A kind of micro drill bit and processing method thereof

Abstract

The invention discloses a micro drill bit and a processing method thereof, comprising: a first rake face, a first flank face, a second rake face and a second flank face arranged at the position of the drill tip; The first helical groove extending in the direction and the second helical groove symmetrically arranged with the first helical groove, the first helical groove intersects with the first rake face to form a first cutting edge, the second helical groove Intersecting the second rake face to form a second cutting edge; and an offset groove disposed at the position of the large head region of the drill bit, the offset groove intersecting the second rake face such that the second cutting edge The length of the offset groove is less than the length of the first cutting edge, and the offset groove intersects the second helical groove. In the present invention, since the offset groove is set in the drilling position area of ​​the drill bit, the dust suction device can quickly absorb the air in the area of ​​the second helical groove drill tip, thereby improving the heat dissipation efficiency. At the same time, the offset groove also forms a heat dissipation surface to improve the heat exchange efficiency between the drill tip and the air.

Description

technical field [0001] The invention relates to the field of micro-tools, more specifically, to a micro-drill and a processing method thereof. Background technique [0002] Microholes are one of the important components of PCB. Microholes after electroplating play a supporting role in electrical interconnection and components in PCB. Microholes can be divided into two categories: through holes and blind holes (buried holes can be seen into a through hole). Blind holes mainly exist in HDI boards, and through holes mainly exist in single / double-sided boards, multi-layer boards, flexible boards and packaging substrates. In recent years, packaging substrates have outstanding advantages such as realizing multi-pins, reducing the area of ​​packaged products, improving electrical performance and heat dissipation, and achieving high density. The rapid development of FC packaging substrates is a distinctive feature. High-level MCM (multi-chip package) and SIP (system package) CSP p...

AI Technical Summary

Problems solved by technology

[0004] 1) Due to poor dust removal and excessive heating of the drill tip, the tool breaks

2) Poor hole position accuracy

[0006] The above design brings two problems: 1) The helical groove is non-symmetrical with respect to the rotation center, and the center of mass of the drill tip is too far away from the axis. 2) The length of the second helical groove is shorter than that of the first helical groove, and it is a blind groove. Chips are easy to accumulate in the blind groove, causing dry friction and heat with the hole wall. While the first helical groove undertakes excessive chip removal, the drilling machine The space for the vacuum cleaner to suck the air in the groove is further reduced, which affects the heat dissipation of the drill tip

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