Halogen-free epoxy resin composition and application thereof

Abstract

The invention discloses a halogen-free epoxy resin composition, and a prepreg and copper foil clad laminated board prepared from the same. The epoxy resin composition comprises the following components: (A) halogen-free epoxy resin; (B) styrene-maleic anhydride copolymer (SMA) used as a first curing agent; and (C) phosphorus-containing compound used as a second curing agent. The prepreg and copper foil clad laminated board prepared from the halogen-free epoxy resin composition have the advantages of favorable dielectric properties, favorable processability, simple technological operation and favorable moisture and heat resistance.

Description

technical field [0001] The invention relates to a halogen-free epoxy resin composition and its application, in particular to a halogen-free epoxy resin composition and resin glue, prepreg, laminate and copper-clad laminate prepared by using the halogen-free epoxy resin composition. Background technique [0002] Traditional copper-clad laminates for printed circuits mainly use brominated epoxy resin, and bromine is used to realize the flame-retardant function of the board. However, in recent years, carcinogens such as dioxin and dibenzofuran have been detected in the combustion products of electronic and electrical equipment wastes containing halogens such as bromine and chlorine, and highly toxic substances may be released during the combustion process of halogen-containing products hydrogen halide. On July 1, 2006, the EU's two environmental protection directives "Regarding Waste Electrical and Electronic Equipment" and "Restricting the Use of Certain Hazardous Substances ...

AI Technical Summary

Problems solved by technology

[0003] After several years of development, at present, there are two main technical approaches to realize the halogen-free flame retardant of copper-clad laminates. The first approach uses phosphorus-containing epoxy resin as the main resin, and then uses dicyandiamide or phenolic resin as the main resin. Curing agent, add a certain amount of inorganic fillers such as aluminum hydroxide, use dicyandiamide as the curing agent for phosphorus-containing epoxy resin, the board has poor heat resistance and high water absorption; use phenolic resin as the curing agent for phosphorus-containing epoxy resin , the appearance of the prepreg is poor, the brittleness of the sheet is large, and the processability is poor

The second way is to use benzoxazine resin as the main resin, add an appropriate amount of phosphorus-containing epoxy resin or phosphorus-containing, nitrogen-containing curing agent, and then add an appropriate amount of organic or inorganic fillers. The benzoxazine resin has good Heat resistance and low water absorption, but high brittleness and poor processing performance of the plate

[0007] US6509414 uses styrene maleic anhydride as the curing agent, and selects tetrabromobisphenol A (TBBPA), tetrabromobisphenol A diglycidyl ether (TBBPADGE) as the second curing agent to cure thermosetting resins such as epoxy resin, with Good moisture and heat resistance, high glass transition temperature, however, because the co-crosslinking agent uses bromine as a flame retardant, the whole system is a halogen-containing system, which has been unable to meet the current growing demand for halogen-free

[0008] WO03 / 048251 uses styrene maleic anhydride as a curing agent, combined with bismaleimide resin and an appropriate amount of epoxy, to achieve a high glass transition temperature and good electrical properties. However, the entire system still uses bromine flame retardant flame retardant

[0009] CN200910189765.3 adopts styrene maleic anhydride as the curing agent, selects benzoxazine as the second curing agent, and matches an appropriate amount of epoxy and a certain amount of phosphorus-containing flame retardant to realize the halogen-free copper clad laminate. It has good dielectric properties. However, due to the inherent brittleness of benzoxazine, it will cause severe wear to the drill bit, difficult processing, and unstable heat and humidity resistance.

[0010] CN201010184744.5 uses styrene maleic anhydride as a curing agent, and a certain amount of halogen-free epoxy resin and polymethyl phosphate 1,3-phenylene ester as a flame retardant to achieve better dielectric properties and at the same time Halogenation-free, however, due to the characteristics of styrene maleic anhydride as a single curing agent, its resistance to heat and humidity is poor

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