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Room-temperature cured epoxy polysiloxane resin

A technology of epoxy polysiloxane and epoxy resin, which is applied in epoxy resin coatings, organic chemistry, chemical instruments and methods, etc., can solve the phenomenon of orange peel in the coating film, poor surface effect and decreased anti-corrosion performance. And other issues

Inactive Publication Date: 2013-12-18
WUHAN HOSTS COATING MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the components of the hybrid coating cannot be cured in coordination, the orange peel phenomenon will appear on the surface of the coating film, resulting in poor board surface effect and greatly reduced anti-corrosion performance

Method used

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  • Room-temperature cured epoxy polysiloxane resin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] ① Preparation of silicone oligomers: Add 35.6g of methyltriethoxysilane, 47.4g of dimethyldiethoxysilane, 48g of a Phenyltriethoxysilane and 20.5 g butyl glycidyl ether. Stirring was started and the temperature was raised to 50°C, and 23.2 g of the mixed solution of hydrochloric acid and deionized water was added dropwise. After the reaction is finished, the ethanol and water generated by the reaction are distilled out by first atmospheric distillation and then vacuum distillation. Cool down to room temperature and filter to obtain a colorless, transparent, uniform and stable low-viscosity liquid.

[0042] ②Take 50g of the silicone oligomer in the above ①, add 2g of hydroxyethylidene diphosphonic acid to it, stir well until the mixture is uniform.

[0043] ③Add 48g of epoxy resin E51 to the mixture of ② above. Epoxy polysiloxane resin is obtained after thorough mixing.

Embodiment 2

[0045] ① Preparation of silicone oligomers: Add 35.6g of methyltriethoxysilane, 47.4g of dimethyldiethoxysilane, 48g of a Phenyltriethoxysilane and 20.5 g of 1,6-hexanediol diglycidyl ether. Stirring was started and the temperature was raised to 50°C, and 23.2 g of the mixed solution of hydrochloric acid and deionized water was added dropwise. After the reaction is finished, the ethanol and water generated by the reaction are distilled out by first atmospheric distillation and then vacuum distillation. Cool down to room temperature and filter to obtain a colorless, transparent, uniform and stable low-viscosity liquid.

[0046] ②Take 62.5g of the silicone oligomer in ① above, add 2g of 2-phosphonic acid butane-1,2,4-tricarboxylic acid into it, and stir well until the mixture is uniform.

[0047] ③Add 35.5g of epoxy resin E44 to the mixture of ② above. Epoxy polysiloxane resin is obtained after thorough mixing.

Embodiment 3

[0049] ① Preparation of silicone oligomers: Add 35.6g of methyltriethoxysilane, 47.4g of dimethyldiethoxysilane, 48g of a Phenyltriethoxysilane and 20.5 g of trimethylolpropane triglycidyl ether. Stirring was started and the temperature was raised to 50°C, and 23.2 g of the mixed solution of hydrochloric acid and deionized water was added dropwise. After the reaction is finished, the ethanol and water generated by the reaction are distilled out by first atmospheric distillation and then vacuum distillation. Cool down to room temperature and filter to obtain a colorless, transparent, uniform and stable low-viscosity liquid.

[0050] ② Take 75g of the silicone oligomer in the above ①, add 2g of aminodimethylphosphonic acid to it, and stir well until the mixture is uniform.

[0051] ③Add 23g of epoxy resin E20 to the mixture of ② above. Epoxy polysiloxane resin is obtained after thorough mixing.

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Abstract

The invention relates to a room-temperature cured epoxy polysiloxane resin. The resin is a composition which comprises a first component, namely an epoxy resin, a second component, namely aliphatic glycidyl ether, a third component, namely low molecular weight polysiloxane with an ethoxy functional group, and a fourth component, namely organic phosphonic acid. The aliphatic glycidyl ether is taken as a solvent when the polysiloxane with the ethoxy functional group is prepared, so as to control the molecular weight of the polysiloxane; the resin composition is subjected to moisture absorption and cured at room temperature by the organic phosphonic acid, and can be prepared into a solvent-free paint with a single component; a cured coating has the advantages of an epoxy resin coating and a polysiloxane coating, especially has good adhesive force on steel products, and has excellent corrosion resistance and weather resistance. The resin composition can be applied to a matrix resin as a base coat and a finishing coat.

Description

technical field [0001] The invention relates to an epoxy polysiloxane resin curable at room temperature. The resin is a combination of epoxy resin and low-molecular-weight polysiloxane containing specific active functional groups, and the resin can be used to prepare a one-component, solvent-free, room-temperature-curable epoxy polysiloxane coating. After the coating is cured, its coating film has both the advantages of epoxy resin coating film and polysiloxane coating film, especially has excellent adhesion to steel, and has excellent corrosion resistance and weather resistance. Background technique [0002] Silicone resin is widely used in various fields because of its excellent weather resistance, heat resistance and chemical resistance after film formation. Alkoxy oligomers of silicone resins are terminated with siloxane groups Si-OR and can be moisture cured at room temperature. Because of this, it is often used to prepare solvent-free coatings. Although siloxane oli...

Claims

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Application Information

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IPC IPC(8): C09D183/04C09D163/00C09D7/12C09D5/08C08G77/06C07F7/18
Inventor 黄治军
Owner WUHAN HOSTS COATING MATERIAL CO LTD
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