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Copper alloy wire and copper alloy spring

A copper alloy wire, copper alloy technology, applied in the direction of springs, low internal friction springs, springs/shock absorbers, etc., to achieve the effect of realizing use, improving thermal fatigue, and achieving long life

Active Publication Date: 2013-08-21
NIPPON SEISEN CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, this beryllium-copper alloy contains harmful beryllium in its composition, and there is an environmental problem when it is recycled, so its use has been limited in recent years. 16.0%, Ni: 1.0~5.0%, Si: 0.2~1.2%, so due to the eutectic phase of Cu and Ag and Ni 2 Copper-silver alloy wire with high strength and electrical conductivity due to the composite effect of Si particles (see Patent Document 1)

Method used

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  • Copper alloy wire and copper alloy spring
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  • Copper alloy wire and copper alloy spring

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0105]

[0106] A total of eight types of copper alloy samples (test samples A to H) having the composition shown in Table 1 were melted using a continuous casting machine having a graphite mold provided with a water cooling jacket around them, and the wire diameters were obtained by hot rolling. 9.5mm rod wire. On the other hand, as comparative samples, a copper-silver alloy material (comparative sample a) corresponding to the above-mentioned Patent Document 1, a conventional beryllium-added copper alloy material (comparative sample b), and other two copper alloy materials (comparative sample b) were used. The rods and wires of the comparison samples c and d) with a wire diameter of 6-8 mm were used as the comparison samples.

[0107] Table 1

[0108]

[0109] □(A) value=(Ni+20Al) / (8Si)

[0110] In this way, test samples A to D set Ni to be relatively high, and test samples E to H include test samples in which the third element is added in an amount of about 5 to 8% of...

Embodiment 2

[0144] As another form of the copper alloy wire shown in Table 1, for the suspension spring for an optical pick-up tube, the rod wires B, F and the comparative sample c were repeated in the same manner as in the above-mentioned Example 1, respectively, from the raw material batch wires. At the same time of cold drawing and heat treatment, 99% wire drawing is finally used to obtain a hard copper alloy fine wire with a finished wire diameter of 0.080mm.

[0145] Even in such small-diameter processing, there were no problems such as disconnection and cracking, and good manufacturability was achieved. As shown in Table 5, the strength characteristics, electrical conductivity, and X-ray intensity ratio were superior to those of Example 1 above. In addition, in this X-ray test, since the thin wires have a small diameter, the test was performed by a method of securing a predetermined measurement area by arranging a plurality of them in parallel.

[0146] table 5

[0147] ...

Embodiment 3

[0152] Using the hard wires of the two copper alloy wires (wire diameter 0.7mm) obtained in the above-mentioned Example 1, the test samples A and G were put into the cold rolling mill as they were and carried out multi-stage roll rolling to obtain Microstrip line with flat cross section (0.3×0.9mm). The tensile strength was further increased by about 8 to 10% by this rolling process, and it was confirmed that none of the test samples had defects such as wire breakage and material cracking, and had good processability.

[0153] Then, after removing and washing the lubricant and impurities on the surface of the obtained processed strip, aging heat treatment was performed using a tubular heating furnace set at a temperature of 440°C. This heat treatment is carried out in a stranding system in which the strip wire is always fed at a constant speed while performing heat treatment. For the heating atmosphere, the heat treatment is carried out in a non-oxidizing state based on argon ...

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Abstract

A high-strength and high-conductivity copper alloy wire and a copper alloy spring made from the copper alloy wire are provided. The copper alloy wire is a copper alloy filamentary material containing, in percent by mass, 3.0 to 15.0% Ni, 0.5 to 5.0% Al, and 0.1 to 3.0% Si, with the remainder being composed of Cu and incidental impurities, and is provided with a tensile strength ([sigma]B) of 900 to 1300 Mpa, and electrical conductivity of 10 to 22% IACS. In addition to the abovementioned characteristics, the copper alloy wire satisfies a strength ratio of A : B : C of 1 : 1.2 to 6.0 : 2 to 8.0 when A, B and C represent the diffraction intensities of Cu (111), Cu (200) and Cu (220) according to X-ray diffraction in a prescribed cross section. By using the copper alloy wire as a copper alloy spring that can be used for a conductive spring that can cope with heat sagging, the copper alloy spring can be incorporated in mobile phones and various electronic devices etc., and used as an operation or contact spring etc. The copper spring wire does not contain harmful elements such as Be, has excellent conductivity and spring characteristics, and is particularly excellent in resisting heat sagging due to heat generated when conducting electricity.

Description

technical field [0001] The present invention relates to a copper alloy wire that is mounted on a mobile phone or various small electronic devices and is used as an operating or contact spring, etc., and responds to electrical conductivity and spring characteristics, especially thermal fatigue caused by heat generated during energization, and Copper alloy spring. Background technique [0002] Since copper or copper alloy materials have low electrical resistance and excellent electrical conductivity, it is expected to expand to electrical and electronic materials and parts such as connectors and contact springs of mobile phones and various electronic devices that continue to undergo rapid technological innovation. A beryllium copper alloy wire (for example, JIS-H3270) is used. [0003] However, this beryllium-copper alloy contains harmful beryllium in its composition, and there is an environmental problem when it is recycled, so its use has been limited in recent years. 16.0...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/06C22C9/01C22F1/08F16F1/02H01B1/02H01B5/04C22F1/00
CPCC22C9/01C22C9/06C22F1/08H01B1/026F16F1/02H01B1/02F16F1/021
Inventor 石田清仁秋月孝之
Owner NIPPON SEISEN CO LTD
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