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Carbon nano tube composite copper thick membrane electroconduction slurry and preparation method thereof

A carbon nanotube composite, conductive paste technology, applied in conductive materials dispersed in non-conductive inorganic materials, cable/conductor manufacturing, circuits, etc., can solve higher resistance, copper paste conductivity effects, low oxidation Stability and other issues, to achieve the effect of easy coating, convenient operation and good conductivity

Inactive Publication Date: 2014-09-03
XI'AN POLYTECHNIC UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, copper paste also has some problems, such as low oxidation stability and high resistance after sintering, which affects the conductivity of copper paste, especially electronic paste after low temperature sintering

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0035] The preparation method of above-mentioned conductive paste, comprises the following steps:

[0036] Step 1: Take spherical copper powder with a particle size of 5-15 μm, wash it with dilute hydrochloric acid with a volume concentration of 5-15%, wash it with distilled water, and wash it with ethanol in sequence, then add an antioxidant that is 1.5-2 times the volume of the spherical copper powder and stir evenly. The antioxidant is any one of tributyl phosphate, oleic acid or lactic acid, and it is dried in an ammonia or nitrogen atmosphere at a temperature of 90°C to 100°C for 2 to 3 hours to obtain spherical copper powder coated with antioxidants;

[0037] Step 2: Weigh the raw materials of the conductive phase: according to the mass ratio of (75-98): (0.5-5), weigh the spherical copper powder coated with antioxidant obtained in step 1 and the outer diameter of 2-5nm and the length of 0.5-5nm. 3 μm single-walled carbon nanotubes;

[0038] Weigh CaO-ZnO-B according to...

Embodiment 1

[0053] Step 1: Take the spherical copper powder with a particle size of 5 μm, wash it successively with dilute hydrochloric acid with a volume concentration of 5%, wash it with distilled water, and wash it with absolute ethanol, then add tributyl phosphate whose volume is 1.5 times that of the spherical copper powder, and let it stand After 5 minutes, pour off the upper liquid and dry at 100°C for 2 hours in an ammonia atmosphere to obtain spherical copper powder coated with tributyl phosphate;

[0054] Step 2: Weighing the raw materials of the conductive phase: 75 g of spherical copper powder coated with tributyl phosphate obtained in step 1, 5 g of single-walled carbon nanotubes with a particle diameter of 2 nm and a length of 0.5 μm;

[0055] Weigh CaO-ZnO-B respectively 2 o 3 System low melting point glass raw materials: B 2 o 3 : 45g, CaO: 40g, ZnO: 15g;

[0056] Weigh the raw materials of the organic carrier: 4g of ethyl cellulose, 90g of terpineol, 2.4g of polyether...

Embodiment 2

[0062] Step 1: Take spherical copper powder with a particle size of 10 μm, wash it with dilute hydrochloric acid with a volume concentration of 10%, wash it with distilled water, and wash it with absolute ethanol, then add oleic acid 1.5 times the volume of the spherical copper powder, and let it stand for 5 minutes , pour off the upper liquid and dry at 90°C for 3 hours in a nitrogen atmosphere to obtain spherical copper powder coated with oleic acid;

[0063] Step 2: Weighing the raw materials of the conductive phase: 98 g of spherical copper powder coated with oleic acid obtained in step 1, 0.5 g of single-walled carbon nanotubes with a particle diameter of 4 nm and a length of 2 μm;

[0064] Weigh CaO-ZnO-B respectively 2 o 3 System low melting point glass raw materials: B 2 o 3 : 60g, CaO: 30g, ZnO: 10g;

[0065] Weigh the raw materials of the organic carrier: 7g of ethyl cellulose, 76g of terpineol, 4g of polyether defoamer, 2g of γ-aminopropyltriethoxysilane, 10g of...

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Abstract

The invention discloses carbon nano tube composite copper thick membrane electroconduction slurry. The carbon nano tube composite copper thick membrane electroconduction slurry comprises the following components in percentage by mass: 60%-80% of electroconduction phase, 4%-10% of a glass phase and 15%-30% of an organic carrier. The preparation method comprises the following steps: mixing all the components, heating to 35-40 DEG C, and stirring uniformly, thereby obtaining the carbon nano tube composite copper thick membrane electroconduction slurry. According to the carbon nano tube composite copper thick membrane electroconduction slurry, a carbon nano tube is added in the electroconduction phase in copper slurry; the electroconduction performance of the electroconduction slurry is improved, and the printing thickness is low; lead-free environmental-friendly low-fusing-point glass of a CaO-ZnO-B2O3 system is adopted so as to form electroconduction slurry which is sintered at low temperature and also shows excellent electric performance and adhesive powder; the electroconduction slurry can be effectively applied to electronic devices; the slurry preparation technology is simple, is convenient to operate, is good in electroconduction property, is easy to coat, and is suitable for scale production of enterprises.

Description

technical field [0001] The invention belongs to the technical field of electronic paste, and relates to a carbon nanotube composite copper thick film conductive paste, and also relates to a preparation method of the conductive paste. Background technique [0002] The rapid development of the electronic information industry has promoted the rapid development of the electronic paste industry. The electronic paste integrates metallurgy, chemical industry, and electronic technology. It is a high-tech electronic functional material. alternative status. Silver conductive paste is the most widely used in the electronics industry, and it is also a kind of precious metal powder with the largest amount. It is the basic material for the production of various electronic components. However, with the increase in demand and types of electronic products, the production cost is obviously not dominant, which limits its application field and scope, so base metal electronic pastes emerge in e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B1/24H01B13/00
Inventor 屈银虎蒙青
Owner XI'AN POLYTECHNIC UNIVERSITY
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