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Ultra-thin diamond saw blade made of rare-earth modified tungsten-base binding agent and manufacturing method of ultra-thin diamond saw blade

A tungsten-based binder and rare-earth modification technology, which is applied in the field of rare-earth-modified tungsten-based binder diamond ultra-thin saw blades and its manufacturing field, can solve the problems of diamond particle graphitization, narrow application range, and high sintering temperature. Stable diameter, good effect and high hardness

Active Publication Date: 2014-11-19
南安华大石材产业技术研究院
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the melting point of tungsten is as high as 3940°C. The temperature required for sintering with tungsten as a metal bond far exceeds the ability of diamond, which is likely to cause graphitization of diamond particles. Therefore, most of the sintering temperatures are relatively low at present. Tungsten carbide-based binder, pure metal tungsten-based binder has not been reported
However, on the one hand, tungsten carbide-based binders have formed carbides on the tungsten element itself, which weakens the effect of chemical metallurgical bonding with diamond; Diamond with better thermal performance is used together, the cost is higher, and the application range is narrow

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] 1) Preparation of rare earth modified tungsten-based binder: based on the total mass of the rare earth modified tungsten-based binder, it contains the following components: 75% tungsten, 5% nickel, 4% iron, 8% tin, 7% copper, manganese 0.5%, lanthanum oxide 0.5%, the above components are fully mixed and ground uniformly by high-energy ball mill; the artificial single crystal diamond powder with a particle size of W40 is fully mixed with the above-mentioned rare earth modified tungsten-based binder according to the diamond concentration of 100%;

[0025] 2) According to the different geometric shapes of diamond ultra-thin saw blades, use the corresponding mold to cold-press the above mixture, then carry out vacuum hot-press sintering, the sintering temperature is 950°C, the sintering pressure is 100KN, and the sintering time is 30 minutes;

[0026] 3) After vacuum hot-pressing sintering, carry out hot isostatic pressing sintering at a sintering temperature of 850°C, a sin...

Embodiment 2

[0029] 1) Preparation of rare earth modified tungsten-based binder: based on the total mass of the rare earth modified tungsten-based binder, it contains the following components: 70% tungsten, 5% nickel, 4% iron, 11% tin, 9% copper, manganese 0.5%, lanthanum oxide 0.5%, the above components are fully mixed and ground uniformly by high-energy ball mill; the artificial single crystal diamond powder with a particle size of W40 is fully mixed with the above-mentioned rare earth modified tungsten-based binder according to the diamond concentration of 100%;

[0030] 2) According to the different geometric shapes of diamond ultra-thin saw blades, use the corresponding mold to cold-press the above mixture, then carry out vacuum hot-press sintering, the sintering temperature is 950°C, the sintering pressure is 100KN, and the sintering time is 30 minutes;

[0031] 3) After vacuum hot-pressing sintering, carry out hot isostatic pressing sintering at a sintering temperature of 850°C, a si...

Embodiment 3

[0034] 1) Preparation of rare earth modified tungsten-based binder: based on the total mass of the rare earth modified tungsten-based binder, it contains the following components: tungsten 60%, nickel 5%, iron 4%, tin 17%, copper 13%, manganese 0.5%, lanthanum oxide 0.5%, the above components are fully mixed and ground uniformly by high-energy ball mill; the artificial single crystal diamond powder with a particle size of W40 is fully mixed with the above-mentioned rare earth modified tungsten-based binder according to the diamond concentration of 100%;

[0035] 2) According to the different geometric shapes of diamond ultra-thin saw blades, use the corresponding mold to cold-press the above mixture, then carry out vacuum hot-press sintering, the sintering temperature is 950°C, the sintering pressure is 100KN, and the sintering time is 30 minutes;

[0036] 3) After vacuum hot-pressing sintering, carry out hot isostatic pressing sintering at a sintering temperature of 850°C, a s...

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Abstract

The invention discloses an ultra-thin diamond saw blade made of a rare-earth modified tungsten-base binding agent and a manufacturing method of the ultra-thin diamond saw blade. The method includes: fully mixing diamond powder and the rare-earth modified tungsten-base binding agent; subjecting the mixture to cold press molding, and then performing vacuum hot-pressing sintering at the temperature of 900-960 DEG C under the force of 90-200KN for 25-35 minutes; then performing hot isostatic pressing sintering at the temperature of 840-900 DEG C under the pressure of 80-120 Mpa for 5-10 minutes to obtain a crude product of the ultra-thin diamond saw blade; finishing the crude product of the ultra-thin diamond saw blade to obtain a finished product of the ultra-thin diamond saw blade. The rare-earth modified tungsten-base binding agent comprises 40-75 parts of tungsten, 2-6 parts of nickel, 2-5 parts of ferrum, 8-30 parts of stannum, 7-20 parts of copper, 0.4-1 part of manganese and 0.1-1 part of rare earth elements. Holding force of diamond particles can be enhanced remarkably, abrasion resistance of the ultra-thin diamond saw blade is improved, and accordingly processability is improved while service life of the ultra-thin diamond saw blade is prolonged.

Description

technical field [0001] The invention relates to a rare earth modified tungsten-based binder diamond ultra-thin saw blade and a manufacturing method thereof. Background technique [0002] Diamond ultra-thin saw blade refers to a high-precision diamond saw blade with a thickness of less than 1.0mm. Its cutting slit is narrow, which is conducive to saving precious materials during the cutting process. It is widely used in the cutting of silicon, silicon carbide and other photoelectric materials. Commonly used diamond ultra-thin saw blades include iron-based metal bond diamond ultra-thin saw blades and cobalt-based metal bond diamond ultra-thin saw blades. Iron-based diamond ultra-thin saw blades have high mechanical properties, good wettability to diamond, and low cost, but their self-sharpening is not good; while cobalt-based diamond ultra-thin saw blades have good formability And sinterability, good wettability to diamond, strong adhesion, good toughness, good self-sharpenin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F3/14B22F1/00C22C26/00C22C27/04C22C30/00
Inventor 胡中伟徐西鹏郭桦黄辉姜峰
Owner 南安华大石材产业技术研究院
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