High intensity temperature change-resistant crimping diode
A technology of diodes and Schottky diodes, which is applied in the field of crimping diodes and can solve problems such as plastic deformation of solder
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[0020] The inventors have recognized that when making crimped diodes, as in image 3 As can be seen in , the solder layer 5 is squeezed through the insulating layer 10 . this is in Figure 4 shown in the Figure 4 It can be seen that the flux layer 5 has overlapped the insulating layer 10 by a distance (C-D) after the soldering process, where C is the creep distance of the flux without overlapping and D is the The creeping distance of the flux in the case of connection. As a result of the overlap, a reduction of the creeping path occurs, by which reduction the temperature resistance of known crimp diodes is reduced.
[0021] The overlapping of the solder layer 5 on the insulating layer 10 can be traced to various causes. Among the causes are, for example, the pressure exerted on the top wire during soldering, deviations during the soldering process (Streuungen), the base 1 or the top wire 6 (cf. figure 1 ) of the surface quality fluctuations. Furthermore, there is the po...
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