Nano-accuracy electrochemical etching processing method

Abstract

The invention discloses a nano-accuracy electrochemical etching processing method which comprises the following steps: immobilizing a layer of redox hydrated gel polymer ultrathin film on the surface of a template electrode or a workpiece; immersing the template electrode and the workpiece into a working solution, and stacking at the bottom of a container, so that the surface of the template electrode and the surface of the workpiece respectively keep natural and close contact with both surfaces of the soft polymer ultrathin film; additionally arranging an auxiliary electrode and a reference electrode in the container, and connecting the auxiliary electrode and the reference electrode with an electrochemical controller; starting the electrochemical controller, and regulating the potentials of the electrodes, wherein groups with electrochemical activity in the electrochemical oxidized ultrathin film are subjected to rapid chemical oxidization to capture electrons from the surface of the workpiece which is in contact with the groups, and the electrons lost from the surface of the workpiece can be transferred to the template electrode by the ultrathin film at a low speed, so that etching can be continuously carried out; and after the etching is ended, shutting off the electrochemical controller, and moving the template electrode away. According to the method disclosed by the invention, a complementary structure of a microstructure pattern on the surface of the template electrode is processed on the surface of the workpiece in an etching manner at nano accuracy.

Description

technical field [0001] The invention relates to an electrochemical nano-processing technology, in particular to a large-area and batch-scale electrochemical etching processing method for the surface of metals, alloys and semiconductors. technical background [0002] Microsystems include microelectronics, micro-electromechanical, micro-optics and micro-opto-electromechanical systems, which are of self-evident importance in many fields of national defense, military affairs and national economy and people's livelihood. In recent years, with the rapid development of various application fields, the requirements for the performance of microsystems are also increasing, and further reducing the feature size of devices in microsystems and improving the surface quality of devices have been recognized by the industry as the key common issues for improving the performance of microsystems . However, as the feature size of devices in microsystems shrinks to submicron and nanometer levels...

AI Technical Summary

Problems solved by technology

However, there are two main problems in further improving the machining accuracy to the nanometer level. One is that the distance and parallelism between the template electrode and the workpiece surface must be able to achieve nanoscale and precision control. A sufficient amount of capture agent can still be supplied in the formed large-area nanogap

Although the above-mentioned problems can be solved together by designing and manufacturing an ultra-high-precision distance control system (CN 101880907), the manufacture of such equipment is difficult and expensive, and the process steps of etching processing also increase accordingly

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