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IC power supply chip

A power chip, circuit chip technology, applied in circuits, electrical components, electrical solid devices, etc., to achieve the effects of simple production process, small size and low cost

Inactive Publication Date: 2014-04-16
福州市长乐区芯聚电子科技研究所 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This involves issues in circuit topology, layout design, manufacturing process, packaging process, and chip power consumption.

Method used

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Examples

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Embodiment Construction

[0046] refer to figure 1 , figure 2 , image 3 , Figure 4 , Figure 5 An IC power supply chip, comprising: a ceramic carrier 7, a power supply AC-DC converter chip 8, a constant voltage constant current circuit chip 2, connectors, etc. covered up and down (6) packaging; it is characterized in that: aluminum oxide or ferrite The functional wiring structure is realized on the ceramic carrier 7 such as body, and the electrode pad 4 is formed on the periphery of the wiring structure to complete. The electrode pad 4 is provided with silver paste or solder film; the power supply AC-DC converter chip 8 is provided with a A redundant circuit of at least one fuse 801 and at least one rectifier 802; constant voltage constant current circuit chip 2 includes a redundant circuit provided with at least one charge pump 202, voltage and current detection 201, PWM microcontroller 203; power supply AC— The DC converter chip 8 is provided with a stack of quantum wells and barrier layers fo...

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Abstract

The invention relates to an IC power supply chip, in particular to a power supply management chip which is high in cost performance and integration, enables a periphery circuit to be simple and has an optimum performance index. Additionally, the invention aims to provide a covering packaging material and process. According to the technical scheme and product novel innovation design application, a wafer extremely high in thermal conductivity is subject to optimization, the wafer material type is changed by means of extension, oxidation, doping (diffusion), photoetching and deposition and the like to finish the high-integration IC power supply chip which is subject to power supply integrated circuit coverage packaging. The IC power supply chip is high in cost performance and integration, enables the periphery circuit to be simple, is high in power supply quality factor, small in size, light in weight, high in control precision, good in rapidity and simple and compact in structure, enables power supply output to be matched with a reactive capacitor and provides the optimum performance index. The IC power supply chip is subject to special covering packaging, safety in chip use is guaranteed, and the IC power supply chip is simple in production process, low in cost, wide in application prospect, high in popularization and application value and good in market prospect.

Description

technical field [0001] The present invention relates to an IC power supply chip, which is a power management chip with high cost performance, high integration, simple peripheral circuits, and best performance indicators. Another object of the present invention is to provide a covering packaging material and process. Background technique [0002] The power supply is the heart of electronic equipment, and its quality directly affects the reliability of electronic equipment. With the continuous development of electronic technology, the requirements for power consumption, volume and conversion efficiency continue to increase. Since the 1960s, the use of ion implantation technology has greatly promoted the rapid development of integrated circuits, which has brought rapid development of science and technology. Integrated circuits are "stacked layer by layer", which is composed of various materials layered together like building blocks. Epitaxy, oxidation, doping (diffusion), photo...

Claims

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Application Information

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IPC IPC(8): H01L23/488H01L23/31H01L25/18H02M7/00
CPCH01L2924/181H01L2924/00012
Inventor 陈胤辉
Owner 福州市长乐区芯聚电子科技研究所
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