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Resin composition for optical semiconductor element housing package, and optical semiconductor light-emitting device obtained using the same

A technology of optical semiconductor and resin composition, which is applied in the direction of semiconductor devices, electrical components, electric solid devices, etc., to achieve the effects of excellent solder heat resistance, reduced linear expansion coefficient, and good light reflectivity

Inactive Publication Date: 2012-08-29
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in consideration of the suitability for mass production and the cost of such packaging, etc., and further in consideration of the shape reproducibility of the reflector (reflecting portion), forming the portion corresponding to the insulating resin layer 3 from a ceramic material is problematic

Method used

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  • Resin composition for optical semiconductor element housing package, and optical semiconductor light-emitting device obtained using the same
  • Resin composition for optical semiconductor element housing package, and optical semiconductor light-emitting device obtained using the same
  • Resin composition for optical semiconductor element housing package, and optical semiconductor light-emitting device obtained using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1 to 6

[0062] Examples 1 to 6, Reference Examples 1 and 2, Comparative Examples 1 and 2

[0063] The ingredients shown in Table 1 below were mixed in the ratios shown therein, then melt mixed in a beaker, aged, then cooled to room temperature and ground to prepare the desired finely powdered epoxy resin composition.

[0064] The thus-produced epoxy resin compositions of Examples and Comparative Examples were analyzed to measure their reflectance (initial stage, after standing at high temperature for a long period of time). The results are shown in Table 1 below.

[0065] Reflectivity

[0066] Under predetermined curing conditions (conditions: forming at 150° C. for 4 minutes + curing at 150° C. for 3 hours), the epoxy resin composition was formed into a test piece with a thickness of 1 mm; and at the initial stage and at 150° C. The total reflectance of the test piece (cured material) was measured after standing still for 168 hours. As a tester, a spectrophotometer V-670 manufact...

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Abstract

The present invention relates to a resin composition for forming an insulating resin layer for optical semiconductor element housing package having a concave portion in which a metal lead frame and an optical semiconductor element mounted thereon are housed, in which the resin composition includes the following ingredients (A) to (D), and the ingredients (C) and (D) are contained in a blend ratio (C) / (D) of 0.26 to 3.0 as a weight ratio thereof: (A) an epoxy resin; (B) an acid anhydride curing agent; (C) a white pigment; and (D) an inorganic filler.

Description

technical field [0001] The present invention relates to a resin composition for packaging an optical semiconductor element case, which is an insulating resin layer forming material to be formed around a light emitting element and whose reflection is emitted by the light emitting element, and to an optical semiconductor light emitting device obtained by using the same light to provide directivity. Background technique [0002] so far, such as figure 1 As shown in , an optical semiconductor light-emitting device in which a light-emitting element is mounted is designed such that an optical semiconductor element 2 is mounted on a metal lead frame 1, and an insulating resin layer 3 is formed to surround the optical semiconductor element 2 except its upper side. part. exist figure 1 Among them, 4 is a bonding wire for electrically connecting an electrode circuit (not shown) formed on the metal lead frame 1 to the optical semiconductor element 2 . [0003] In this optical semic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08G59/42C08K13/02C08K3/22H01L33/56
CPCC08G59/3245C08G59/4215C08K3/22C08L63/00C08K3/013H01L33/486H01L2224/48091H01L2224/48247H01L2924/3025H01L2933/0033H01L2924/00014H01L2924/00H01L33/00
Inventor 福家一浩谷口刚史太田贵光伊藤久贵
Owner NITTO DENKO CORP
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