Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

LED ceramic baseplate and preparation method thereof

A technology of ceramic substrate and organic solvent, applied in the field of high thermal conductivity, high reflection ceramic substrate and its preparation, can solve the problem of not considering optical requirements and the like, and achieve the effects of simple preparation method, prolonged service life and low roughness

Active Publication Date: 2013-10-09
SINOCERAM TECH (ZHENGZHOU) CO LTD
View PDF2 Cites 15 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, the current LED packaging substrates all use the traditional alumina ceramic substrates used for high-power thick film and hybrid integrated circuits, without considering the optical requirements

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • LED ceramic baseplate and preparation method thereof
  • LED ceramic baseplate and preparation method thereof
  • LED ceramic baseplate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0046] A preparation method based on the aforementioned LED ceramic substrate described in the embodiment of the present invention includes the following steps:

[0047] Step S101. Accurately weigh and take out each component according to the weight percentage;

[0048] Step S102. Mix the weighed components uniformly and perform ball milling;

[0049] Step S103. Vacuum defoaming and stirring the ball-milled mixture in a constant temperature environment;

[0050] Step S104. The mixture after vacuum defoaming and stirring is sequentially subjected to coating molding, hot air drying, and punching to obtain a green sheet, and vacuum packaging, pressing and cooling the green sheet;

[0051] Step S105. The vacuum-encapsulated pressed and cooled green sheet is subjected to staling, low-temperature debinding, sintering and cooling.

[0052] Wherein, the said components that are weighed out are mixed uniformly and ball milled, which may specifically be: firstly, alumina, oxidation ad...

Embodiment 1

[0063] A LED ceramic substrate described in the embodiment of the present invention is made of the following components and their weight percentages: 60% aluminum oxide, 0.5% rare earth oxide, 30% organic solvent, 1.2% surfactant, and 3% adhesive , 2.5% plasticizer and 2.8% oxide additive; during preparation, according to the components and weight percentages and through the preparation method of the present invention, high heat dissipation, high surface finish, low roughness, and enhanced The reflectivity of light improves the light efficiency, reduces light decay, and prolongs the service life of LED lamps. Ceramic substrates for LED packaging.

Embodiment 2

[0065] An LED ceramic substrate described in the embodiment of the present invention is made of the following components and their weight percentages: 65% aluminum oxide, 0.4% rare earth oxide, 20% organic solvent, 0.8% surfactant, and 4.5% adhesive , 5.3% plasticizer and 4% oxide additive; during preparation, according to the composition and weight percentage and through the preparation method of the present invention, high heat dissipation, high surface finish, low roughness, and enhanced The reflectivity of light improves the light efficiency, reduces light decay, and prolongs the service life of LED lamps. Ceramic substrates for LED packaging.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
densityaaaaaaaaaa
densityaaaaaaaaaa
Login to View More

Abstract

The invention provides an LED ceramic baseplate and a preparation method thereof. The baseplate comprises the following components by weight percent: 60-70 percent of aluminium oxide, 0.2-0.5 percent of rare earth oxide, 10-30 percent of organic solvent, 0.2-1.2 percent of surface-active agent, 3.5-5.5 percent of adhesive, 2.5-7.2 percent of fluidizer and 2-5 percent of oxide additive. The preparation method comprises the following steps of: first, respectively and accurately weighing the components at respective weight percent, uniformly mixing and ball milling; next, performing vacuum defoamation and agitating; then, sequentially performing coating forming, hot-air drying, punching processing, vacuum encapsulation, pressing and cooling; finally, performing aging, low-temperature burnout, sintering and cooling. Due to the adoption of the method, the prepared ceramic baseplate is high in heat dissipation performance and surface finish, low in roughness, enhances light reflectivity, improves lighting effect, reduces light decay, and prolongs service life of an LED lamp.

Description

【Technical field】 [0001] The invention relates to the technical field of ceramic substrates, in particular to a ceramic substrate with high thermal conductivity and high reflection for LED single chip packaging or chip integrated packaging (COB) and a preparation method thereof. 【Background technique】 [0002] Existing LED products have high light attenuation, which causes their service life to be greatly reduced. The light decay of LED is related to its junction temperature. The so-called junction temperature is the temperature of the semiconductor PN junction. The higher the junction temperature, the earlier the light decay will appear, that is, the shorter the life. [0003] There are many reasons for the light decay of LED products. Only about 15% of the input power of existing high-power LEDs is converted into light, and the rest is converted into heat. If the heat cannot be effectively dissipated, the LED junction temperature will rise. The thermal resistance of the L...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/10C04B35/622
Inventor 段明新
Owner SINOCERAM TECH (ZHENGZHOU) CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com