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Welding method adaptable to high-temperature sputtering target material

A welding method, high-temperature sputtering technology, which is applied in the field of new material welding, and can solve problems such as not being able to withstand high temperatures

Inactive Publication Date: 2013-08-28
LIDA OPTICAL & ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In order to solve the above-mentioned defects in the prior art, the purpose of the present invention is to provide a welding method suitable for high-temperature sputtering targets, which can solve the defect that the target cannot withstand high temperatures during the sputtering process, and is easy to operate

Method used

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Embodiment Construction

[0012] A welding method suitable for high-temperature sputtering targets, characterized in that it comprises the following steps:

[0013] (1) Clean the welding surface of the target and the back plate;

[0014] (2) Add silver powder with a weight percentage of 60%-70% or activated carbon particles with a weight percentage of 70%-80% to the epoxy resin glue, and evenly coat the welding surface of the target and the back plate and both sides of the copper mesh;

[0015] (3) Place the copper mesh and the target on the backplane in turn and position them;

[0016] (4) Place a certain weight of briquettes on the target;

[0017] (5) Curing under normal temperature and pressure environment;

[0018] (6) After cooling, remove excess glue on the edge of the target.

[0019] The silicon target welded by this method was provided to a touch screen manufacturer, and the sputtering efficiency of the customer increased by 15-20%, which improved the production efficiency. However, the ta...

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Abstract

The invention discloses a welding method adaptable to high-temperature sputtering target material. The welding method includes (1) cleaning weld faces of the target material and a back plate; (2) adding silver powder with mass percentage of 60% to 70% or activated carbon particles with mass percentage of 70%-80% to epoxy resin adhesive, and evenly coating on the weld faces of the target material and a back plate and two faces of a copper net; (3) placing and positioning the copper net and the target material on the back plate in sequence; (4) placing pressing blocks with certain weight on the target material; (5) solidifying in normal-temperature and normal-pressure environment; and (6) cleaning excess adhesive on the edge of the target material after cooling. When film is produced, the target material produced by the welding method can bear the temperature ranging from 200 DEG C to 250 DEG C, target material sputtering power can increase to almost three in one, sputtering power is increased obviously; and during the process of target material rapidly sputtering, target missing is omitted, high-speed continuous sputtering can be realized, and production efficiency is improved significantly.

Description

technical field [0001] The invention belongs to the technical field of new material welding, and in particular relates to a new method for target material welding. Background technique [0002] Compared with the common welding methods of target materials, there are soft welding and hard welding methods, and soft welding uses indium or indium tin alloy. When this type of target is welded, usually the back plate and target are metallized and the solder is heated to 20-30°C higher than the melting point of the solder, the solder is poured between the back plate and the target, and the target and the back plate are cooled combine together. Due to the low melting point of this type of solder, the target cannot withstand high temperature during the sputtering process and cannot be sputtered quickly, otherwise indium may leak out during the sputtering process, the sputtering time should not be too long, and the target may even fall off. Hard welding is after mechanical finishing,...

Claims

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Application Information

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IPC IPC(8): B23K31/02
Inventor 张向东杨太礼李智超付勇
Owner LIDA OPTICAL & ELECTRONICS
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