Silicon wafer cleaning method for preparing high-efficiency solar cell and cleaning equipment

Abstract

The invention provides a silicon wafer cleaning method for preparing a high-efficiency solar cell and cleaning equipment. The surface hydrophobicity of a textured silicon wafer is poorer due to the fact that the proportion by weight of sulfuric acid to hydrogen peroxide is lower in the existing silicon wafer cleaning technology. The silicon wafer cleaning method for preparing the high-efficiency solar cell comprises the following steps of firstly cleaning the silicon wafer by mixed solution of concentrated sulfuric acid and hydrogen peroxide solution by adopting the cleaning equipment, wherein the proportion by weight of the sulfuric acid to the hydrogen peroxide is (65-170):1, then, cleaning by deionized water, then, cleaning the silicon wafer by the hydrogen peroxide solution or salpeter solution so as to remove carbon residues and part of metallics and form a layer of oxidation film, cleaning by the deionized water, and finally, removing the oxidation film on the silicon wafer by the mixed solution of hydrochloric acid and hydrofluoric acid, and cleaning by the deionized water. According to the silicon wafer cleaning method for preparing the high-efficiency solar cell and the cleaning equipment provided by the invention, the hydrophobicity of the silicon wafer can be effectively improved, i.e. the cleaned silicon wafer is completely dehydrated after the oxidation film on the silicon wafer is removed.

Description

technical field [0001] The invention relates to the field of solar cell manufacturing, in particular to a silicon wafer cleaning method and cleaning equipment for preparing high-efficiency solar cells. Background technique [0002] For high-efficiency solar cells, the surface treatment of silicon wafers is very critical. The early cleaning can remove organic impurities and metal particles on the surface of silicon wafers, so as to effectively avoid the introduction of impurities or defects in the later high-temperature processes such as diffusion, oxidation, and activation. . [0003] In the integrated circuit (Integrated Circuit; IC for short) industry, although the traditional RCA cleaning method has an excellent cleaning effect, there are many problems in this method such as complicated procedures, small process window, and short service life of the solution. Furthermore, when the silicon wafer is cleaned by the RCA cleaning method in the solar energy industry, its SC-1 ...

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a silicon chip cleaning method and cleaning equipment for preparing high-efficiency solar cells, through which the surface hydrophobicity problem of the suede silicon chip can be solved when the SPM cleaning method cleans the silicon chip , thereby improving the cleanliness of the cleaning

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