Combined cutter and separable cutting method of ceramic substrate LED

Abstract

The invention discloses a combined cutter and separable cutting method of a ceramic substrate LED. The combined cutter comprises a main shaft, a main shaft flange, a grinding wheel sheet, a flange gasket, a disk shaped milling sheet, a gasket and a locking device, wherein the main shaft flange, the grinding wheel sheet, the flange gasket, the disk shaped milling sheet, the gasket and the locking device are sequentially arranged on the main shaft; the diameter of the grinding wheel sheet is more than that of the disk shaped milling sheet. The cutting method comprises the following steps: transversely cutting and lengthways cutting an LED sheet through the combined cutter; grinding and processing the ceramic substrate through the grinding wheel sheet during cutting; milling a rubber layer through the disk shaped milling sheet, wherein the grinding wheel sheet and the disk shaped milling sheet work at the same time. According to the method, the cutter of different forms and different processing methods are utilized to separately cut the rubber layer and the ceramic substrate, and thus the cutting efficiency and quality are improved.

Description

technical field [0001] The invention relates to a combined cutter with different diameters and shapes and a method for separately cutting ceramic substrate LEDs based on the combined cutter. Background technique [0002] At present, the calorific value of a single high-power LED device increases significantly with the power. In order to solve the problem of heat dissipation, one of the solutions is to use metal or ceramic substrates. Among them, COB LEDs can use metal substrates or ceramic substrates, while CHIP LEDs Mainly use ceramic substrate. When CHIP LED is produced, it usually produces a large sheet of glue that has been dispensed, and then cuts the sheet, but ceramics are brittle and hard materials, so they can only be cut with a harder diamond wheel, and the cutting method is grinding. [0003] Diamond grinding wheels can be divided into metal-based diamond grinding wheels and resin-based diamond grinding wheels according to different binders. The nature of the sub...

AI Technical Summary

Problems solved by technology

In general, the resin-based diamond grinding wheel has low hardness and good self-sharpening. It is suitable for grinding harder and more brittle materials, and the obtained surface accuracy is higher, but it wears faster; the metal-based diamond grinding wheel is the opposite

However, when glue has been dispensed on the surface of the CHIP LED chip, if the resin-based diamond grinding wheel is used, there will be a situation where the silicone sticks to the knife, so that part of the diamond blade cannot participate in the cutting, which affects the cutting effect of the ceramic. The common cutting problems are The cutting surface is inclined into a trapezoidal surface; at the same time, the cutting force of the grinding process is relatively large, which is easy to pull the gold wire on the chip, and the large cutting force brings large cutting heat, which is easy to burn out the silicone

The use of metal-based diamond grinding wheels can cut silicone smoothly, which can reduce or avoid the situation of silicone sticking to a certain extent, but the hardness of the grinding wheel is high, which intensifies the cracking of the ceramic substrate, forming a large number of cracks, chipping and protrusions, etc.

A single diamond grinding wheel has been difficult to solve the mixed cutting of brittle materials and plastic materials

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