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A kind of electroplating pc/abs alloy material with low linear expansion coefficient and preparation method thereof

A low linear expansion, alloy material technology, applied in the fields of polymer blending and polymer molding processing, can solve the problems of inability to pass the thermal shock test, large difference in linear expansion coefficient, large shrinkage deformation, etc., to achieve easy implementation, surface Smooth, reduce cracking effect

Active Publication Date: 2015-10-28
SHANGHAI KUMHO SUNNY PLASTICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The usual electroplated PC / ABS alloy materials cannot pass the thermal shock test
During thermal shock, both the PC / ABS plastic parts and the electroplating layer are subject to thermal expansion and contraction, but due to the large difference in linear expansion coefficient between the PC / ABS alloy material and the electroplated metal layer, the shrinkage deformation of the PC / ABS alloy material is greater , eventually leading to cracking of the coating

Method used

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  • A kind of electroplating pc/abs alloy material with low linear expansion coefficient and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Example 1 Preparation of electroplated PC / ABS alloy material of the present invention (1)

[0043] a) In parts by weight, add 80 parts of PC resin, 15 parts of ABS resin, 1 part of talcum powder I, 0.1 part of antioxidant and 0.1 part of lubricant into a mixing mixer;

[0044] b) The mixture obtained in step a) is blended and granulated through a twin-screw extruder, wherein the barrel temperature of the twin-screw extruder is 200-260°C, and the screw speed is 200-600rpm to obtain electroplated PC with low linear expansion coefficient / ABS alloy particles.

Embodiment 2

[0045] Example 2 Preparation of electroplated PC / ABS alloy material of the present invention (2)

[0046] a) By weight, add 30 parts of PC resin, 65 parts of ABS resin, 5 parts of talcum powder I, 0.4 part of antioxidant and 0.3 part of lubricant into a mixing mixer;

[0047] b) The mixture obtained in step a) is blended and granulated through a twin-screw extruder, wherein the barrel temperature of the twin-screw extruder is 200-260°C, and the screw speed is 200-600rpm to obtain electroplated PC with low linear expansion coefficient / ABS alloy particles.

Embodiment 3

[0048] Example 3 Preparation of electroplated PC / ABS alloy material of the present invention (3)

[0049] a) By weight, add 50 parts of PC resin, 45 parts of ABS resin, 5 parts of talcum powder I, 0.4 part of antioxidant and 0.3 part of lubricant into a mixing mixer;

[0050] b) The mixture obtained in step a) is blended and granulated through a twin-screw extruder, wherein the barrel temperature of the twin-screw extruder is 200-260°C, and the screw speed is 200-600rpm to obtain electroplated PC with low linear expansion coefficient / ABS alloy particles.

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Abstract

The invention relates to a low CLTE electroplating PC / ABS (Polycarbonate / Acrylonitrile Butadiene Styrene) alloy material and a preparation method thereof. The low CLTE electroplating PC / ABS alloy material is prepared from the following raw materials in parts by weight: 30-80 parts of PC resin, 15-65 parts of ABS resin, 1-5 parts of talcum powder, 0.1-1 part of antioxygen and 0.1-1 part of lubricating agent. The preparation method comprises the following steps: adding all raw materials in a mixing agitator for mixing; then passing the obtained mixture through a double-screw extruder for blend granulation. According to the invention, the talcum powder is added into the materials, so that the CLTE of the PC / ABS alloy material is lowered; when the PC / ABS alloy material is machined after electroplating, the difference between the CLTE of the PC / ABS alloy material and the CLTE of an electroplating metal layer is reduced; therefore, the crack of the electroplating metal layer caused by deformation of the material due to cold and thermal impact is reduced, the high electroplating binding power is ensured, the surface of a product is smooth, the electroplating surface effect is good, and the preparation method is simple and practicable.

Description

technical field [0001] The invention belongs to the fields of polymer blending and polymer molding processing, and in particular relates to an electroplated PC / ABS alloy material with a low linear expansion coefficient and a preparation method thereof. Background technique [0002] Due to its excellent heat resistance, toughness, fatigue resistance and electroplating properties, PC / ABS alloy materials are widely used in interior and exterior parts of automobiles, such as interior and exterior door handles, automobile nameplates, wheel housings, grilles, decorative strips, etc. . [0003] With the wide application of electroplated PC / ABS alloy materials, the requirements of the automobile manufacturing industry are becoming more and more stringent. In the GWM14668-2010 launched by General Motors in 2010, the thermal shock test was added to the electroplated PC / ABS alloy material. The standard requires that the electroplated parts have no cracking and no foaming after the the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L69/00C08L55/02C08K3/34
Inventor 柏莲桂李强罗明华辛敏琦
Owner SHANGHAI KUMHO SUNNY PLASTICS
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