A kind of integrated circuit board metal surface protective agent

A surfactant and metal technology, applied in the direction of metal material coating process, etc., can solve the problems of damage to the protective layer, can not be solved, etc., to prevent deposition, improve production efficiency and product reliability, and the effect of stable protection effect

Active Publication Date: 2016-09-21
SHANGHAI TECHN INST OF ELECTRONICS & INFORMATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, this type of protective agent can only work under alkaline conditions, and the concentration of copper ions in the working environment should not exceed 150mg / L, otherwise the protective layer will be damaged
Moreover, the protective agent cannot solve the production problem of reducing copper ions, nickel ions, silver ions, etc. on the surface of inert metals

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] 4 parts by weight of cetyl mercaptan, 20 parts by weight of β-cyclodextrin, 3 parts by weight of imidazoline oleate and 73 parts by weight of polyethylene glycol octylphenyl ether were mixed. Take 4 g of the mixed solution, add it into 300 g of distilled water, stir and heat to 70°C. The circuit board with the gold-copper connection was immersed in the aqueous solution for 4 minutes, and then the temperature of the aqueous solution was lowered to 35° C., and the immersion was continued for 5 minutes. Place the coated circuit board in air at room temperature for 10 hours to dry, then put the coated circuit board into CuSO 4 / H 2 SO 4 / H 2 o 2 Immerse in etching solution for 150 seconds, where Cu 2+ The concentration is 150g / L, H 2 SO 4 150g / L, H 2 o 2 30g / L. After the above-mentioned processed circuit board was cleaned and dried, the surface was analyzed by an X-ray photoelectron spectrometer, and copper ions did not remain on the gold surface.

Embodiment 2

[0021] 4 parts by weight of cetyl mercaptan, 20 parts by weight of β-cyclodextrin, 3 parts by weight of octadecyl phosphoric acid and 73 parts by weight of polyethylene glycol octylphenyl ether were mixed. Take 4 g of the mixed solution, add it into 300 g of distilled water, stir and heat to 70°C. The circuit board with palladium-copper connection was immersed in the aqueous solution for 4 minutes, and then the temperature of the aqueous solution was lowered to 35° C., and the immersion was continued for 5 minutes. Place the coated circuit board in air at room temperature for 10 hours to dry, then put the coated circuit board into CuSO 4 / H 2 SO 4 / H 2 o 2 Immerse in etching solution for 150 seconds, where Cu 2+ The concentration is 150g / L, H 2 SO 4 150g / L, H 2 o 2 30g / L. After the above-mentioned processed circuit board is cleaned and dried, the surface is analyzed by an X-ray photoelectron spectrometer, and there is no copper ion residue on the palladium surface. ...

Embodiment 3

[0023] Mix 4 parts by weight of octadecyl mercaptan, 20 parts by weight of β-cyclodextrin, and 73 parts by weight of polyethylene glycol octylphenyl ether. Take 4 g of the mixed solution, add it into 300 g of distilled water, stir and heat to 70°C. The circuit board with the gold-copper connection was immersed in the aqueous solution for 4 minutes, and then the temperature of the aqueous solution was lowered to 35° C., and the immersion was continued for 5 minutes. Place the coated circuit board in air at room temperature for 10 hours to dry, then put the coated circuit board into CuSO 4 / H 2 SO4 / H 2 o 2 Immerse in etching solution for 150 seconds, where Cu 2+ The concentration is 180g / L, H 2 SO 4 180g / L, H 2 o 2 30g / L. After the above-mentioned processed circuit board was cleaned and dried, the surface was analyzed by an X-ray photoelectron spectrometer, and copper ions did not remain on the gold surface.

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PUM

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Abstract

The present invention relates to an integrated circuit board metal surface protection agent. More specifically the present invention discloses a composition for protecting the double metal surface or the alloy surface, wherein the composition contains 1 part by weight of a first component, 0-50 parts by weight of a second component, and 0.01-40 parts by weight of a synergist, the first component is selected from a compound having a mercapto functional group, each molecule of the compound has more than 6 carbon atoms, the second component is selected from alkyl phosphoric acid, alkyl phosphate, a derivative of alkyl phosphate, an oleic acid imidazoline compound, a derivative of an oleic acid imidazoline compound, organic silane, fatty acid and a derivative thereof, and the synergist is selected from alpha-cyclodextrin and a derivative thereof, beta-cyclodextrin and a derivative thereof, and gamma-cyclodextrin and a derivative thereof. The composition has the excellent metal surface protection function, and particularly can be used for preventing deposition of one metal onto the other metal due to the Galvanic effect during the integrated circuit board electroplating process.

Description

technical field [0001] The invention relates to a metal surface protective agent. More specifically, it relates to a metal surface protective agent in the production process of integrated circuit boards. Background technique [0002] With the development of the electronics industry, gold, silver, palladium, platinum, nickel, copper, iron and other metals and alloys of these metals are widely used in integrated circuit boards. In the various steps of the current electroplating process of integrated circuit boards, the widespread existence of electrochemical effects (such as the Giavani effect) greatly affects the production stability of circuit boards and the reliability of packaging and use. For example, circuit boards often meet the connection of gold-copper (Au-Cu) pads due to actual requirements during circuit design. In some etching processes, such as the copper removal process, the copper ions formed by etching will be reduced to metallic copper on the gold surface, a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C22/05C23C22/03
CPCC23F11/10
Inventor 刘春连
Owner SHANGHAI TECHN INST OF ELECTRONICS & INFORMATION
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