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Preparation and application of polyisocyanurate modified phenol formaldehyde foam plastic

A technology of polyisocyanurate and phenolic foam, which is applied in the field of polyisocyanurate modified phenolic foam, can solve the problems of low density and difficult realization of spray molding process, great influence on strength and thermal conductivity, and poor Suitable for problems such as spray molding process, to achieve fast curing time, improve mechanical properties, and save raw materials

Inactive Publication Date: 2014-01-15
新疆三宝盛世新型材料科技股份有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] (1) High brittleness, high porosity, strength and thermal conductivity are greatly affected by density, and it is difficult to reduce the density of products;
[0004] (2) The curing agent used in the foaming process is a strong acid, which may corrode the metal plate;
[0005] (3) It needs heating and foaming, which consumes a lot of energy;
[0006] (4) Not suitable for spray molding process
[0013] The above-mentioned toughening modification does not change the foaming mechanism of the phenolic resin, therefore, it is still difficult to realize the low density of the product and the spray molding process

Method used

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  • Preparation and application of polyisocyanurate modified phenol formaldehyde foam plastic
  • Preparation and application of polyisocyanurate modified phenol formaldehyde foam plastic
  • Preparation and application of polyisocyanurate modified phenol formaldehyde foam plastic

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0073] One of the synthesis of embodiment 1-F-polyol copolymer polyol

[0074] Preheat 100 parts by weight of phenol to 40-60°C to melt, add 44 parts by weight of 37wt% formaldehyde aqueous solution and 2 parts by weight of 50wt% aqueous oxalic acid solution, and react for 3 hours at a temperature of 60-75°C. After the reaction is over, adjust the pH value to 7-7.5 with disodium hydrogen phosphate solution, then add 20 parts by weight of glycerin and 0.3 parts by weight of KOH, and vacuumize at 60-80 ° C for 4 hours to dehydrate. The vacuum pressure is -0.09MPa to -0.1 MPa. After the dehydration is completed, 145 parts by weight of propylene oxide is added to keep the reaction temperature at 90-120° C. and the reaction pressure at 0.3-0.6 MPa. When the pressure drops to 0MPa, it means that the phenolic condensation reaction is complete. Then add 110 parts by weight of ethylene oxide, keep the reaction temperature at 90-120° C., and the reaction pressure at 0.3-0.6 MPa. When...

Embodiment 2

[0075] Synthetic two of embodiment 2-F-polyol copolymer polyol

[0076] Preheat 100 parts by weight of phenol to 40-60°C to melt, add 182 parts by weight of 37% by weight formaldehyde solution and 4 parts by weight of CaO, and react for 4 hours at a temperature of 70-90°C. After the reaction, adjust the pH value to 7-7.5 with phosphoric acid, then add 60 parts by weight of glycerin and 1 part by weight of KOH, and vacuumize at 60-80° C. for 4 hours to dehydrate at a vacuum pressure of -0.09 MPa to -0.1 MPa. After the dehydration is completed, 226 parts by weight of propylene oxide are added to keep the reaction temperature at 90-120° C. and the reaction pressure at 0.3-0.6 MPa. When the pressure drops to 0MPa, it means that the phenolic condensation reaction is complete. Then add 150 parts by weight of ethylene oxide, keep the reaction temperature at 90-120° C., and the reaction pressure at 0.3-0.6 MPa. When the pressure drops to 0MPa, it means that the epoxy ring-opening po...

Embodiment 3

[0077] The preparation of embodiment 3-component A

[0078] According to the formula in Table 1, each component can be stirred evenly at room temperature.

[0079] Table 1. Composition of Part A

[0080]

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Abstract

The present invention discloses a polyisocyanurate modified phenol formaldehyde foam plastic capable of being used as an energy saving and thermal insulation material, and a double component system for preparing the polyisocyanurate modified phenol formaldehyde foam plastic, wherein the system comprises a polyol mixture component A and a polymethylene polyphenyl isocyanate component B, and the component A contains a phenol formaldehyde resin structure-containing copolymer polyol prepared through copolymerization of a phenol-formaldehyde condensation compound and ethylene oxide and / or propylene oxide.

Description

technical field [0001] The invention relates to a polyisocyanurate modified phenolic foam plastic, its preparation system, preparation method, and its application as an energy-saving heat preservation material. Background technique [0002] Phenolic foam is a kind of foam plastic obtained by foaming phenolic resin. Compared with polystyrene foam, polyvinyl chloride foam, polyurethane foam and other materials that dominated the market in the early stage, it has special excellent performance in terms of flame retardancy. It has light weight, high rigidity, good dimensional stability, chemical corrosion resistance, good heat resistance, flame retardant, self-extinguishing, low smoke, flame penetration resistance, no spillage in case of fire, and low price. It is an ideal insulation and heat insulation material for industries such as chemical industry and petrochemical industry, so it has been widely valued by people. At present, phenolic foam has become one of the fastest gro...

Claims

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Application Information

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IPC IPC(8): C08G18/76C08G18/48C08G18/50C08L75/08C08G101/00
CPCC08G18/092C08G18/4804C08G18/4879C08G18/5012C08G18/7664C08G2110/005C08G2110/0083C08G2115/02
Inventor 张春梅万小龙胡小江
Owner 新疆三宝盛世新型材料科技股份有限公司
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