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Preparation method of thick tungsten coating material and tungsten coating material

A coating material and coating technology, applied in coatings, chemical instruments and methods, metal material coating processes, etc., can solve the problems of slow deposition rate and high preparation cost, achieve fast deposition rate, high thermal conductivity, and reduce Effect of small thermal stress

Inactive Publication Date: 2014-01-01
SOUTHWESTERN INST OF PHYSICS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, its deposition rate is slow, and the deposition rate reported in many documents and patents is 0.2~0.3mm / h, and the preparation cost is relatively high.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] Use pure copper as the base material for grinding, polishing, cleaning, dehydration and drying; make pure copper reduce tungsten hexafluoride with hydrogen to deposit tungsten coating in a chemical vapor deposition furnace; keep the purity of tungsten hexafluoride and hydrogen to be greater than 99.9% and 99.99% respectively %; the flow ratio of tungsten hexafluoride and hydrogen is 1:2; the deposition temperature range is 500°C, the deposition rate is 0.4mm / h, and the thickness of the tungsten coating is 1mm.

Embodiment 2

[0019] Use pure copper as the base material for grinding, polishing, cleaning, dehydration and drying; make pure copper reduce tungsten hexafluoride with hydrogen to deposit tungsten coating in a chemical vapor deposition furnace; keep the purity of tungsten hexafluoride and hydrogen to be greater than 99.9% and 99.99% respectively %; the flow ratio of tungsten hexafluoride and hydrogen is 1:4; the deposition temperature range is 600°C, the deposition rate is 0.7mm / h, and the thickness of the tungsten coating is 3mm.

Embodiment 3

[0021] Use pure copper as the base material for grinding, polishing, cleaning, dehydration and drying; make pure copper reduce tungsten hexafluoride with hydrogen to deposit tungsten coating in a chemical vapor deposition furnace; keep the purity of tungsten hexafluoride and hydrogen to be greater than 99.9% and 99.99% respectively %; the flow ratio of tungsten hexafluoride and hydrogen is 1:5; the deposition temperature range is 700°C, the deposition rate is 1mm / h, and the thickness of the tungsten coating is 5mm.

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Abstract

The invention relates to a preparation method of a thick tungsten coating material. Chemical vapor deposition method is used, and a tungsten coating is deposited on a base material by using hydrogen for reduction of tungsten hexafluoride. The deposition rate is 0.4-1 mm / h, and the tungsten coating thickness is greater than or equal to 1 mm. The invention also relates to a tungsten coating material including pure copper or copper alloy, an adaptation layer and the tungsten coating; the adaptation layer is 1-5 layers of a tungsten copper gradient material, and the thickness of each layer is 0.5 - 1.5mm; the tungsten content of the tungsten copper gradient material closed to the tungsten coating side is 50-90wt.%; the tungsten contents of the middle layers of tungsten copper gradient material decrease successively, and the copper contents increase successively; and the copper content of the tungsten copper gradient material closed to the copper or copper alloy side is 50-90wt.%. In the tungsten coating material, a pure tungsten coating-adaptation layer-copper based material method is used, through adoption of the adaptation layer, the thermal expansion coefficient mismatch problem between tungsten and copper can be solved, and the thermal stress of the coating and the base can be reduced.

Description

technical field [0001] The invention relates to a preparation method of a thick tungsten coating material, in particular to a preparation method of a thick tungsten coating material used as the material of the first wall of a fusion device and a divertor component. The invention also relates to a tungsten coating material obtained by the method. Background technique [0002] Tungsten is widely considered to be the most promising nuclear fusion device due to its advantages such as high melting point, excellent thermal conductivity, low sputtering yield and high self-sputtering threshold, low vapor pressure and low tritium retention performance. body material. However, tungsten is very brittle and difficult to process, and the preparation of tungsten on the heat sink material by coating technology can overcome these shortcomings. Tungsten coating technology is a material preparation technology and a material connection technology. It is made into a plasma-facing component by...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C16/14B32B15/01
Inventor 练友运刘翔宋久鹏于洋
Owner SOUTHWESTERN INST OF PHYSICS
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