Palladium/titanium dioxide/silicon dioxide/silicon heterojunction-based hydrogen detector
A technology of titanium dioxide and silicon dioxide is applied in the field of hydrogen detectors to achieve the effects of low energy consumption, high sensitivity and simple process
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Embodiment 1
[0028] Titanium dioxide sputtering targets were obtained by cold pressing titanium dioxide powder with a purity (mass fraction) of 99.99%. We selected a monocrystalline silicon wafer with a thickness of 0.5 mm as the substrate, and retained its natural oxide layer. Clean the silicon wafer with ethanol and acetone in ultrasonic wave for 5 minutes, and clean the silicon wafer with deionized water for 1 minute.
[0029] Titanium dioxide film was prepared by radio frequency magnetron sputtering: put the cleaned silicon substrate into the sputtering chamber, and turn on the vacuum system for vacuuming; when the background vacuum was 2×10 -4 When the pressure is Pa, argon / oxygen mixed gas is introduced, the ratio of the two gases is between 2:1 and 1:2, and a pressure of 5 Pa is maintained. After the pressure is stable, start sputtering with a titanium dioxide target, and the RF sputtering power The sputtering time is 90 watts, the sputtering time is 30 seconds, and the sputtering ...
Embodiment 2
[0034] Titanium dioxide sputtering targets were obtained by cold pressing titanium dioxide powder with a purity (mass fraction) of 99.99%. We selected a monocrystalline silicon wafer with a thickness of 0.5 mm as the substrate, and retained its natural oxide layer. Clean the silicon wafer with ethanol and acetone in ultrasonic wave for 5 minutes, and clean the silicon wafer with deionized water for 1 minute.
[0035] Titanium dioxide film was prepared by radio frequency magnetron sputtering: put the cleaned silicon substrate into the sputtering chamber, and turn on the vacuum system for vacuuming; when the background vacuum was 2×10 -4 When the pressure is Pa, argon / oxygen mixed gas is introduced, the ratio of the two gases is between 2:1 and 1:2, and a pressure of 5 Pa is maintained. After the pressure is stable, start sputtering with a titanium dioxide target, and the RF sputtering power The sputtering time is 90 watts, the sputtering time is 60 seconds, and the sputtering ...
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