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Preparation method of embedded printed structural parts

A structural part and embedded technology, which is applied in the field of preparation of embedded printed structural parts, can solve the problems of occupying the space of the chassis, many heat dissipation links, and increasing the weight of the whole machine, so as to avoid the influence of high temperature and achieve good adsorption Effect

Active Publication Date: 2014-04-02
NO 771 INST OF NO 9 RES INST CHINA AEROSPACE SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

After testing, although the above measures have a heat dissipation effect, there are thermal resistance in many places, many heat dissipation links, occupying space in the chassis, small heat dissipation area, and increased weight of the whole machine. The heat dissipation effect of power devices or power control circuit boards is not good.

Method used

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  • Preparation method of embedded printed structural parts
  • Preparation method of embedded printed structural parts
  • Preparation method of embedded printed structural parts

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preparation example Construction

[0038] The preparation method of the embedded printed structure provided by the present invention includes the following operations:

[0039] 1) Take one side of the chassis cover as the reference plane, and determine the fixed position and the frame of the circuit graphic on the reference plane according to the circuit graphic film;

[0040] 2) After leveling the reference plane, insulate the surface of the chassis cover to form a heat dissipation insulation layer on the surface; coat the heat conduction insulation layer on the heat dissipation insulation layer of the reference plane;

[0041] 3) Load copper foil on the thermal insulation layer, and make circuit graphics on the surface of copper foil;

[0042] 4) Cover the protective layer after the circuit graphics are made, and process the chassis cover into shape;

[0043] 5) Carry out surface protection treatment on the exposed surface of the chassis cover, and coat thermal control material on the exposed surface.

[00...

Embodiment 1

[0059] see Figure 2 ~ Figure 6 , a method for preparing a chimeric printed structure, comprising the following operations:

[0060] 1) Take one side of the chassis cover as the reference plane, and determine the fixed position and the frame of the circuit graphic on the reference plane according to the circuit graphic film;

[0061] Specifically, the blanking size is determined according to the drawing size and structure of the aluminum cover plate of the chassis, and the reference plane is determined after the six surfaces are exposed to light after rough machining; the frame lines around the film, the circuit graphic edges and the positioning points are set according to the length and width of the aluminum plate; Alignment during the production of printed circuit graphics to ensure the structural size of the printed graphics and the cover plate;

[0062] According to the size of the aluminum plate and the size of the positioning point, use CNC to drill holes; then use a be...

Embodiment 2

[0074] see Figure 2 ~ Figure 6 , a method for preparing a chimeric printed structure, comprising the following operations:

[0075] 1) Take one side of the chassis cover as the reference plane, and determine the fixed position and the frame of the circuit graphic on the reference plane according to the circuit graphic film;

[0076] Specifically, the aluminum cover plate of the chassis is cut, and the size is 5mm-10mm larger than the length and width of the drawing size; the thickness is 6mm-8mm larger than the drawing size; use a planer to plan the two sides until the thickness is 0.5-0.8mm larger than the drawing requirement, and use a milling machine to mill Measure the length and width from all around to the smooth surface, and record them to determine the reference plane;

[0077] For light-painted printed circuit graphics negatives, set ∮2~∮3mm positioning points at the four corners, and set surrounding frame lines according to the length and width of the aluminum plat...

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Abstract

The invention discloses a preparation method of embedded printed structural parts. The method comprises the following steps: taking one surface of a case cover plate as a reference surface, confirming frames of a fixing position and a circuit pattern on the reference surface according to a circuit pattern negative plate, leveling the reference surface, then performing insulating treatment on the surface of the case cover plate, forming a heat dissipation insulating layer on the surface of the case cover plate, coating a heat conduction insulating layer on the heat dissipation insulating layer of the reference surface, loading copper foils on the heat conduction insulating layer, manufacturing a circuit pattern on surfaces of the copper foils, then coating a protection layer on the circuit pattern on the surfaces, performing shape processing on the case cover plate, performing surface protection treatment on an exposed surface of the case cover plate, and coating thermal control material on the exposed surface. Heat emitted by the high-power elements connected with a printed circuit is directly conducted to the case cover plate, and then is radiated to external environment through the case cover plate, heat is rapidly emitted to external space, other devices in a case are prevented from being affected by high temperature, and the method provides guarantee for the stable and reliable operation of a complete machine.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation of power electronic products, and relates to a preparation method of an embedded printed structural part. Background technique [0002] The increasing miniaturization of electronic products and the application of high-density assembly technology put forward higher requirements on the heat dissipation effect of products, especially the demand for heat dissipation of power electronic products is more urgent. As the main component of electronic products, the printed board plays a role of support and conduction. The power devices and wires carried on it will generate a lot of heat when they work. In order to ensure the stable operation of devices and products, avoid the local heat accumulation. If the consequences are serious, the printed board must be designed for effective heat dissipation, so that the heat generated by the circuit can be quickly discharged to ensure the safety, service lif...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
Inventor 杨胜利
Owner NO 771 INST OF NO 9 RES INST CHINA AEROSPACE SCI & TECH
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