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Adhesive thin film, cutting/chip bonding thin film, manufacturing method for semiconductor device and semiconductor device

A chip bonding film and adhesive film technology, which is applied in the direction of film/sheet adhesive, semiconductor/solid device manufacturing, semiconductor device, etc., can solve the problem of paste adhesive coating amount, coating shape deviation, and difficulty in uniformity Solve problems such as long time, achieve the effect of improving the yield, good production efficiency, and preventing the decline of communication speed

Inactive Publication Date: 2014-10-29
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the coating amount and coating shape of the paste-like adhesive vary greatly, making it difficult to uniformize or coating requires special equipment and a long time

Method used

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  • Adhesive thin film, cutting/chip bonding thin film, manufacturing method for semiconductor device and semiconductor device
  • Adhesive thin film, cutting/chip bonding thin film, manufacturing method for semiconductor device and semiconductor device
  • Adhesive thin film, cutting/chip bonding thin film, manufacturing method for semiconductor device and semiconductor device

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Experimental program
Comparison scheme
Effect test

no. 1 approach

[0073] In the first embodiment, if figure 1 As shown, a dicing / die-bonding film in which an adhesive film 22 is laminated on a dicing film 5 obtained by laminating an adhesive layer 3 on a base material 4 will be described below as an example. In this embodiment mode, a mode in which the electrical connection between the adherend and the first semiconductor element is realized by wire bonding connection will be described.

[0074]

[0075] The adhesive film 22 contains a thermoplastic resin and a thermosetting resin (described later), and the abundance ratio of the thermoplastic resin is 10% or more and 30% or less. The lower limit of the abundance ratio of the thermoplastic resin is preferably 15% or more. The upper limit of the abundance ratio of the thermoplastic resin is preferably 25% or less. An appropriate viscosity can be imparted to the adhesive film 22 by setting the abundance ratio of the thermoplastic resin within the above range. As a result, the followabilit...

no. 2 approach

[0201] In the first embodiment, the first semiconductor element is fixed on the adherend by an adhesive film, and the electrical connection between the two is realized by wire bonding. However, in the second embodiment, by using The flip-chip connection of the protruding electrodes on the components realizes the fixation and electrical connection between the two. Therefore, the second embodiment differs from the first embodiment only in the fixing method in the first fixing step, and the difference will be mainly described below.

[0202] (First fixed process)

[0203] In this embodiment, in the first fixing step, the first semiconductor element 41 is fixed on the adherend 1 by flip-chip connection (refer to Figure 4A ). The flip-chip connection is so-called face-down mounting in which the circuit surface of the first semiconductor element 41 faces the adherend 1 . A plurality of protruding electrodes 43 such as bumps are provided on the first semiconductor element 41 , an...

Embodiment 1～8 and comparative example 1～4

[0220] (Production of adhesive film)

[0221] Acrylic resin A, acrylic resin B, epoxy resin A, epoxy resin B, phenolic resin, silicon dioxide and a thermosetting catalyst are dissolved in methyl ethyl ketone in the ratio shown in Table 1 to prepare a concentration of 40 to 50% by weight solution of the adhesive composition.

[0222] This adhesive composition was applied to a release-treated film comprising polyethylene terephthalate film having a thickness of 50 μm after silicone release treatment as a release liner, and then dried at 130° C. for 2 minutes , thereby producing adhesive films having thicknesses shown in Table 1 below.

[0223] In addition, the details of the abbreviations and components in Table 1 below are as follows.

[0224] Acrylic resin A: SG-700AS manufactured by Nagase Chemtex Co., Ltd.

[0225] Acrylic resin B: SG-70L manufactured by Nagase ChemTex Co., Ltd.

[0226] Epoxy resin A: KI-3000 manufactured by Tohto Kasei Co., Ltd.

[0227] Epoxy resin B...

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Abstract

The invention relates to an adhesive thin film, a cutting / chip bonding thin film, a manufacturing method for semiconductor device and a semiconductor device. The present invention provides the adhesive thin film which can be used for manufacturing semiconductor devices of high quality in an excellent yield, the cutting / chip bonding thin film, the manufacturing method of semiconductors by using the adhesive thin films and a semiconductor obtained by the manufacturing method. The adhesive thin film is used for imbedding a first semiconductor element fixed on an object to be bonded and fixing a second semiconductor element different from the first semiconductor element onto the object to be bonded, wherein the adhesive thin film comprises thermoplastic resin and thermosetting resin. The thermoplastic resin existence ratio shown in the following formula is larger than 10% and less than 30%. The thermoplastic resin existence ratio (%)={A / (A+B)}*100 (in the formula, A represents weight of the thermoplastic resin and B represents weight of the thermosetting resin).

Description

technical field [0001] The present invention relates to an adhesive film, a dicing / die-bonding film, a method for manufacturing a semiconductor device, and a semiconductor device. Background technique [0002] Conventionally, a silver paste has been used for fixing a semiconductor chip to a substrate or an electrode member in the manufacture of a semiconductor device. The fixing process is performed by applying a paste-like adhesive to a semiconductor chip or a lead frame, mounting the semiconductor chip on a substrate through the paste-like adhesive, and finally curing the paste-like adhesive layer. [0003] However, large variations occur in the coating amount and coating shape of the paste-like adhesive, making it difficult to uniformize or requiring special equipment and a long time for coating. Therefore, a dicing / die-bonding film that provides an adhesive film for fixing a chip required for a mounting process while adhesively holding a semiconductor wafer in a dicing ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/00C09J7/02H01L21/78
CPCH01L24/27H01L24/32H01L24/73H01L24/83H01L24/92H01L2224/16H01L2224/16225H01L2224/16245H01L2224/27002H01L2224/27003H01L2224/32145H01L2224/32225H01L2224/32245H01L2224/45124H01L2224/45144H01L2224/45147H01L2224/48H01L2224/48091H01L2224/48145H01L2224/48227H01L2224/48247H01L2224/73204H01L2224/73265H01L2224/83191H01L2224/92247H01L2225/06506H01L2225/0651H01L2924/00011H01L2924/15747H01L2924/15788H01L2924/181H01L2924/00012H01L2924/00014H01L2924/00H01L2924/01004C09J7/00C09J11/04C09J133/00C09J161/04C09J163/00C09J2203/326
Inventor 宍户雄一郎三隅贞仁大西谦司
Owner NITTO DENKO CORP
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