A kind of high-performance organosilicon epoxy material and its preparation method and application

An organosilicon epoxy and cyclosiloxane technology, applied in epoxy resin coatings, epoxy resin adhesives, organic insulators, etc., can solve the problems of failing to take into account material transmittance, high interfacial tension, poor compatibility, etc.

Inactive Publication Date: 2015-11-18
GUANGZHOU CHEM CO LTD CHINESE ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the silicone-modified epoxy resin or epoxy-reinforced silicone material used above is prepared by adding silicone or single-phase epoxy curing. The two-phase interfacial tension of silicone and epoxy in the material is too large and compatible. Poor performance, failing to take into account other properties such as light transmittance of the material

Method used

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  • A kind of high-performance organosilicon epoxy material and its preparation method and application
  • A kind of high-performance organosilicon epoxy material and its preparation method and application
  • A kind of high-performance organosilicon epoxy material and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] The preparation method of silicone epoxy material is as follows:

[0053] (1) Preparation of end-capped epoxy cyclosiloxane: add 0.5mol (90.1g) 1,3,5-trimethylcyclosiloxane to a round-bottomed flask equipped with a stirrer, reflux condenser, thermometer, and nitrogen port Trisiloxane C 3 h 12 o 3 Si 3 (provided by Beijing Huawei Ruike Chemical Co., Ltd.), 1.0mol (114.1g) allyl glycidyl ether (CH 2 =CHCH 2 OCH 2 CHCH 2O, supplied by Energy Chemical) and 100ml cyclohexane, feed high-purity nitrogen into the reactor at room temperature and stir evenly, then gradually heat up to 70°C, and slowly add 0.4ml dropwise after the temperature is constant, the concentration is 1g The chloroplatinic acid tetrahydrofuran solution of / 160ml is used as catalyzer, after dropwise addition, react 8h, add 59.3g capping agent n-butanol and 0.15ml above-mentioned chloroplatinic acid tetrahydrofuran solution in reactor, continue reaction 6h again, after reaction finishes, The solvent ...

Embodiment 2

[0058] The preparation method of silicone epoxy material is as follows:

[0059] (1) Preparation of end-capped epoxy cyclosiloxane: add 0.5mol (120.2g) 1,3,5,7-tetramethyl to a round bottom flask equipped with a stirrer, reflux condenser, thermometer, and nitrogen port Cyclotetrasiloxane C 4 h 16 o 4 Si 4 (Quzhou Ruilijie Chemical Co., Ltd. provides), 0.5mol (62.1g) 1,2-epoxy-4-vinyl epoxycyclohexane ( CH 2 = CHC 6 h 9 O, provided by SigmaAldrich) and 150ml of xylene, feed high-purity nitrogen into the reactor at room temperature and stir evenly, then gradually heat up to 60°C, after the temperature is constant, slowly add 3.22ml of chloroplatinic acid with a concentration of 1g / 160ml The isopropanol solution is used as a catalyst. After the dropwise addition, after 2 hours of reaction, add 176.7g end-capping agent 1-heptene and 2.52ml of the above-mentioned chloroplatinic acid isopropanol solution in the reactor, and then continue to react for 6h. After the reaction, ...

Embodiment 3

[0065] The preparation method of silicone epoxy material is as follows:

[0066] (1) Preparation of end-capped epoxy cyclosiloxane: add 0.5mol (180.4g) 1,3,5,7,9 in a round bottom flask equipped with a stirrer, reflux condenser, thermometer, nitrogen port, 11-Hexamethylcyclohexasiloxane C 6 h 24 o 6 Si 6 (provided by KingstonChemistry), 3.5mol (434.63g) 1,2-epoxy-4-vinylcyclohexane (CH 2 =CHC 6 h 9 O, Provided by SigmaAldrich) and 100ml of toluene, feed high-purity nitrogen into the reactor at room temperature and stir evenly, then gradually heat up to 100°C, after the temperature is constant, add 0.10ml of dicyclopentadiene platinum dichloride with a concentration of 1g / 160ml dropwise Ethanol solution was used as a catalyst. After 24 hours of reaction, 20.0 g of capping agent ethanol and 0.01 ml of the above-mentioned dicyclopentadiene platinum dichloride ethanol solution were added to the reactor, and the solvent toluene and excess unreacted 1 were removed by rotary ...

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Abstract

The invention belongs to the field of light emitting semiconductor packaging, and discloses a high performance organosilicon epoxy material, a preparation method and applications thereof. According to the present invention, a vinyl epoxy monomer and methylhydrosiloxane are subjected to a catalysis reaction for 2-24 h, an end capping agent and a catalyst are added to continuously carry out the reaction to obtain end capped epoxy cyclosiloxane, 0.1-5.0 parts of a cyclosiloxane ring opening agent, 0.01-80 parts of an epoxy curing agent and 0.01-5.0 parts of a curing catalyst are added to 100 parts of the end capped epoxy cyclosiloxane in batches, stirring is performed for 0.5-12.0 h under a nitrogen condition during the addition, an auxiliary agent is added, stirring is continuously performed for 0.5-3.0 h, and curing is performed to obtain the organosilicon epoxy material; and the material has characteristics of the epoxy resin and the organosilicon material, further has characteristics of excellent light transmittance, excellent adhesion, excellent mechanical strength, excellent heat resistance and excellent UV performance, and can be adopted as a LED packaging material, an optical lens material, a photoelectric conversion material, an integrated circuit packaging material, an insulation material, a coating material and an adhesive.

Description

technical field [0001] The invention belongs to the field of packaging of light-emitting semiconductors, and relates to a packaging material for sealing a light-emitting diode (LED) and an optical lens, in particular to a high-performance organosilicon epoxy material and a preparation method and application thereof. technical background [0002] Since the 21st century, energy problems have become more and more serious. Under the background of rising concerns about global energy shortages, energy conservation will be an important issue in the future. At present, lighting accounts for about 20% of the world's total energy consumption. If the traditional light sources with low energy consumption, long life, safety and environmental protection are used to replace traditional light sources with low efficiency and high power consumption, it will be strategic to the sustainable development of the world. meaning. Light-emitting diodes (LEDs), as a new generation of green solid-stat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/20C08G77/14C07F7/21H01L33/56H01L23/29H01B3/40H01B3/46C09D163/00C09D183/06C09J163/00C09J183/06
Inventor 刘伟区高南
Owner GUANGZHOU CHEM CO LTD CHINESE ACADEMY OF SCI
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