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Epoxy resin adhesive used for encapsulating smart cards

A technology of epoxy resin and adhesive, which is applied in the direction of epoxy resin glue, novolak epoxy resin adhesive, adhesive, etc., which can solve the problem of low wire bonding yield, too thin adhesive layer, and module thickness not meeting the requirements and other issues, to achieve the effect of improving the wire bonding yield and efficiency, reducing the height difference of the four corners, and improving the wire bonding yield

Active Publication Date: 2014-01-29
CHANGCHUN YONGGU TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the smart card chip packaging adhesives on the market have serious resin overflow on the flexible carrier tape of the smart card, and the overflow area covers the wiring position, which often results in low wiring yield and seriously affects the reliability of the plastic-encapsulated product. The smart card module requires controlling the thickness of the overall module to ensure the thin card body requirements of the smart card, and the adhesive in the prior art usually has a phenomenon that the adhesive layer is too thin or too thick after the patch, resulting in the thickness of the overall module reaching less than required

Method used

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  • Epoxy resin adhesive used for encapsulating smart cards
  • Epoxy resin adhesive used for encapsulating smart cards
  • Epoxy resin adhesive used for encapsulating smart cards

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] The formula is:

[0026]

[0027] Preparation method: mix bisphenol A epoxy resin, 92% 1,4-butanediol diglycidyl ether, dicyandiamide, 2-methylimidazole, aminopropyltriethoxysilane and silane surfactant according to dosage Mix evenly, mix twice through a three-roller machine, then add silicon micropowder, stir evenly, then mix both sides through a three-roller machine, then add glass microspheres, stir for half an hour, and vacuum defoam for 30 minutes to obtain the non-conductive epoxy resin adhesive.

[0028] Take 0.5ml adhesive to test its viscosity: 25°C viscosity is 10000Cp; thixotropic index is 5.2; 150°C 3min glue can be cured; 2*2mm chip, Ag / Cu frame can withstand horizontal shear force of more than 15kg at 25°C; curing The resin overflow measurement before is 0, and the resin overflow is 0 after curing; the thickness of the adhesive layer is 10-15 microns, and the height difference of the four corners is up to 6um. Obviously, the performance of the epoxy r...

Embodiment 2

[0030] The formula is:

[0031]

[0032] Preparation method: mix bisphenol F epoxy resin, 92% 1,4-butanediol diglycidyl ether, polyetheramine, 2-ethylimidazole, propyltrimethoxysilane and silane surfactant according to dosage Evenly, mix twice through a three-roll machine, then add polytetrafluoroethylene micropowder, stir evenly, then mix both sides through a three-roll machine, then add glass microspheres, stir for half an hour, and vacuum defoam for 30 minutes to obtain the present invention Non-conductive epoxy adhesive.

[0033] Take 0.5ml adhesive to test its viscosity: the viscosity is 12000Cp at 25°C; the thixotropic index is 5.5; the glue can be cured in 3 minutes at 150°C; the 2*2mm chip, the Ag / Cu frame can withstand a horizontal shear force of more than 15kg at 25°C; curing The resin overflow measurement before is 0, and the resin overflow is 0 after curing; the thickness of the adhesive layer is 15-20 microns, and the maximum height difference of the four corn...

Embodiment 3

[0035] The formula is:

[0036]

[0037]

[0038] Preparation method: Bisphenol A epoxy resin, novolac epoxy resin, 92% 1,4-butanediol diglycidyl ether, polyether amine, 2-ethyl-4-methylimidazole, bis( Mix triethoxysilylpropyl) polysulfide and fluorine-containing surfactant evenly, mix twice through a three-roll machine, then add fumed silica, stir evenly, mix twice through a three-roll machine, and then add The glass beads were stirred for half an hour, and vacuum defoamed for 30 minutes to obtain the non-conductive epoxy resin adhesive of the present invention.

[0039]Take 0.5ml adhesive to test its viscosity: the viscosity is 11000Cp at 25°C; the thixotropic index is 6.0; the glue can be cured in 3 minutes at 150°C; the 2*2mm chip, the Ag / Cu frame can withstand a horizontal shear force of more than 20kg at 25°C; curing The resin overflow measurement before is 0, and the resin overflow after curing is 0; the thickness of the adhesive layer is 20-25 microns, and the h...

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Abstract

The invention discloses an epoxy resin adhesive used for encapsulating smart cards. The epoxy resin adhesive is non-conductive adhesive and conductive adhesive and comprises the following components in percentage by weight: 20-40% of epoxy resin, 5-20% of diluent, 4-8% of amine curing agent, 4-8% of curing accelerator, 0.1-1% of coupling agent, 0.1-1% of surfactant, 1-5% of glass microspheres and 20-40% of fillers. The epoxy resin adhesive is prepared in a special preparation sequence. The surfactant is added to effectively inhibit the resin overflow, improve the routing yield and ensure the reliability of the product at the same time, the glass microspheres are added to effectively control the thickness of the adhesive layer, prevent the adhesive layer from becoming excessive thin or thick after being pasted, ensure the reliability of the encapsulated product, and meanwhile, reduce the height difference of four corners and improve the routing yield and efficiency.

Description

technical field [0001] The invention relates to an epoxy resin adhesive used for smart card packaging, in particular to an adhesive used for bonding a smart card chip to a flexible base frame or a carrier tape. Background technique [0002] The use of smart cards has become an important part of the world's banking, transportation, and mobile communication access industries. In daily life, the smart cards we usually see are calling cards and micro SIM cards in mobile phones. Of course, as we all know, smart cards still have many widespread applications, and their development prospects are very broad. Global economic integration and the sustainable development of my country's national economy will make my country the world's largest smart card application market. Domestic smart cards have good development prospects, especially the demand for lower cost, high reliability, flexibility, and thin card body is very obvious. [0003] At present, the smart card chip packaging adhe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/02C09J163/04C09J11/06C09J11/04C09J11/08C09J9/02
Inventor 刘姝王群郑岩王政孙莉李中亮
Owner CHANGCHUN YONGGU TECH
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