 2014-11-19
ZHENGZHOU ZHONGYUAN SILANDE HIGH TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the heat-conducting potting adhesives used in China mainly include three categories: epoxy resin, polyurethane and silicone. In high-power power supplies, relays, sensors, or electronic appliances that require high temperature use, the potting glue will pulverize and lose elasticity for a long time
Silicone heat-conducting potting adhesive has the advantages of high temperature resistance and small linear expansion coefficient, and can be used at a high temperature of 230°C for a long time, but its bonding ability to the substrate is poor, and it has almost no bonding ability.
The silicone potting adhesives currently on the market do have poor bonding ability, especially for aluminum and PC boards, which have almost no bonding ability

Method used

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  • Addition-type bi-component heat-conducting pouring sealant and preparation method thereof
  • Addition-type bi-component heat-conducting pouring sealant and preparation method thereof
  • Addition-type bi-component heat-conducting pouring sealant and preparation method thereof

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Experimental program
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Effect test

Embodiment 1

[0027] The addition-type two-component heat-conducting potting compound in this embodiment is composed of two components, A and B, in parts by weight.

[0028] Component A: 100 parts of vinyl silicone oil with a viscosity of 300cp, 2 parts of hydrogen-containing silicone oil with a hydrogen content of 0.25%, 200 parts of filler aluminum oxide, 100 parts of silicon carbide and 100 parts of magnesium oxide, 1-ethynyl-1 0.2 parts of cyclohexanol, 5 parts of tackifier with hydrogen content of 0.35%, the structural formula is:

[0029] Component B: 30 parts of methyl silicone oil with a viscosity of 50 cp, platinum-divinyltetramethyldisiloxane complex with a Pt content of 3000 ppm (purchased from Heraeus, Germany, CAS: 68478-92-2) 0.6 share.

[0030] The preparation method of described tackifier is: get 24g of D 4 H Put 32.6g of vinyltrimethoxysilane in a 250ml three-necked flask, add 30mL of toluene as a solvent, and react under nitrogen protection, the reaction temperature i...

Embodiment 2

[0033] The addition-type two-component heat-conducting potting compound in this embodiment is composed of two components, A and B, in parts by weight.

[0034] Component A: 100 parts of vinyl silicone oil with a viscosity of 500cp, 2 parts of hydrogen-containing silicone oil with a hydrogen content of 0.3%, 150 parts of filler aluminum oxide, 100 parts of aluminum nitride, 250 parts of magnesium oxide, tetramethyltetraethylene 0.25 parts of cyclotetrasiloxane, 5 parts of tackifier with hydrogen content of 0.4%, the structural formula is:

[0035] Component B: 30 parts of methyl silicone oil with a viscosity of 50 cp, 0.6 parts of chloroplatinic acid-isopropanol solution with a Pt content of 3%.

[0036] The preparation method of described tackifier is: get 24g of D 4 H Place 27.4g of allyl glycidyl ether in a 250ml three-necked flask, add 30mL of toluene as a solvent, and react under nitrogen protection. The reaction temperature is 70°C, and the reaction time is 4 hours; a...

Embodiment 3

[0039] The addition-type two-component heat-conducting potting compound in this embodiment is composed of two components, A and B, in parts by weight.

[0040] Component A: 100 parts of vinyl silicone oil with a viscosity of 1000cp, 1 part of hydrogen-containing silicone oil with a hydrogen content of 0.4%, 200 parts of filler aluminum oxide and 100 parts of silicon carbide, tetramethyltetravinyl cyclotetrasiloxane 0.15 parts, 4 parts of tackifier with hydrogen content of 0.4%, the structural formula is:

[0041] Component B: 30 parts of methyl silicone oil with a viscosity of 50 cp, 0.6 parts of chloroplatinic acid-tetrahydrofuran solution with a Pt content of 3%.

[0042] The preparation method of described tackifier is: get 24g of D 4 HPut 16.3g of vinyltrimethoxysilane and 13.7g of allyl glycidyl ether into a 250ml three-necked flask, add 30mL of toluene as a solvent, and react under nitrogen protection. The reaction temperature is 80°C, and the reaction time is For 4...

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Abstract

The invention discloses an addition-type bi-component heat-conducting pouring sealant and a preparation method thereof and belongs to the technical field of polymer materials. The pouring sealant is composed of a component A and a component B, wherein the component A contains 100 parts by weight of vinyl silicone oil, 0-2 parts by weight of hydrogen-contained silicon oil, 200-400 parts by weight of filler, 0.1-0.5 part by weight of inhibitor and 4-6 parts by weight of thickening agent; the component B contains 10-40 parts by weight of plasticizer and 0.3-0.8 part by weight of platinum catalyst; and the mass ratio of the component A to the component B is (8-12):(0.8-1.2). The pouring sealant disclosed by the invention has excellent heat conductivity, flowability and adhesive property. The thickening agent can be used as a main crosslinking agent for addition reaction and can be compounded with the hydrogen-contained silicon oil to realize curing reaction, so that the adhesive property of the pouring sealant to a base material can be improved, the steam is effectively prevented from permeating into electronic devices, a power source of a street lamp, a transformer and the like cannot be influenced by snowy and rainy weathers when working outdoors, and the reliability of equipment is improved.

Description

technical field [0001] The invention specifically relates to an addition-type two-component heat-conducting potting glue and a preparation method of the potting glue, belonging to the technical field of polymer materials. Background technique [0002] In today's world, science and technology are changing with each passing day, and human society has entered the era of electronic information. With the improvement of market requirements for electronic technology and people's in-depth research, electronic components and logic circuits tend to be denser and miniaturized, thus putting forward higher requirements for the stability of electrical appliances. In the electronics industry, packaging is one of the necessary processes for electronic components. Packaging is the operation process of rationally arranging, assembling, bonding, connecting, isolating and protecting the various components that constitute electronic devices or integrated circuits according to the specified requi...

Claims

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Application Information

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IPC IPC(8): C09J183/07C09J183/05C09J11/04C09J11/06
Inventor 张德恒张燕红杨潇珂安静孟婷张燕青王晓红陆瑜翀杨晓菲张敬轩许艳艳张焕焕杨玉宁张荣荣董鹏飞杨秀丽段珊陈继芳
Owner ZHENGZHOU ZHONGYUAN SILANDE HIGH TECH CO LTD
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