Toughening modification method for bismaleimide resin
A kind of bismaleimide resin, maleimide resin technology, applied in the direction of adhesive and so on
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specific Embodiment approach 1
[0012] Specific embodiment one: the toughening modification method of bismaleimide resin of the present embodiment, carry out according to the following steps:
[0013] 1. Prepolymerization reaction: Stir diallyl bisphenol A, bismaleimide resin and vinyl-terminated nitrile rubber in an oil bath at a temperature of 120°C to 150°C until they are completely dissolved, and then at a temperature of 120°C ℃~150℃ under oil bath, continue to stir and react for 20min~40min to obtain prepolymer; the molar ratio of bismaleimide resin to diallyl bisphenol A is (0.9~1.9):1; The bismaleimide resin is 100phr, and the addition of the vinyl-terminated nitrile rubber is 5phr~15phr;
[0014] 2. Add silicon carbide whiskers treated with silane coupling agent to the prepolymer obtained in step 1. After stirring evenly, put it into a vacuum with a temperature of 120℃~130℃ and a vacuum degree of -0.09MPa~-0.1MPa. Perform defoaming treatment in a drying oven for 25-35 minutes, and then pour into a m...
specific Embodiment approach 2
[0020] Specific embodiment 2: The difference between this embodiment and specific embodiment 1 is that the bismaleimide resin described in step 1 is 4,4-diaminodiphenylmethane bismaleimide resin (BDM) and 4,4'-bis(3-maleimidophenoxy)benzophenone (EK-BMI) or a mixture of both. Others are the same as in the first embodiment.
[0021] When the bismaleimide resin described in this embodiment is a mixture, each component is mixed in any ratio.
specific Embodiment approach 3
[0022] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is: the molar ratio of bismaleimide resin and diallyl bisphenol A described in step one is (1.0~1.8): 1. Others are the same as in the first or second embodiment.
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