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High-density magnetic sensor device and magnetic induction method and preparation process thereof

A preparation process and magnetic sensing technology, applied in the direction of measuring devices, the size/direction of magnetic field, manufacturing measuring instruments, etc., can solve the problems that the three-axis sensor cannot be manufactured at the same time

Inactive Publication Date: 2014-10-29
QST CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the simultaneous fabrication of three-axis sensors cannot be realized on a single wafer / chip

Method used

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  • High-density magnetic sensor device and magnetic induction method and preparation process thereof
  • High-density magnetic sensor device and magnetic induction method and preparation process thereof
  • High-density magnetic sensor device and magnetic induction method and preparation process thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0115] see Figure 6 , Figure 7 ,in, Figure 7 yes Figure 6 The projection along the A-A direction; the present invention discloses a high-density magnetic sensing device, which includes a Z-axis magnetic sensing component, and the Z-axis magnetic sensing component includes: a substrate 10, a magnetic conduction unit 20, an induction unit ; The substrate 10 may include CMOS peripheral circuits.

[0116] The surface of the substrate 10 has a dielectric layer, and a groove 11 is opened in the dielectric layer. The substrate is provided with one row or several rows of grooves. In this embodiment, one row of grooves includes several sub-grooves 11 .

[0117] The magnetic conduction unit 20 contains a magnetic material layer, such as Figure 6 As shown, the magnetically permeable unit 20 includes a first magnetically permeable part 21 and a second magnetically permeable part 22 respectively arranged on both sides of the groove 11; the main parts of the first magnetically per...

Embodiment 2

[0137] The difference between this embodiment and Embodiment 1 is that in this embodiment, multiple magnetic permeable structures can share the same groove; please refer to Figure 9The grooves 11 on the substrate 10 can be arranged in one or more rows, and one row of grooves 11 can be arranged as a long and narrow groove for shared use by multiple magnetic components.

Embodiment 3

[0139] The difference between this embodiment and Embodiment 1 is that in this embodiment, the Z-axis magnetic sensing component can be summarized as the third direction magnetic sensing component; the third direction magnetic sensing component includes at least a pair of A matched magnetic sensing module, the magnetic sensing module includes the magnetic conduction unit and the sensing unit; the third direction may be the Z-axis direction (vertical direction). After each pair of matching two magnetic sensing modules is set up, it can directly cancel the magnetic field signals of each pair of magnetic sensing modules in the first direction (such as the X-axis direction) or / and the second direction (such as the Y-axis direction) output.

[0140] The main parts of the first magnetically permeable part and the second magnetically permeable part of the magnetically permeable unit are arranged in a row of grooves; a row of grooves is composed of a long groove, or a row of grooves i...

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Abstract

The invention discloses a high-density magnetic sensor device and a magnetic induction method and preparation process thereof. The high-density magnetic sensor device comprises a third direction magnetic sensing member. The third direction magnetic sensing member includes a base, a magnetic permeable unit, induction units and a peripheral circuit. The surface of the base is provided with a trench; the magnetic permeable unit comprises a first magnetic permeable portion and a second magnetic permeable portion which are disposed respectively at two sides of the trench; the induction units are disposed on the surface of the base and at the two sides of the trench, and respectively match the first magnetic permeable portion and the second magnetic permeable portion in the trench; and the induction units are used for receiving magnetic signals in the third direction outputted by the magnetic permeable unit, and measuring the magnetic field strength and direction corresponding to the third direction based on the magnetic signals. According to the invention, the induction devices in the X-axis, Y-axis and Z-axis can be disposed on the same wafer or chip, and the invention has the advantages of good manufacturability, excellent performance and significant price competitiveness; and the unit area of elements can be reduced, and the utilization rate of the chip area is improved.

Description

technical field [0001] The present invention belongs to the technical field of semiconductors, and relates to a magnetic sensing device, in particular to a single-chip three-axis magnetic sensing device, and the present invention also relates to a magnetic sensing design method for the high-density magnetic sensing device; meanwhile, the present invention It further relates to the preparation process of the above-mentioned high-density magnetic sensing device. Background technique [0002] According to its principle, magnetic sensors can be divided into the following categories: Hall elements, magneto-sensitive diodes, anisotropic magnetoresistance elements (AMR), tunnel junction magnetoresistance (TMR) elements and giant magnetoresistance (GMR) elements, induction coils , superconducting quantum interference magnetometer, etc. [0003] Electronic compass is one of the important application fields of magnetic sensors. With the rapid development of consumer electronics in re...

Claims

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Application Information

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IPC IPC(8): G01R33/02G01R3/00
Inventor 张挺万虹
Owner QST CORP
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