Anti-aging heat radiation paint for LED lamp and preparation method thereof

Abstract

The invention provides an anti-aging heat radiation paint for an LED lamp, wherein the paint is prepared by the raw materials by weight: 25-28 parts of aniline presence of formaldehyde resin, 20-25 parts of E-12 epoxy resin, 6-8 parts of 2-methyl methacrylate, 3-4 parts of tetraethylenepentamine, 15-18 parts of aluminum nitride powder, 1-2 parts of graphite alkene, 1-2 parts of carbon nanotube, 4-5 parts of titanium dioxide, 1-2 parts of barium sulfate, 2-3 parts of zinc oxide, 4-5 parts of glycol, 2-3 parts of silane coupling agent KH-550, 10-12 parts of phthalate, 1-2 parts of chromic oxide(Cr_2O_3), 12-14 parts of ethyl acetate, 8-10 parts of xylene, and 4-5 parts of film-forming auxiliary agent. Aluminum nitride powder is added to make the paint have advantages of high heat conductive rate and good heat radiation effect; titanium dioxide is added to make the paint have excellent anti-aging effect; under daylight irradiation, the paint has advantages of sunlight resistance, no cracking, no color change, and acid and alkali resistance; graphite alkene and carbon nanotube are added to make the paint have advantages of easy construction, greatly enhance the heat conduction effect of the paint, and improve the pot-opening effect of the paint.

Description

technical field [0001] The invention belongs to the technical field of coatings, and relates to a heat dissipation coating, more specifically, an anti-aging heat dissipation coating for LED lamps and a preparation method thereof. Background technique [0002] As LED technology has received widespread attention as a new generation of lighting technology in recent years, the power of LED has increased, and the heat dissipation problem has also attracted more and more attention. At present, most of the heat-conducting adhesives are used to solve the heat dissipation problem of LED lamps, but the materials used have technical problems such as poor temperature resistance and aging resistance, low adhesion to the substrate, poor heat dissipation effect and inconvenient operation, which are difficult to meet people's expectations. LED lamp heat dissipation requirements. Some manufacturers also start to select materials with higher thermal conductivity, but this will increase the p...

AI Technical Summary

Problems solved by technology

At present, most of the heat-conducting adhesives are used to solve the heat dissipation problem of LED lamps, but the materials used have technical problems such as poor temperature resistance and aging resistance, low adhesion to the substrate, poor heat dissipation effect and inconvenient operation, which are difficult to meet people's expectations. Requirements for heat dissipation of LED lamps

Some manufacturers are also starting to use materials with higher thermal conductivity, but this will increase the production cost of LEDs