Vacuum drying device and photolithographic process

Abstract

The invention relates to the technical field of substrate manufacture, in particular to a vacuum drying device and a photolithographic process which are used for improving the photolithographic accuracy. The disclosed vacuum drying device comprises a vacuum chamber provided with exhaust vents and a chamber door, a vacuum pumping device communicated with the exhaust vents, as well as a heating assembly arranged in the vacuum chamber. When the vacuum drying device is adopted for performing vacuum drying on a substrate coated with photoresist, heating and vacuum drying simultaneously act on the photoresist, so that less hardening film is produced, the residual quantity of a solvent in the photoresist is reduced, and the photolithographic accuracy is improved. The invention further discloses a photolithographic process which comprises steps as follows: the substrate is coated with the photoresist; and the vacuum drying device with the characteristics is adopted for performing vacuum drying and heating on the photoresist coating the substrate at the vacuum degree ranging from 26 Pa to 500 Pa at the heating temperature ranging from 30 DEG C-90 DEG C.

Description

technical field [0001] The invention relates to the technical field of substrate manufacturing, in particular to a vacuum drying device and a photolithography process. Background technique [0002] At present, the pattern on the substrate is generally formed by a photolithography process. The specific process is as follows: firstly, the photoresist is coated on the substrate, and then the photoresist on the substrate is vacuum-dried. Finally, after pre-baking, exposure, and development, Form the desired pattern on the substrate. [0003] Vacuum drying is an intermediate link in the photolithography process, which is used to remove the solvent in the photoresist. Therefore, the drying effect on the photoresist will directly affect the properties of the photoresist and the effects of subsequent exposure and development. At present, vacuum drying is generally completed in a vacuum drying device. The inventors of the present application have found that when using an existing va...

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Problems solved by technology

At present, vacuum drying is generally completed in a vacuum drying device. The inventors of the present application have found that when using an existing vacuum drying device to dry the photoresist, because the vacuum drying is performed from the surface of the photoresist, it is easy to A hardened film is formed on the surface of the photoresist, making it difficult for the solvent in the photoresist in the hardened film to volatilize, which affects the slope angle of the photoresist (Profile)

like figure 1 As shown, it is the slope angle topography diagram of the resist when vacuum drying at room temperature; the photoresist 2 is located on the substrate 1, and since there are more solvent residues in the photoresist 2 after drying, the slope angle a of the photoresist is 20°~ 30°, it can be seen that the slope angle of the photoresist is small, which affects the photolithography accuracy

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